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The Visual Computer

International Journal of Computer Graphics

Publishing model:

Editorial board

Editor-in-Chief

Nadia Magnenat-Thalmann
MIRALab-CUI
University of Geneva
Battelle, Building A
7, Route de Drize 
CH-1227 Carouge, Geneva, Switzerland
thalmann@miralab.ch
http://www.miralab.ch/


Associate Editor-in-Chief

Nannan Wang
Xidian University, China, nnwang@xidian.edu.cn
 
 
Managing Editor
 
Bin Sheng
Shanghai Jiao Tong University, China, shengbin@sjtu.edu.cn
 

Editorial Board

Antonio Agudo
CSIC-Universitat Politècnica de Catalunya BarcelonaTech, Spain, antonio.agudo@upc.edu

Yiannis Aloimonos
University of Maryland, United States of America, yiannis@cs.umd.edu

Nantheera (Pui) Anantrasirichai
University of Bristol, United Kingdom, N.Anantrasirichai@bristol.ac.uk

Andreas Aristidou
University of Cyprus, Cyprus, a.aristidou@ieee.org

Seung-Hwan Baek
POSTECH, Korea (South), shwbaek@postech.ac.kr

Selim Balcisoy
Sabanci University, Istanbul, Turkey, balcisoy@sabanciuniv.edu

Francisco Barranco
University of Granada, Spain, fbarranco@ugr.es

Lei Bi
Shanghai Jiao Tong University, China, lei.bi@sjtu.edu.cn

Niccolò Bisagno
University of Trento, Italy, niccolo.bisagno@unitn.it

Nicolas Bonneel
CNRS-University of Lyon, France, nicolas.bonneel@liris.cnrs.fr

Tolga Çapın
TED University, Turkey, tolga.capin@tedu.edu.tr

Lap-Pui Chau
Nanyang Technological University, Singapore, elpchau@ntu.edu.sg

Jie Chen
Hong Kong Baptist University,  Hong Kong, chenjie@comp.hkbu.edu.hk

Mingang Chen
Shanghai Development Center of Computer Software Technology, China, cmg@sscenter.sh.cn

Renjie Chen
Max-Planck Institute for Informatics, Germany, renjie.chen@mpi-inf.mpg.de

Zhonggui Chen
Xiamen University, China, chenzhonggui@xmu.edu.cn

De Cheng
Xidian University, China, dcheng@xidian.edu.cn

Sunghyun Cho
POSTECH, Korea (South), s.cho@postech.ac.kr

Frederic Cordier
University of Haute Alsace and University of Strasbourg, France, Frederic.Cordier@uha.fr

Rémi Cozot
University of Littoral Côte d'Opale, France, remi.cozot@univ-littoral.fr

Zhaopeng Cui
ETH Zurich, Switzerland, zhpcui@gmail.com

Lei Dai
East China University of Science and Technology, China, dailei@ecust.edu.cn

Naser Damer
Fraunhofer IGD, Germany, Naser.Damer@igd.fraunhofer.de

Jan De Beenhouwer
University of Antwerp, Belgium, jan.debeenhouwer@uantwerpen.be

Wanxia Deng
National University of Defense Technology (NUDT), China, dengwanxia14@nudt.edu.cn

Jean-Michel Dischler
University of Strasbourg, France, dischler@unistra.fr

Matteo Dunnhofer
University of Udine, Italy, matteo.dunnhofer@uniud.it

Helin Dutagaci
Eskisehir Osmangazi University, Turkey, helindutagaci@gmail.com

Parris K. Egbert
Brigham Young University, United States of America, egbert@cs.byu.edu

Bin Fan
University of Science and Technology Beijing, China, bin.fan@ieee.org

Cornelia Fermuller
University of Maryland, United States of America, fer@umiacs.umd.edu

Tomaso Fontanini
University of Parma, Italy, tomaso.fontanini@unipr.it

Issei Fujishiro
Keio University, Japan, ifujishiro@keio.jp

Antonino Furnari
University of Catania, Italy, furnari@dmi.unict.it

Chenqiang Gao
Chongqing University of Posts and Telecommunications, China, gaocq@cqupt.edu.cn

Marina Gavrilova
University of Calgary, Canada, mgavrilo@ucalgary.ca

Enrico Gobbetti
The Center for Advanced Studies, Research and Development in Sardinia, Italy, gobbetti@crs4.it

Marcin Grzegorzek
Universität zu Lübeck, Germany, grzegorzek@imi.uni-luebeck.de

Shuhang Gu
University of Electronic Science and Technology of China (UESTC), China, shuhanggu@uestc.edu.cn

Frank Guan
Singapore Institute of Technology, Singapore, frank.guan@singaporetech.edu.sg

Jianwei Guo
Chinese Academy of Sciences, China, jianwei.guo@nlpr.ia.ac.cn

Yulan Guo
Sun Yat-sen University, China, guoyulan@mail.sysu.edu.cn

Zhenhua Guo
Alibaba Group, China, cszguo@gmail.com

Jiří Hladůvka
Vienna University of Technology, Austria, jiri@prip.tuwien.ac.at

Peng Hu
Sichuan University, China, Penghu.ml@gmail.com

Jin Huang
Wuhan Textile University, China, jhuang@wtu.edu.cn

Haibin Huang
Kuaishou Technology, United States of America, jackiehuanghaibin@gmail.com

Hua Huang
Beijing Institute of Technology, China, huahuang@bit.edu.cn

Caigui Jiang
Xi'an Jiaotong University, China, cgjiang@xjtu.edu.cn

Jianbo Jiao
University of Birmingham, United Kingdom, j.jiao@bham.ac.uk

Younhyun Jung
Gachon University, Korea (South), younhyun.jung@gachon.ac.kr

Ramakrishna Kakarala
Omnivision Technologies, Inc., United States of America, ram.kakarala@ovt.com

Prem Kalra
Indian Institute of Technology Delhi, India, pkalra@cse.iitd.ernet.in

Daniel Keim
University of Konstanz, Germany, keim@uni-konstanz.de

Jinman Kim
University of Sydney, Australia, jinman.kim@sydney.edu.au

George Alex Koulieris
Durham University, United Kingdom, georgios.a.koulieris@durham.ac.uk

Arjan Kuijper
Fraunhofer IGD, and Technical University of Darmstadt, Germany, arjan.kuijper@igd.fraunhofer.de

Yu-Kun Lai
Cardiff University, United Kingdom, LaiY4@cardiff.ac.uk

Jean-François Lalonde
Université Laval, Canada, jean-francois.lalonde@gel.ulaval.ca

Guanbin Li
Sun Yat-sen University, China, liguanbin@mail.sysu.edu.cn

Jiajia Li
Shanghai Jiao Tong University, China, lijiajia@sjtu.edu.cn

Ping Li
The Hong Kong Polytechnic University, Hong Kong, p.li@polyu.edu.hk

Zechao Li
Nanjing University of Science and Technology, China, zechao.li@njust.edu.cn

Dong Liang
Nanjing University of Aeronautics and Astronautics, China, liangdong@nuaa.edu.cn

Jinxing Liang
Wuhan Textile University, China, jxliang@wtu.edu.cn

Hai-Ning Liang
Xi’an Jiaotong-Liverpool University, China, haining.liang@xjtlu.edu.cn

Luming Liang
Microsoft, United States of America, llmpass@gmail.com

Di Lin
Shenzhen University, China, ande.lin1988@gmail.com

Risheng Liu
Dalian University of Technology, China, rsliu@dlut.edu.cn

Xuequan Lu
La Trobe University, Australia, b.lu@latrobe.edu.au

Yong Luo
Wuhan University, China, luoyong@whu.edu.cn

Bingpeng Ma
University of Chinese Academy of Sciences, China, bpma@ucas.ac.cn

Luca Magri
Politecnico di Milano, Italy, luca.magri@polimi.it

Xiaoyang Mao
University of Yamanashi,  Japan, mao@yamanashi.ac.jp

Jingjing Meng
University at Buffalo, State University of New York, United States of America, jingjing.meng1@gmail.com

Weiliang Meng
Chinese Academy of Sciences, China, weiliang.meng@ia.ac.cn

Alexandre Meyer
Claude Bernard University of Lyon 1, France, alexandre.meyer@liris.cnrs.fr

Bochang Moon
Gwangju Institute of Science and Technology, Korea (South), moonbochang@gmail.com

Michela Mortara
IMATI-CNR Genova, Italy, michela.mortara@ge.imati.cnr.it

Hamed Mozaffari
National Research Council Canada, Canada, MHamed.MozaffariMaaref@nrc-cnrc.gc.ca

Tai-Jiang Mu
Tsinghua University, China, taijiang@tsinghua.edu.cn

Anirban Mukhopadhyay
Technische Universität Darmstadt, Germany, anirban.mukhopadhyay@gris.informatik.tu-darmstadt.de

Yongwei Nie
South China University of Technology, China, nieyongwei@scut.edu.cn

George Papagiannakis
University of Crete, Greece, papagian@ics.forth.gr

Chunlei Peng
Xidian University, China, clpeng@xidian.edu.cn

Xi Peng
Sichuan University, China, pengxi@scu.edu.cn

Jianjun Qian
Nanjing University of Science and Technology (NUST), China, csjqian@njust.edu.cn

Weize Quan
Institute of Automation Chinese Academy of Sciences, China, qweizework@gmail.com

Francesco Ragusa
University of Catania, Italy, francesco.ragusa@unict.it

Jianfeng Ren
University of Nottingham Ningbo, China, Jianfeng.Ren@nottingham.edu.cn

Zhou Ren
Wormpex AI Research, United States of America, renzhou200622@gmail.com

Jonathan Roberts
Bangor University, United Kingdom, j.c.roberts@bangor.ac.uk

Robert Sablatnig
Wien Technical University, Austria, sab@cvl.tuwien.ac.at

Gerik Scheuermann
University of Leipzig, Germany, scheuer@informatik.uni-leipzig.de

Hans-Jörg Schulz
Aarhus University, Denmark, hjschulz@cs.au.dk

Thomas Schultz
University of Bonn, Germany, schultz@cs.uni-bonn.de

Boran Sekeroglu
Near East University, Turkey, boran.sekeroglu@neu.edu.tr

Hyewon Seo 
CNRS and University of Strasbourg, France, seo@unistra.fr

Tianjia Shao
Zhejiang University, China, tjshao@zju.edu.cn

Zhiwen Shao
China University of Mining and Technology, China, zhiwen_shao@cumt.edu.cn

Xiangbo Shu
Nanjing University of Science and Technology, China, shuxb@njust.edu.cn

Oh-young Song
Sejong University, Korea (South), oysong@sejong.ac.kr

Alexei Sourin
Nanyang Technological University, Singapore, assourin@ntu.edu.sg

Indro Spinelli
Sapienza University of Rome, Italy

Xin Tan
East China Normal University, China, xtan@cs.ecnu.edu.cn

Keke Tang
Guangzhou University, China, tangbohutbh@gmail.com

Daniel Thalmann
EPFL, Switzerland, daniel.thalmann@epfl.ch

Bernie Tiddeman
Aberystwyth University, United Kingdom, bpt@aber.ac.uk

Zhigang Tu
Wuhan University, China, tuzhigang@whu.edu.cn

Hongcheng Wang
Comcast Labs, United States of America, Hongcheng.Wang@gmail.com

Huamin Wang
The Ohio State University, United States of America, whmin@cse.ohio-state.edu

Keze Wang
DMAI Co., Ltd, China, kezewang@gmail.com

Weiming Wang
Hong Kong Metropolitan University, Hong Kong, wmwang@hkmu.edu.hk

Wenguan Wang
Zhejiang University, China, wenguanwang.ai@gmail.com

Yi Wang
The Hong Kong Polytechnic University, Hong Kong, yi-eie.wang@polyu.edu.hk

Yiqun Wang
Chongqing University, China, yiqun.wang@cqu.edu.cn

Yang Wen
Shenzhen University, China, wen_yang@szu.edu.cn

Thomas Wischgoll
Wright State University, USA, thomas.wischgoll@wright.edu

Franz-Erich Wolter
Leibniz Universität Hannover, Germany, few@gdv.uni-hannover.de

Zhifeng Xie
Shanghai University and Shanghai Engineering Research Center of Motion Picture Special Effects, China, zhifeng_xie@shu.edu.cn

Kevin Xu
National University of Defense Technology (NUDT), China, kevin.kai.xu@gmail.com

Shibiao Xu
Beijing University of Posts and Telecommunications, China, shibiaoxu@bupt.edu.cn

Yan Yan
Xiamen University, China, yanyan@xmu.edu.cn

Wankou Yang
Southeast University, China, wkyang@seu.edu.cn

Xi Yang
Xidian University, China, yangx@xidian.edu.cn

Yong-Liang Yang
University of Bath, United Kingdom, yy753@bath.ac.uk

Junsong Yuan
University of Buffalo, United States of America, jsyuan@buffalo.edu

Shanxin Yuan
Huawei Technologies Research & Development (UK) Ltd, United Kingdom, shanxinyuan@gmail.com

Gabriel Zachmann
University of Bremen, Germany, zach@cs.uni-bremen.de

Pietro Zanuttigh
University of Padova, Italy, zanuttigh@dei.unipd.it

Wei Zeng
The Hong Kong University of Science and Technology (Guangzhou), China, weizeng@hkust-gz.edu.cn

Zhiyuan Zha
Nanyang Technological University, Singapore, zhiyuan.zha@ntu.du.sg

Hua Zhang
Chinese Academy of Sciences, China, zhanghua@iie.ac.cn

Jian J Zhang
Bournemouth University, United Kingdom, jzhang@bournemouth.ac.uk

Kaibing Zhang
Xi’an Polytechnic University, China, zhangkaibing@xpu.edu.cn

Kang Zhang
University of Texas at Dallas, United States of America, kzhang@utdallas.edu

Lei Zhang
Beijing Institute of Technology, China, leizhang@bit.edu.cn

Mingjin Zhang
Xidian University, China, mjinzhang@xidian.edu.cn

Qianni Zhang
Queen Mary University of London, United Kingdom, qianni.zhang@qmul.ac.uk

Mingyang Zhao
Centre for Artificial Intelligence and Robotics (CAIR) Hong Kong Institute of Science & Innovation, Chinese Academy of Sciences, Hing Kong, migyangz@gmail.com

Yang Zhao
Hefei University of Technology, China, yzhao@hfut.edu.cn

Jianmin Zheng
Nanyang Technological University, Singapore, ASJMZheng@ntu.edu.sg

Shuaifeng Zhi
National University of Defense Technology (NUDT), China, zhishuaifeng11@nudt.edu.cn

Chenyang Zhu
National University of Defense Technology (NUDT), China, chenyang.chandler.zhu@gmail.com

Lei Zhu
The Hong Kong University of Science and Technology (Guangzhou), China, leizhu@ust.hk

Mingrui Zhu
Xidian University, China, mrzhu@xidian.edu.cn

Changqing Zou
Zhejiang University, China, aaronzou1125@gmail.com
 

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