Gold’s evolving role in the electronics industry Trevor Keel Editorial Open access 16 August 2014 Pages: 139 - 139
Evolution and investigation of copper and gold ball bonds in extended reliability stressing C. L. GanF. C. ClasseU. Hashim Original Paper Open access 29 March 2014 Pages: 141 - 151
Effect of gold addition on the microstructure, mechanical properties and corrosion behavior of Ti alloys Yong-Ryeol LeeMi-Kyung HanYeong-Joon Park Original Paper Open access 16 April 2014 Pages: 153 - 160
Generation of gold nanoparticles according to procedures described in the eighteenth century Álvaro MayoralJavier AgúndezJoaquín Pérez-Pariente Original Paper Open access 20 April 2014 Pages: 161 - 165
Phase diagram of Au-Al-Cu at 500 °C Jyun Lin LiPei Jen LoKer-Chang Hsieh Original Paper Open access 29 April 2014 Pages: 167 - 175
Probing the surface oxidation of chemically synthesised gold nanospheres and nanorods Blake J. PlowmanNathan ThompsonAnthony P. O’Mullane Original Paper Open access 03 May 2014 Pages: 177 - 183
Room temperature evolution of gold nanodots deposited on silicon C. GarozzoA. FilettiR. A. Puglisi Original Paper Open access 09 May 2014 Pages: 185 - 193
Lamellar-forming grain boundary reaction related to age-hardening mechanism in an Au-Pt-Pd-In metal-ceramic alloy Sung-Min KimHyung-Il KimHyo-Joung Seol Original Paper Open access 09 July 2014 Pages: 195 - 203
Gold etching for microfabrication T. A. Green Literature Review Open access 11 May 2014 Pages: 205 - 216
Highlights from recent literature Highlights from recent literature Open access 12 August 2014 Pages: 217 - 222