1. Editorial

   • Richard Holliday

   EditorialNotes Open access Pages: 149 - 149

2. What is the future of bonding wire? Will copper entirely replace gold?

   • C. D. Breach

   OriginalPaper Open access Pages: 150 - 168

3. Recent developments in the preparation of nano-gold composite coatings

   • Renate Freudenberger
   • Andreas Zielonka
   • Uwe Landau

   OriginalPaper Open access Pages: 169 - 180

4. Printed gold for electronic applications

   • P. T. Bishop
   • L. J. Ashfield
   • P. A. Sutton

   OriginalPaper Open access Pages: 181 - 188

5. Recent progress in gold nanoparticle-based non-volatile memory devices

   • Jang-Sik Lee

   OriginalPaper Open access Pages: 189 - 199

6. Adsorption of gold(III) from waste rinse water of semiconductor manufacturing industries using Amberlite XAD-7HP resin

   • Nghiem Van Nguyen
   • Jae-chun Lee
   • Jinki Jeong

   OriginalPaper Open access Pages: 200 - 208

7. Recycling of gold from electronics: Cost-effective use through ‘Design for Recycling’

   • Christian Hagelüken
   • Christopher W Corti

   OriginalPaper Open access Pages: 209 - 220

8. Highlights from recent literature

   Announcement Open access Pages: 221 - 228

9. Calendar

   Events Open access Pages: 229 - 229

10. Announcement — a new era forGold Bulletin

    • Richard Holliday

    Announcement Open access Pages: 230 - 230