Materials issues in the multichip module packaging of electronics D. B. KnorrD. R. FrearW. L. Winterbottom Multichip Module Packaging Pages: 7 - 7
Novel materials for electronic packaging and thermal management Warren H. Hunt Jr.M. K. Premkumar Multichip Module Packaging Pages: 8 - 9
The past, present, and future of multilayer ceramic multichip modules in electronic packaging Ananda H. KumarRao R. Tummala Multichip Module Packaging Pages: 10 - 14
Metal-matrix composites for electronic packaging Carl Zweben Multichip Module Packaging Pages: 15 - 23
Aluminum composite materials for multichip modules M. K. PremkumarW. H. Hunt Jr.R. R. Sawtell Multichip Module Packaging Pages: 24 - 28
Mechanical aspects of multichip module reliability David B. Knorr Multichip Module Packaging Pages: 29 - 35
Predictive thermal and mechanical modeling of a developmental MCM Robert DarveauxK. Linga MurtyIwona Turlik Multichip Module Packaging Pages: 36 - 41
Precious-metal-bearing scrap: Some considerations in sampling and negotiations James E. Hoffmann Recycling Precious Metal Pages: 42 - 42
Recovering precious metals from electronic scrap James E. Hoffmann Recycling Precious Metal Pages: 43 - 48
Electronic packaging activities at the Rensselaer Polytechnic Institute’s Center for Integrated Electronics David B. Knorr Forum Pages: 54 - 55
