Skip to main content
Log in

Volumes and issues

Search all Journal of Electronic Materials articles
  • Volume 53

    • Issue 8

      Includes Special Sections: High-Energy Battery Materials. Guest Editors: Xinhui Xia, Yongqi Zhang, and Huang Yizhong; 17th International Conference on Reliability and Stress-Related Phenomena in Nanoelectronics 2023. Guest Editors: Ehrenfried Zschech, Zhong Chen, Reinhold Dauskardt, Valeriy Sukharev, and Olivier Thomas

    • Issue 7

      Includes Special Sections: High-Energy Battery Materials. Guest Editors: Xinhui Xia, Yongqi Zhang, and Huang Yizhong; International Conference on Low-Energy Digital Devices and Computing 2023. Guest Editors: Goutam Kumar Dalapati, Ajay Kumar Kushwaha, Chandreswar Mahata, Ramesh Vaddi, and Chellappan Vijila

    • Issue 6

      Includes Special Sections: 65th Electronic Materials Conference 2023. Guest Editors: Shadi Shahedipour-Sandvik, Jennifer Hite, Nadeem Mahadik, Parsian Mohseni, Jamie Phillips, and Randy P. Tompkins; High-Energy Battery Materials. Guest Editors: Xinhui Xia, Yongqi Zhang, and Huang Yizhong

    • Issue 5
    • Issue 4
    • Issue 3

      Includes Special Section: Electronic Packaging and Interconnections 2023. Guest Editors: Kazuhiro Nogita, Tae Kyu Lee, and Christopher Gourlay

    • Issue 2
    • Issue 1
  • Volume 52

    • Issue 12
    • Issue 11

      Includes Special Section: U.S. Workshop on the Physics and Chemistry of II-VI Materials 2022. Guest Editors: Sivalingam Sivananthan and Nibir K. Dhar

    • Issue 10
    • Issue 9
    • Issue 8

      Includes Special Sections: 19th Conference on Defects-Recognition, Imaging and Physics in Semiconductors (DRIP XIX). Guest Editors: Naoki Fukata, Hidekazu Tsuchida, Takashi Sekiguchi, Atsushi Ogura; and Advanced Metal Ion Batteries. Guest Editors: Guest Editors: Xinhui Xia and Yongqi Zhang

    • Issue 7

      Special Section: International Conference on Organic Electronics 2022. Guest Editors: Pramod Kumar Singh, Geeta Durga, Bouchta Sahraoui, and Canan Varlikli

    • Issue 6

      Special Section: Advanced Metal Ion Batteries. Guest Editors: Xinhui Xia and Yongqi Zhang

    • Issue 5

      Special Sections: Synthesis and Advanced Characterization of Magnetic Oxides. Guest Editors: Jitendra Pal Singh, Manish Kumar, Shalendra Kumar, and R.C. Srivastava; Advanced Metal Ion Batteries. Guest Editors: Xinhui Xia and Yongqi Zhang

    • Issue 4

      Special Section: Advanced Metal Ion Batteries. Guest Editors: Xinhui Xia and Yongqi Zhang

    • Issue 3

      Special Sections: 2nd International Conference on Materials Genome. Guest Editors: Ranjit Thapa, Yoshiyuki Kawazoe, Mahesh Kumar Rava, Jatis Kumar Dash, Pranab Mandal; Advanced Metal Ion Batteries. Guest Editors: Xinhui Xia and Yongqi Zhang

    • Issue 2

      Special Sections: Electronic Packaging and Interconnections 2022. Guest Editors: Tae-Kyu Lee, Kazuhiro Nogita, Albert T. Wu; Advanced Metal Ion Batteries. Guest Editors: Xinhui Xia and Yongqi Zhang

    • Issue 1

      Special Section: Advanced Metal Ion Batteries. Guest Editors: Xinhui Xia and Yongqi Zhang

  • Volume 51

    • Issue 12

      Special Sections: Advanced Metal Ion Batteries. Guest Editors: Xinhui Xia and Yongqi Zhang; Synthesis and Advanced Characterization of Magnetic Oxides. Guest Editors: Jitendra Pal Singh, Manish Kumar, Shalendra Kumar, and R.C. Srivastava

    • Issue 11

      Special Section: Advanced Metal Ion Batteries. Guest Editors: Xinhui Xia and Yongqi Zhang

    • Issue 10

      Special Section: Synthesis and Advanced Characterization of Magnetic Oxides. Guest Editors: Jitendra Pal Singh, Manish Kumar, Shalendra Kumar, and R.C. Srivastava

    • Issue 9

      Special Sections: U.S. Workshop on the Physics and Chemistry of II-VI Materials 2021. Guest Editors: Sivalingam Sivananthan and Nibir K. Dhar; Advanced Metal Ion Batteries. Guest Editors: Xinhui Xia and Yongqi Zhang; Synthesis and Advanced Characterization of Magnetic Oxides. Guest Editors: Jitendra Pal Singh, Manish Kumar, Shalendra Kumar, and R.C. Srivastava

    • Issue 8

      Special Section: Advanced Metal Ion Batteries. Guest Editors: Xinhui Xia and Yongqi Zhang; Special Section: Synthesis and Advanced Characterization of Magnetic Oxides. Guest Editors: Jitendra Pal Singh, Manish Kumar, Shalendra Kumar, and R.C. Srivastava

    • Issue 7

      Special Section: Synthesis and Advanced Characterization of Magnetic Oxides. Guest Editors: Jitendra Pal Singh, Manish Kumar, Shalendra Kumar, and R.C. Srivastava

    • Issue 6

      Special Section: Synthesis and Advanced Characterization of Magnetic Oxides. Guest Editors: Jitendra Pal Singh, Manish Kumar, Shalendra Kumar, and R.C. Srivastava

    • Issue 5

      Special Section: Synthesis and Advanced Characterization of Magnetic Oxides. Guest Editors: Jitendra Pal Singh, Manish Kumar, Shalendra Kumar, and R.C. Srivastava

    • Issue 4
    • Issue 3
    • Issue 2
    • Issue 1
  • Volume 50

    • Issue 12

      Special Section: Electronic Packaging and Interconnections 2021. Guest Editors: Mehran Maalekian, Babak Arfaei, Praveen Kumar, Sai Vadlamani, Kazuhiro Nogita, and Christopher M. Gourlay

    • Issue 11
    • Issue 10
    • Issue 9

      Special Section: Carbon-Based Materials for Energy Storage. Guest Editors: Faxiang Qin and Xinhui Xia

    • Issue 8
    • Issue 7
    • Issue 6

      Special Section: 62nd Electronic Materials Conference 2020. Guest Editors: Shadi Shahedipour-Sandvik, Joshua Caldwell, Jennifer Hite, Nadeem Mahadik, Parsian Mohseni, Jamie Phillips, Randy Tompkins, Jing Zhang; Special Section: Carbon-Based Materials for Energy Storage. Guest Editors: Faxiang Qin and Xinhui Xia

    • Issue 5
    • Issue 4

      Special Section: Asian Consortium on Computational Materials Science–International Conference on Materials Genome (ACCMS-ICMG) 2020. Guest Editors: Rajit Thapa, Jatis Kumar Dash, Kenta Hongo, Yoshiyuki Kawazoe, Pranab Mandal, Mahesh Kumar Rava, Umesh V. Waghmare; Special Section: Progress and Challenges With Stability, Sustainability, Toxicity, and Scalability of Perovskite Materials and Devices. Guest Editors: Wojciech M. Jadwisienczak, Faiz Rahman, Dan Ricinschi

    • Issue 3

      Special Section: TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder. Guest Editors: Christopher M. Gourlay, Kazuhiro Nogita, David P. Yan, Mike Wolverton, Babak Arfaei, Andre M. Delhaise, Mehran Maalekian, Mohd Arif Salleh

    • Issue 2
    • Issue 1
  • Volume 49

    • Issue 12

      Special Section: Progress and Challenges With Stability, Sustainability, Toxicity, and Scalability of Perovskite Materials and Devices. Guest Editors: Wojciech M. Jadwisienczak, Faiz Rahman, and Dan Ricinschi

    • Issue 11

      Special Section: International Electron Devices and Materials Symposium 2019. Guest Editors: Chih Wah Kok, Wing Shan Tam, Chao Sung Lai, Jer Chyi Wang. Special Section: U.S. Workshop on Physics and Chemistry of II-VI Materials 2019

    • Issue 10
    • Issue 9

      Special Section: 18th Conference on Defects-Recognition, Imaging and Physics in Semiconductors (DRIP XVIII). Guest Editors: Anna Mogilatenko, Catherine Bougerol, Matthias Bickermann, Julita Smalc-Koziorowska, Michael Dudley

    • Issue 8

      Special Section: 19th International Conference on II-VI Compounds and Related Materials. Guest Editors: Chongxin Shan and Aidong Shen

    • Issue 7
    • Issue 6

      Special Section: 61st Electronic Materials Conference 2019. Guest Editors: Joshua Caldwell, Nadeem Mahadik, Parsian Mohseni, Jamie Phillips, Shadi Shahedipour-Sandvik, Randy Tompkins

    • Issue 5

      Special Section: International Conference on Thermoelectrics 2019. Guest Editors: Min-Wook Oh, Matt Beekman, Ken Kurosaki, Kyu Hyoung Lee, Donald Morelli, Takao Mori, Michitaka Ohtaki, Yanzhong Pei, Jae Sung Son, Tsunehiro Takeuchi, Wenqing Zhang, Li-dong Zhao, Tie-Jun Zhu; Special Section: Progress and Challenges in Developing Electromagnetic Interference Materials. Guest Editors: M.T. Sebastian, John Baniecki, Ratiba Benzerga, Balaram Sahoo

    • Issue 4
    • Issue 3

      Special Section: Progress and Challenges in Developing Electromagnetic Interference Materials. Guest Editors: M.T. Sebastian, John Baniecki, Balaram Sahoo, and Ratiba Benzerga

    • Issue 2
    • Issue 1

      Special Section: TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder. Guest Editors: Kazuhiro Nogita, Tae-Kyu Lee, Zhi-Quan Liu, Arif Salleh, Christopher Gourlay, Yan Li, Albert T. Wu. Special Section: TMS2019 Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVIII. Guest Editor: Hiroshi Nishikawa

  • Volume 48

    • Issue 12
    • Issue 11

      Special Section: Electronic Materials for Renewable Energy Applications 2018

    • Issue 10

      Special Section: U.S. Workshop on the Physics and Chemistry of II-VI Materials 2018

    • Issue 9

      Special Section: Progress and Challenges for Emerging Integrated Energy Modules

    • Issue 8
    • Issue 7
    • Issue 6
    • Issue 5

      Special Section: 60th Electronic Materials Conference 2018. Guest Editors: Joshua Caldwell, Nadeemullah Mahadik, Jamie Phillips, Adrienne Stiff-Roberts, Ganesh Balakrishnan, Parsian Mohseni, Patrick Shea, Shadi Shahedipour-Sandvik

    • Issue 4

      Special Section: International Conference on Thermoelectrics 2018. Guest Editors: Emmanuel Guilmeau, Matt Beekman, Franck Gascoin, Yuri Grin, Bertrand Lenoir, Donald Morelli, Takao Mori, Ngo Van Nong, James R. Salvador, David Singh, Tsunehiro Takeuchi, Xinfeng Tang, Chunlei Wan, Hsin Wang, Shanyu Wang, Wenqing Zhang, Tie-Jun Zhu

    • Issue 3

      Special Section: 5th International Conference of Asian Union of Magnetics Societies (IcAUMS). Guest Editors: Manh-Huong Phan, Chun-Yeol You, Jun Woo Choi

    • Issue 2
    • Issue 1

      Special Sections: TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder. Guest Editors: Kazuhiro Nogita, Fan-Yi Ouyang, Sergey A. Belyakov, Chih Chen, Christopher M. Gourlay, Kwang-Lung Lin, Won-sik Hong, Mehran Maalekian; and TMS2018 Phase Stability in Electronic Materials. Guest Editor: Shih-kang Lin

  • Volume 47

    • Issue 12
    • Issue 11
    • Issue 10

      Special Section: U.S. Workshop on Physics and Chemistry of II-VI Materials 2017. Guest Editors: N. K. Dhar and S. Sivananthan

    • Issue 9

      Special Section: 17th Conference on Defects-Recognition, Imaging and Physics in Semiconductors (DRIP XVII). Guest Editors: Oscar Martínez Sacristán, Martina Baeumler, Deren Yang, Ute Zeimer, Jean-Pierre Landesman, Helena Castan Lanaspa

    • Issue 8

      Special Sections: 18th International Conference on II–VI Compounds and Related Materials. Guest Editors: Xinyu Liu and Aidong Shen; and 5th European Conference on Renewable Energy Systems. Guest Editors: Erol Kurt and Shadia Jamil Ikhmayies

    • Issue 7
    • Issue 6

      2017 International Conference on Thermoelectrics. Guest Editors: Jihui Yang, Matt Beekman, Ryoji Funahashi,Yuri Grin, Emmanuel Guilmeau, Betrand Lenoir, Donald Morelli,Takao Mori, James Salvador, David Singh, Tsunehiro Takeuchi, Xinfeng Tang, Chunlei Wan, Hsin Wang, Shanyu Wang, Wenqing Zhang, Tie-Jun Zhu

    • Issue 5
    • Issue 4
    • Issue 3
    • Issue 2

      Special Section: 59th Electronic Materials Conference 2017. Guest Editors: Shadi Shahedipour-Sandvik, Joshua Caldwell, Charles Lutz, Jamie Phillips, Adrienne Stiff-Roberts, Joshua Zide, Nadeem Mahadik, and Patrick B. Shea

    • Issue 1

      Special Section: Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI. Guest Editors:Shih-kang Lin, Chao-hong Wang, and Chih-Ming Chen; and Special Section: Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder. Guest Editors: Fan-Yi Ouyang, Albert Wu, C. Robert Kao, Yan Li, Babak Arfaei, and Kazuhiro Nogita

  • Volume 46

    • Issue 12
    • Issue 11
    • Issue 10
    • Issue 9

      2016 U.S. Workshop on the Physics and Chemistry of II-VI Materials. Guest Editors: S. Sivananthan and N.K. Dhar

    • Issue 8
    • Issue 7

      Special Topic on Superlattices, Nanostructures and Nanodevices. Guest Editor: Ruiqin Zhang. Special Topic on Materials Studies in Energy Systems. Guest Editors: Erol Kurt, Shadia Ikhmayies, and Ibrahim Sefa

    • Issue 6

      The Third International Conference on Advanced Materials and Nanotechnology (ICAMN 2016) and The International Workshop on Advanced Materials and Nanotechnology (IWAMN 2016). Guest Editors: Manh-Huong Phan, Nguyen Van Hieu, Anh-Tuan Le, Nguyen Phuc Duong, Yogi Shibutani, and Nguyen Hoang Luong

    • Issue 5

      2016 International Conference on Thermoelectrics. Guest Editors: Jihui Yang, Matt Beekman, Donald Morelli, James Salvador, David Singh, Hsin Wang, Emmanuel Guilmeau, Juri Grin, Bertrand Lenoir, Xinfeng Tang, Wenqing Zhang, Chunlei Wan, TieJun Zhu, Ryoji Funahashi, Takao Mori, Tsunehiro Takeuchi, Franck Gascoin, and Shanyu Wang

    • Issue 4
    • Issue 3
    • Issue 2
    • Issue 1
  • Volume 45

    • Issue 12

      TMS Special Sections: Alloys and Compounds for Thermoelectric and Solar Cell Applications IV; Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology; and Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV. 58th EMC Special Section: 2016 Electronic Materials Conference

    • Issue 11
    • Issue 10
    • Issue 9

      2015 U.S. Workshop on the Physics and Chemistry of II-VI Materials. Guest Editors: S. Sivananthan and N.K. Dhar

    • Issue 8

      Special Section: Third European Conference on Renewable Energy Systems. Guest Editors: Erol Kurt and Shadia Ikhmayies

    • Issue 7
    • Issue 6
    • Issue 5

      International Workshop on Nanoscience and Nanotechnology: Opportunities for Academia & High Tech Industry - Joint 4th Asia-Pacific Chemical and Biological Microfluidics Conferences (IWNN-APCBM 2015). Guest Editors: Manh-Huong Phan, Nguyen Xuan Phuc, and Tran Dai Lam

    • Issue 4

      Special Section: 2015 Electronic Materials Conference. Guest Editors: Joshua Caldwell, Joshua Zide, Suzanne Mohney, Jamie Phillips, F. Shadi Shahedipour-Sandvik, Nadeem Mahadik, Fareed Qhalid, Suchi Guha, Rachel Goldman, Jian Xu, Angel Yanguas-Gil, Ganesh Balakrishnan

    • Issue 3

      2015 International Conference on Thermoelectrics. Guest Editors: Jihui Yang, Matt Beekman, Donald Morelli, James Salvador, David Singh, Hsin Wang, Emmanuel Guilmeau, Juri Grin, Bertrand Lenoir, Xinfeng Tang, Wenqing Zhang, Chunlei Wan, TieJun Zhu, Ryoji Funahashi, Takao Mori, Tsunehiro Takeuchi, Sabah Bux

    • Issue 2
    • Issue 1

      Special Sections: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies; Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIII; and Advanced Materials for Power Electronics and Power Conditioning Systems

  • Volume 44

    • Issue 12
    • Issue 11
    • Issue 10
    • Issue 9

      2014 U.S. Workshop on the Physics and Chemistry of II-VI Materials. Guest Editors: S. Sivananthan and N.K. Dhar

    • Issue 8
    • Issue 7
    • Issue 6

      2014 International Conference on Thermoelectrics. Guest Editors: Lasse Rosendahl, Donald Morelli, Jihui Yang, Hiroaki Anno, Matt Beekman, Jan D. Koenig, Xinfeng Tang, James R. Salvador, Bertrand Lenoir, Chunlei Wan, Jeff Sharp, Emmanuel Guilmeau, Hsin Wang, Jing-feng Li, Tie-Jun Zhu, David Singh, Ryoji Funahashi, Yuri Grin, and Wenqing Zhang

    • Issue 5

      2014 Electronic Materials Conference. Guest Editors: Angel Yanguas-Gil, Ganesh Balakrishnan, Joshua D. Cladwell, Jamie Phillips, Joshua Zide, Michael Tiscler, John Baniecki, Suzanne Mohney, and Shadi Shahedipour-Sandvik

    • Issue 4
    • Issue 3

      Special Section: 3D Printing. Guest Editors: Kyoung-sik (Jack) Moon, Raymond C. Rumpf, Namsoo P. Kim, and Seung-Kyum Choi

    • Issue 2
    • Issue 1
  • Volume 43

    • Issue 12

      Special Sections from the 2014 TMS Annual Meeting: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies; Advanced Materials for Power Electronics and Power Conditioning Systems; and Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIII. Guest Editors: Darrel Frear, Rachael Myers-Ward, Paul Ohodnicki, and Chaohong Wang

    • Issue 11
    • Issue 10

      European Conference on Thermoelectrics 2013. Guest Editors: Andrea Amaldi and Francois Tang

    • Issue 9
    • Issue 8

      2013 U.S. Workshop on the Physics and Chemistry of II-VI Materials. Guest Editors: S. Sivananthan and N. K. Dhar

    • Issue 7
    • Issue 6

      International Conference on Thermoelectrics 2013. Guest Editors: Jihui Yang, Hiroaki Anno, Matt Beekman, Ryoji Funahashi, Yuri Grin, Emmanuel Guilmeau, Jan Koenig, Bertrand Lenoir, Don Morelli, Lasse Rosendahl, James R. Salvador, Jeff Sharp, David Singh, Tsunehiro Takeuchi, Xiegeng Tang, Chunlei Wang, Hsin Wang, Wenqing Zhang, and Tie-Jun Zhu

    • Issue 5
    • Issue 4

      2013 Electronic Materials Conference. Guest Editors: Joshua Caldwell, Rachel Goldman, Oana Jurchescu, Xuiling Li, Suzanne Mohney, Jamie Phillips, Grace Xing, Jian Xu, and Joshua Zide

    • Issue 3

      Special Section: Mechanical Reliability of Electronic Components; Guest Editor: Narayanaswami Ranganathan

    • Issue 2
    • Issue 1

      Special Sections from the 2013 TMS Annual Meeting: Lead-Free Solders; Advanced Materials for Power Electronics and Power Conditioning Systems; and Phase Stability, Phase Transformations, and Reaction Phase Formation in Electronic Materials. Guest Editors: Darrel Frear, Rachael Myers-Ward, Paul Ohodnicki, and Chaohong Wang

  • Volume 42

    • Issue 12
    • Issue 11

      2012 U.S. Workshop on the Physics and Chemistry of II-VI Materials. Guest Editors: S. Sivananthan and N.K. Dhar

    • Issue 10
    • Issue 9
    • Issue 8
    • Issue 7

      2012 International Conference on Thermoelectrics. Guest Editors: Ryoji Funahashi, Donald Morelli, Lasse Rosendahl, and Jihui Yang

    • Issue 6
    • Issue 5

      2012 Electronic Materials Conference. Guest Editors: Joshua Caldwell, Rachel Goldman, Jamie Phillips, Oana Jurchescu, Shadi Shahedipour-Sandvik, Alberto Salleo, Grace Xing, and Jian Xu

    • Issue 4
    • Issue 3
    • Issue 2

      Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

    • Issue 1
  • Volume 41

    • Issue 12

      Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XI

    • Issue 11
    • Issue 10

      2011 U.S. Workshop on the Physics and Chemistry of II-VI Materials

    • Issue 9
    • Issue 8
    • Issue 7
    • Issue 6

      International Conference on Thermoelectrics 2011

    • Issue 5

      2011 Electronic Materials Conference

    • Issue 4
    • Issue 3
    • Issue 2

      Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

    • Issue 1

      Phase Stability, Phase Transformation and Reactive Phase Formation in Electronic Materials

  • Volume 40

  • Volume 39

    • Issue 12

      Special Issue: Pb-Free Solders and Emerging Interconnect and Packaging Technologies

    • Issue 11

      Special Issue: Phase Stability, Phase Transformation and Reactive Phase Formation in Electronic Materials

    • Issue 10
    • Issue 9

      Special Issue: International Conference on Thermoelectrics 2009

    • Issue 8
    • Issue 7

      2009 U.S. Workshop on the Physics and Chemistry of II–VI Materials

    • Issue 6

      2009 International Conference on Defects: Recognition, Imaging and Physics in Semiconductors (DRIP)

    • Issue 5

      Special Issue: Group III Nitrides, Silicon Carbide, and Zinc Oxide

    • Issue 4
    • Issue 3
    • Issue 2
    • Issue 1
  • Volume 38

  • Volume 37

  • Volume 36

  • Volume 35

  • Volume 34

  • Volume 33

  • Volume 32

  • Volume 31

  • Volume 30

  • Volume 29

  • Volume 28

  • Volume 27

  • Volume 26

  • Volume 25

  • Volume 24

  • Volume 23

  • Volume 22

  • Volume 21

  • Volume 20

  • Volume 19

  • Volume 18

  • Volume 17

  • Volume 16

  • Volume 15

  • Volume 14

  • Volume 13

  • Volume 12

  • Volume 11

  • Volume 10

  • Volume 9

  • Volume 8

  • Volume 7

  • Volume 6

  • Volume 5

  • Volume 4

  • Volume 3

  • Volume 2

  • Volume 1

Navigation