Volume 43, Issue 3

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March 2014

Special Section: Mechanical Reliability of Electronic Components; Guest Editor: Narayanaswami Ranganathan

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20 articles in this issue

Structure–Diffusion Relationship of Magnetron-Sputtered WTi Barriers Used in Indium Interconnections
A. Le Priol
E. Le Bourhis
H. Sik
OriginalPaper 07 November 2013 Pages: 641 - 647
Architectured Materials to Improve the Reliability of Power Electronics Modules: Substrate and Lead-Free Solder
Abderrahmen Kaabi
Yves Bienvenu
Bertrand Pierre
OriginalPaper 11 July 2013 Pages: 648 - 657
Local and Global Properties of a Lead-Free Solder
Z. Ma
F. Chalon
B.D. Beake
OriginalPaper 12 July 2013 Pages: 658 - 670
Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies
W. Kpobie
N. Bonfoh
P. Lipinski
OriginalPaper 17 July 2013 Pages: 671 - 684
Mechanical and Electrical Reliability Assessment of Stacking of Ultrathin Chips on Si Interposer Using Back-to-Face Architecture
G. Parès
F. De Crecy
R. Anciant
OriginalPaper 29 August 2013 Pages: 685 - 694
SiC Die Attach for High-Temperature Applications
A. Drevin-Bazin
F. Lacroix
J. -F. Barbot
OriginalPaper 01 November 2013 Pages: 695 - 701
Dynamic Mechanical Properties and Thermal Effect of an Epoxy Resin Composite, Encapsulation’s Element of a New Electronic Component
W. Rmili
M.P. Deffarges
R. Leroy
OriginalPaper 14 November 2013 Pages: 702 - 707
3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters
Soufyane Belhenini
Abdellah Tougui
Franck Dosseul
OriginalPaper 14 January 2014 Pages: 708 - 716
Indentation Creep of Lead-Free Sn-5Sb Solder Alloy with 1.5 wt% Ag and Bi Additions
A.R. Geranmayeh
R. Mahmudi
G. Nayyeri
OriginalPaper 01 January 2014 Pages: 717 - 723
Effects of Annealing Temperature on the Electric Properties of 0.94(Na_0.5Bi_0.5)TiO₃–0.06BaTiO₃ Ferroelectric Thin Film
J. F. Peng
X. J. Zheng
Z. H. Dai
OriginalPaper 18 December 2013 Pages: 724 - 731
Structural, Dielectric, and Electrical Properties of BiFeWO₆ Ceramic
Jyoshna Rout
B.N. Parida
R. N. P. Choudhary
OriginalPaper 20 December 2013 Pages: 732 - 739
Strong Enhancement of Near-Band-Edge Photoluminescence of ZnO Nanowires Decorated with Sputtered Metallic Nanoparticles
Mohsen Purahmad
Michael A. Stroscio
Mitra Dutta
OriginalPaper 25 December 2013 Pages: 740 - 745
Thermal Conductivity Measurement of Low-k Dielectric Films: Effect of Porosity and Density
M. T. Alam
R. A. Pulavarthy
M. A. Haque
OriginalPaper 27 December 2013 Pages: 746 - 754
Investigation of Structural and Electrical Properties of B-Site Complex Ion (Mg_1/3Nb_2/3)⁴⁺-Modified High-Curie-Temperature BiFeO₃-BaTiO₃ Ceramics
Xiujuan Zhou
Changrong Zhou
Qiaolan Fan
OriginalPaper 04 January 2014 Pages: 755 - 760
Substitutional Atom Influence on the Electronic and Transport Properties of Mn₄Si₇
Ali Allam
Pascal Boulet
Marie-Christine Record
OriginalPaper 24 December 2013 Pages: 761 - 773
Pressure-Free Bonding of Metallic Plates with Ni Affinity Layers Using Cu Nanoparticles
Toshitaka Ishizaki
Kunio Akedo
Ryota Watanabe
OriginalPaper 10 January 2014 Pages: 774 - 779
High Performance Bottom-Gate-Type Amorphous InGaZnO Flexible Transparent Thin-Film Transistors Deposited on PET Substrates at Low Temperature
Hsin-Ying Lee
Wan-Yi Ye
Ching-Ting Lee
OriginalPaper 03 January 2014 Pages: 780 - 785
Reduction of Dislocation Density in HVPE-Grown GaN Epilayers by Using In Situ-Etched Porous Templates
Z. D. Zhao
B. Wang
G. H. Yu
OriginalPaper 18 December 2013 Pages: 786 - 790
Effects of Thickness and Annealing on Optoelectronic Properties of Electrodeposited ZnS Thin Films for Photonic Device Applications
O. K. Echendu
I. M. Dharmadasa
OriginalPaper 24 December 2013 Pages: 791 - 801
p-on-n HgCdTe Infrared Focal-Plane Arrays: From Short-Wave to Very-Long-Wave Infrared
L. Mollard
G. Bourgeois
A. Manissadjian
OriginalPaper 22 October 2013 Pages: 802 - 807

Volume 43, Issue 3

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