Etching of 10Boron with SF6-based Electron Cyclotron Resonance Plasmas for Pillar-Structured Thermal Neutron Detectors L. F. VossC. E. ReinhardtC. L. Cheung OriginalPaper 20 January 2010 Pages: 263 - 267
Modeling of Thermal Conductivity of Graphite Nanosheet Composites Wei LinRongwei ZhangC.P. Wong OriginalPaper 13 January 2010 Pages: 268 - 272
Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys John W. ElmerEliot D. SpechtMukul Kumar OriginalPaper Open access 02 February 2010 Pages: 273 - 282
Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints Yung-Chi LinKai-Jheng WangJenq-Gong Duh OriginalPaper 11 December 2009 Pages: 283 - 294
A Study of Plasma-Cleaned Ag-Plated Cu Leadframe Surfaces Wuhu Li OriginalPaper 09 December 2009 Pages: 295 - 302
Measurements of Microhardness and Thermal and Electrical Properties of the Binary Zn-0.7wt.%Cu Hypoperitectic Alloy H. KayaU. BöyükN. Maraşli OriginalPaper 20 January 2010 Pages: 303 - 311
Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy Jir̆í SopoušekMarián PalcutJozef Janovec BriefCommunication 30 January 2010 Pages: 312 - 317
Reflow Phenomenon Analysis of Large Scale Integrated Cu Interconnections in Via Holes by Viscoelastic Deformation Simulation Takashi OnishiMasao MizunoTakayuki Onoda OriginalPaper 03 February 2010 Pages: 318 - 325
Effects of Solder Ball Geometry on Lap Shear Creep Rate S. B. KimJin Yu OriginalPaper 02 February 2010 Pages: 326 - 332
Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate X. F. ZhangJ. D. GuoJ. K. Shang BriefCommunication 29 December 2009 Pages: 333 - 337
Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP) Ji Chul YangDong Won OhTaesung Kim OriginalPaper 20 January 2010 Pages: 338 - 346
Enhanced Temperature Stability of (1 − x)(K0.5Na0.5)0.94Li0.06NbO3-x(Bi0.5Na0.5)TiO3 Lead-Free Piezoelectric Ceramics J. G. HaoZ. J. XuQ. R. Yin OriginalPaper 29 December 2009 Pages: 347 - 354