Volume 39, Issue 11

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November 2010

Special Issue: Phase Stability, Phase Transformation and Reactive Phase Formation in Electronic Materials

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22 articles in this issue

Foreword

News 11 September 2010 Pages: 2367 - 2367
Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps
Myeong-Hyeok Jeong
Gi-Tae Lim
Young-Bae Park
OriginalPaper 10 September 2010 Pages: 2368 - 2374
Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C
Chao-hong Wang
Hsien-hsin Chen
OriginalPaper 10 September 2010 Pages: 2375 - 2381
Growth Mechanism of a Ternary (Cu,Ni)₆Sn₅ Compound at the Sn(Cu)/Ni(P) Interface
T. S. Huang
H. W. Tseng
C. Y. Liu
OriginalPaper 09 September 2010 Pages: 2382 - 2386
Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish
W. H. Wu
C. S. Lin
C. E. Ho
OriginalPaper 04 September 2010 Pages: 2387 - 2396
Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder
Yu-Yan Chiang
Robbin Cheng
Albert T. Wu
OriginalPaper 02 September 2010 Pages: 2397 - 2402
Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers
K. C. Huang
F. S. Shieu
C. Y. Liu
OriginalPaper 01 September 2010 Pages: 2403 - 2411
Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate
Yee-Wen Yen
Da-Wei Liaw
Hao Chen
OriginalPaper 14 August 2010 Pages: 2412 - 2417
Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples
Sinn-wen Chen
Yu-kai Chen
Chih-ming Chen
OriginalPaper 14 August 2010 Pages: 2418 - 2428
Elastic Moduli of (Ni,Cu)₃Sn₄ Ternary Alloys from First-Principles Calculations
Feng Gao
Jianmin Qu
OriginalPaper 14 August 2010 Pages: 2429 - 2434
Control of Interface Traps in HfO₂ Gate Dielectric on Silicon
S. Y. Tan
OriginalPaper 21 July 2010 Pages: 2435 - 2440
The Application of Barrierless Metallization in Making Copper Alloy, Cu(RuHfN), Films for Fine Interconnects
C.H. Lin
W.K. Leau
C.H. Wu
OriginalPaper 12 June 2010 Pages: 2441 - 2447
In Situ Temperature Measurement of GaN-Based Ultraviolet Light-Emitting Diodes by Micro-Raman Spectroscopy
Yaqi Wang
Hui Xu
Kalyankumar Das
BriefCommunication 04 September 2010 Pages: 2448 - 2451
Electrical and Optical Characterization of AlGaN/GaN HEMTs with In Situ and Ex Situ Deposited SiN_x Layers
Marko J. Tadjer
Travis J. Anderson
Charles R. Eddy Jr.
OriginalPaper 10 September 2010 Pages: 2452 - 2458
Optimal Electrical Conductivity for Maximum Thermoelectric Figure of Merit
Gao Min
OriginalPaper 11 September 2010 Pages: 2459 - 2461
Chalcopyrite/Si Heterojunctions for Photovoltaic Applications
O. Akpa
S. Shoieb
K. Das
OriginalPaper 10 September 2010 Pages: 2462 - 2466
Light-Harvesting in n-ZnO/p-Silicon Heterojunctions
L. Li
C. X. Shan
Y. M. Lu
OriginalPaper 09 September 2010 Pages: 2467 - 2470
High-Temperature Capacitor Based on Ca-Doped Bi_0.5Na_0.5TiO₃-BaTiO₃ Ceramics
Y. Yuan
X. H. Zhou
S. R. Zhang
OriginalPaper 02 September 2010 Pages: 2471 - 2475
Recrystallization of Electrodeposited Copper Thin Films During Annealing
N. Alshwawreh
M. Militzer
D. Bizzotto
OriginalPaper 09 September 2010 Pages: 2476 - 2482
Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment
A.S. Budiman
C.S. Hau-Riege
W.D. Nix
OriginalPaper Open access 11 September 2010 Pages: 2483 - 2488
Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints
Y. W. Chang
S. H. Chiu
Chih Chen
OriginalPaper 10 September 2010 Pages: 2489 - 2494
Impression Creep Behavior of Zn-Sn High-Temperature Lead-Free Solders
R. Mahmudi
M. Eslami
OriginalPaper 10 September 2010 Pages: 2495 - 2502

Volume 39, Issue 11

Foreword

Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps

Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C

Growth Mechanism of a Ternary (Cu,Ni)₆Sn₅ Compound at the Sn(Cu)/Ni(P) Interface

Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish

Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder

Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers

Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples

Elastic Moduli of (Ni,Cu)₃Sn₄ Ternary Alloys from First-Principles Calculations

Control of Interface Traps in HfO₂ Gate Dielectric on Silicon

The Application of Barrierless Metallization in Making Copper Alloy, Cu(RuHfN), Films for Fine Interconnects

In Situ Temperature Measurement of GaN-Based Ultraviolet Light-Emitting Diodes by Micro-Raman Spectroscopy

Electrical and Optical Characterization of AlGaN/GaN HEMTs with In Situ and Ex Situ Deposited SiN_x Layers

Optimal Electrical Conductivity for Maximum Thermoelectric Figure of Merit

Chalcopyrite/Si Heterojunctions for Photovoltaic Applications

Light-Harvesting in n-ZnO/p-Silicon Heterojunctions

High-Temperature Capacitor Based on Ca-Doped Bi_0.5Na_0.5TiO₃-BaTiO₃ Ceramics

Recrystallization of Electrodeposited Copper Thin Films During Annealing

Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment

Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints

Impression Creep Behavior of Zn-Sn High-Temperature Lead-Free Solders

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