Nanostructured Thermoelectric Materials and High-Efficiency Power-Generation Modules Timothy P. HoganAdam DowneyEldon D. Case OriginalPaper 06 July 2007 Pages: 704 - 710
Synthesis and Thermoelectric Properties of “Nano-Engineered” CoSb3 Skutterudite Materials P.N. AlboniX. JiTerry M. Tritt OriginalPaper 29 June 2007 Pages: 711 - 715
Development and Evolution of Nanostructure in Bulk Thermoelectric Pb-Te-Sb Alloys Teruyuki IkedaVilupanur A. RaviG. Jeffrey Snyder OriginalPaper 29 June 2007 Pages: 716 - 720
Solution-Chemical Syntheses of Nano-Structured Bi2Te3 and PbTe Thermoelectric Materials X. JiB. ZhangA. Kumbhar OriginalPaper 14 June 2007 Pages: 721 - 726
Thermoelectric Properties of Mo3Sb5.4Te1.6 and Ni0.06Mo3Sb5.4Te1.6 Huqin ZhangJian HeHolger Kleinke OriginalPaper 12 June 2007 Pages: 727 - 731
Thermoelectric Properties of Half-Heusler Bismuthides ZrCo1−x Ni x Bi (x = 0.0 to 0.1) V. PonnambalamBo ZhangS. Joseph Poon OriginalPaper 09 June 2007 Pages: 732 - 735
Thermoelectric Properties of Na x CoO2 and Prospects for Other Oxide Thermoelectrics D.J. SinghD. Kasinathan OriginalPaper 13 June 2007 Pages: 736 - 739
Crystal Growth, Structure, and Stoichiometry of the Superconducting Pyrochlore Cd2Re2O7 J. HeR. JinTerry M. Tritt OriginalPaper 03 July 2007 Pages: 740 - 745
Thermoelectric Properties of NaCo2–x Fe x O y Biprodas DuttaJugdersuren BattogtokhIan L. Pegg OriginalPaper 19 June 2007 Pages: 746 - 752
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads W.H. LinAlbert T. WuK.N. Tu OriginalPaper 07 June 2007 Pages: 753 - 759
Effects of Copper Doping on Microstructural Evolution in Eutectic SnBi Solder Stripes under Annealing and Current Stressing Chih-Ming ChenChih-Chieh HuangKuen-Ming Liou OriginalPaper 12 June 2007 Pages: 760 - 765
Properties of Sn3.8Ag0.7Cu Solder Alloy with Trace Rare Earth Element Y Additions H. HaoJ. TianZ.D. Xia OriginalPaper 19 June 2007 Pages: 766 - 774
Electroless Ni/Au Bump on a Copper Patterned Wafer for the CMOS Image Sensor Package in Mobile Phones Joong-Do Kim OriginalPaper 30 May 2007 Pages: 775 - 782
Failure Mechanisms and Crack Propagation Paths in Thermally Aged Pb-Free Solder Interconnects Eduardo Franco De MonlevadeWeiqun Peng OriginalPaper 16 June 2007 Pages: 783 - 797
The Role of TiO2 in Ceramic Bulk Interference Suppressing Resistor Integrated with Car Spark Plug Ewa KlimiecStanisław NowakJerzy Stoch OriginalPaper 02 June 2007 Pages: 798 - 804
Improved Schottky Contacts on n-Type 4H-SiC Using ZrB2 Deposited at High Temperatures T.N. OderP. MartinJ.R. Williams OriginalPaper 05 June 2007 Pages: 805 - 811
Optical Characterization of Ag Nanoparticles Embedded in Aluminophosphate Glass J.A. JiménezS. LysenkoH. Liu OriginalPaper 30 May 2007 Pages: 812 - 820