Characteristics of Dislocation Half-Loop Arrays in 4H-SiC Homo-Epilayer Z. ZhangR.E. StahlbushT.S. Sudarshan OriginalPaper 09 May 2007 Pages: 539 - 542
Strategies to Improve Field Emission Performance of Nanostructural ZnO C. X. XuX. W. Sun OriginalPaper 01 May 2007 Pages: 543 - 548
High Performance Nonconductive Film with π-Conjugated Self-Assembled Molecular Wires for Fine Pitch Interconnect Applications Yi LiMyung Jin YimC.P. Wong Regular Issue Paper 19 April 2007 Pages: 549 - 554
Migration, Formation, and Growth of Pure Cd Whiskers in Cd-Based Compounds D. WuT.A. LograssoJ.W. Anderegg Regular Issue Paper 19 April 2007 Pages: 555 - 561
In-Situ Observation of Electromigration in Eutectic SnPb Solder Lines: Atomic Migration and Hillock Formation Min-Seung YoonMin-Ku KoYoung-Chang Joo OriginalPaper 19 April 2007 Pages: 562 - 567
Thermodynamic Modeling of the Au-Bi-Sb Ternary System J. WangF.G. MengZ.P. Jin OriginalPaper 21 April 2007 Pages: 568 - 577
Interfacial Reactions between Cu x Ni y Alloy Underbump Metallurgy and Sn-Ag-zCu Solders H. HANY. C. SOHNJIN YU OriginalPaper 09 May 2007 Pages: 578 - 586
A Preliminary Electron Backscatter Diffraction Study of Microstructures and Microtextures Evolution during Au Stud and Flip Chip Thermosonic Bonding Chun-Mei LiPing YangMing Li OriginalPaper 10 April 2007 Pages: 587 - 592
Magnetic Nanocomposite for Potential Ultrahigh Frequency Microelectronic Application Hai DongAdam MeiningerC. P. Wong Regular Issue Paper 25 April 2007 Pages: 593 - 597
Measurement of Small Specific Contact Resistance of Metals with Resistive Semiconductors DeepakHare Krishna OriginalPaper 19 April 2007 Pages: 598 - 605
Effects of Substrate Materials on Self-Formation of Ti-Rich Interface Layers in Cu(Ti) Alloy Films K. ItoS. TsukimotoM. Murakami Regular Issue Paper 10 April 2007 Pages: 606 - 613
Barrier Properties of Amorphous Binary Ta-Ni Thin Films for Cu Interconnection J.S. FangT.P. HsuH.C. Chen Regular Issue Paper 24 April 2007 Pages: 614 - 622