Foreword Sinn-wen ChenSrinivas ChadaKatsuaki Suganuma OriginalPaper 11 September 2007 Pages: 1407 - 1407
Electroless CoWP as a Diffusion Barrier between Electroless Copper and Silicon T.K. TsaiS.S. WuW.J. Chen OriginalPaper 11 September 2007 Pages: 1408 - 1414
Phase Equilibria in the Ag-Ni-Sn System: Isothermal Sections Clemens SchmettererHans FlandorferHerbert Ipser OriginalPaper Open access 25 September 2007 Pages: 1415 - 1428
Thermodynamic Calculation of Phase Equilibria in the Sn-Ag-Cu-Ni-Au System X. J. LiuC. P. WangK. Ishida OriginalPaper 26 September 2007 Pages: 1429 - 1441
Nucleation and Growth of Zinc Particles on an Aluminum Substrate in a Zincate Process Sung-Ki LeeJae-Ho LeeYoung-Ho Kim OriginalPaper 21 September 2007 Pages: 1442 - 1447
Sn-Cu Intermetallic Grain Morphology Related to Sn Layer Thickness Min-Hsien LuKer-Chang Hsieh OriginalPaper 19 September 2007 Pages: 1448 - 1454
Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness Chien Wei ChangSu Chun YangC. Robert Kao OriginalPaper 11 September 2007 Pages: 1455 - 1461
Evaluation of DC-sputtered Glassy TaCoN Thin Film for Copper Metallization Jau-Shiung FangMin-Li KeHui-Chien Chen OriginalPaper 21 September 2007 Pages: 1462 - 1468
Morphological and Microstructural Evolution of Phosphorous-Rich Layer in SnAgCu/Ni-P UBM Solder Joint Yung-Chi LinToung-Yi ShihJenq-Gong Duh OriginalPaper 11 September 2007 Pages: 1469 - 1475
Inhibiting AuSn4 Formation by Controlling the Interfacial Reaction in Solder Joints Li-Yin HsiaoGuh-Yaw JangJenq-Gong Duh OriginalPaper 06 October 2007 Pages: 1476 - 1482
Enhanced Wettability of Oxidized Copper with Lead-Free Solder by Ar-H2 Plasmas for Flip-Chip Bumping Yung-Sen LinChun-Hao ChangWei-Jhih Lin OriginalPaper 14 September 2007 Pages: 1483 - 1488
Fabrication of Mg-Based Intermetallic Compounds by Liquid Electromigration C.H. LiY.C. ChuangC.Y. Liu OriginalPaper 13 September 2007 Pages: 1489 - 1494
The Effect of Thermomigration on Phase Coarsening in a Eutectic SnPb Alloy Y.C. ChuangC.Y. Liu OriginalPaper 11 September 2007 Pages: 1495 - 1500
Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging Moon Gi ChoSung K. KangHyuck Mo Lee OriginalPaper 05 October 2007 Pages: 1501 - 1509
Fabrication of Ni Metal Mask by Electroforming Process Using Wetting Agents Jun Hyung LimEui Cheol ParkKeun Song OriginalPaper 11 September 2007 Pages: 1510 - 1515
Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High-Temperature Soldering Applications Jenn-Ming SongHsin-Yi ChuangZong-Mou Wu OriginalPaper 13 September 2007 Pages: 1516 - 1523
Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates Ching-Feng YangSinn-Wen ChenTsung-Shune Chin OriginalPaper 21 September 2007 Pages: 1524 - 1530
Electrochemical Properties of Joints Formed Between Sn-9Zn-1.5Ag-1Bi Alloys and Cu Substrates in a 3.5 wt.% NaCl Solution Chih-Yao LiuYing-Ru ChenMoo-Chin Wang OriginalPaper 11 September 2007 Pages: 1531 - 1535
Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System Sun-Kyoung SeoMoon Gi ChoHyuck Mo Lee OriginalPaper 02 October 2007 Pages: 1536 - 1544