Packaging of nanostructured microelectromechanical systems microtriode devices L. H. ChenS. Jin Special Issue Paper Pages: 1360 - 1365
Rare-earth-enabled universal solders for microelectromechanical systems and optical packaging Sungho Jin Special Issue Paper Pages: 1366 - 1370
Temperature and duration effects on microstructure evolution during copper wafer bonding K. N. ChenA. FanR. Reif Special Issue Paper Pages: 1371 - 1374
Mechanical properties of intermetallic compounds associated with Pb-free solder joints using nanoindentation J. P. LucasH. RheeK. N. Subramanian Special Issue Paper Pages: 1375 - 1383
Isothermal aging of near-eutectic Sn-Ag-Cu solder alloys and its effect on electrical resistivity B. A. CookI. E. AndersonS. K. Kang Special Issue Paper Pages: 1384 - 1391
Creep and rupture behavior of Cu wire/lead-free solder-alloy joint specimen Kepeng WuMakoto AoyamaKazuya Miyahara Special Issue Paper Pages: 1392 - 1397
The constitutive creep equation for a eutectic Sn-Ag alloy using the modified theta-projection concept Yoshiharu KariyaMasahisa OtsukaWilliam J. Plumbridge Special Issue Paper Pages: 1398 - 1402
Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints X. DengG. PiotrowskiN. Chawla Special Issue Paper Pages: 1403 - 1413
Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder F. OchoaJ. J. WilliamsN. Chawla Special Issue Paper Pages: 1414 - 1420
Lead-free ceramic ball grid array: Thermomechanical fatigue reliability Mukta FarooqCharles GoldsmithGregory Martin Special Issue Paper Pages: 1421 - 1425
Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate Chiang-Ming ChuangKwang-Lung Lin Special Issue Paper Pages: 1426 - 1431
Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders Paul LauroSung K. KangDa-Yuan Shih Special Issue Paper Pages: 1432 - 1440
Thickening kinetics of interfacial Cu6Sn5 and Cu3Sn layers during reaction of liquid tin with solid copper Robert A. GaglianoMorris E. Fine Special Issue Paper Pages: 1441 - 1447
Microstructure characterization of Sn-Ag solder joints between stud bumps and metal pads Mu-Seob ShinYoung-Ho Kim Special Issue Paper Pages: 1448 - 1454
Comparisons of experimental and computed crystal rotations caused by slip in crept and thermomechanically fatigued dual-shear eutectic Sn-Ag solder joints A. U. TelangT. R. BielerK. N. Subramanian Special Issue Paper Pages: 1455 - 1462
Compound formation for electroplated Ni and electroless Ni in the under-bump metallurgy with Sn-58Bi solder during aging Bi-Lian YoungJenq-Gong DuhGuh-Yaw Jang Special Issue Paper Pages: 1463 - 1473
Influence of Au addition on the phase equilibria of near-eutectic Sn-3.8Ag-0.7Cu Pb-free solder alloy Jae-Yong ParkRajendra KabadeViswanadham Puligandla Special Issue Paper Pages: 1474 - 1482
In-situ observation and simulation of the solidification process in soldering a small outline package with the Sn-Ag-Cu lead-free alloy Keun-Soo KimMotoharu HagaKatsuaki Suganuma Special Issue Paper Pages: 1483 - 1489
A potential drop-in replacement for eutectic Sn-Pb solder—The Sn-Zn-Ag-Al-Ga solder Kwang-Lung LinKang-I ChenPo-Cheng Shi Special Issue Paper Pages: 1490 - 1495
Microstructure and thermal behavior of Sn-Zn-Ag solders Kwang-Lung LinChia-Ling Shih Special Issue Paper Pages: 1496 - 1500
Resonant vibration behavior of lead-free solders J. M. SongT. S. LuiD. Y. Tsai Special Issue Paper Pages: 1501 - 1508
Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip package Chien-Sheng HuangJenq-Gong DuhYen-Ming Chen Special Issue Paper Pages: 1509 - 1514
Electromigration studies on Sn(Cu) alloy lines C. C. LuS. J. WangC. Y. Liu Special Issue Paper Pages: 1515 - 1522
Efficiency enhancement of InGaN/GaN light-emitting diodes with a back-surface distributed bragg reflector Y. S. ZhaoD. L. HibbardH. Liu Special Issue Paper Pages: 1523 - 1526
Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects Shinichi TerashimaYoshiharu KariyaMasamoto Tanaka Special Issue Paper Pages: 1527 - 1533
Phase-field modeling for Sn-Bi soldering Machiko OdeToshiyuki KoyamaToshio Suzuki Special Issue Paper Pages: 1534 - 1539
Properties of quad flat package joints using Sn-Zn-Bi solder with varying lead-plating materials H. IwanishiA. HiroseK. F. Kobayashi Special Issue Paper Pages: 1540 - 1546
