1. Low-resistance and thermally stable Pd/Ru ohmic contacts to p-type GaN

   • Ja-Soon Jang
   • Chang-Won Lee
   • I. T. Ferguson

   Regular Issue Paper Pages: 903 - 906

2. Phase equilibria and solidification properties of Sn-Cu-Ni alloys

   • Chih-Hao Lin
   • Sinn-Wen Chen
   • Chao-Hong Wang

   Regular Issue Paper Pages: 907 - 915

3. Electrical characterization of isotropic conductive adhesive under mechanical loading

   • Zhimin Mo
   • Xitao Wang
   • Johan Liu

   Regular Issue Paper Pages: 916 - 920

4. The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements

   • C. M. L. Wu
   • D. Q. Yu
   • L. Wang

   Regular Issue Paper Pages: 921 - 927

5. Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys

   • C. M. L. Wu
   • D. Q. Yu
   • L. Wang

   Regular Issue Paper Pages: 928 - 932

6. Effect of heating on the electrical resistivity of conductive adhesive and soldered joints

   • Kyu Dong Kim
   • D. D. L. Chung

   Regular Issue Paper Pages: 933 - 939

7. The thermal property of lead-free Sn-8.55Zn-1Ag-XAl solder alloys and their wetting interaction with Cu

   • Shou Chang Cheng
   • Kwang Lung Lin

   Regular Issue Paper Pages: 940 - 945

8. Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints

   • J. G. Lee
   • F. Guo
   • J. P. Lucas

   Regular Issue Paper Pages: 946 - 952

9. Evaluation of the mechanical properties of a ternary Sn-20In-2.8Ag solder

   • M. S. Yeh

   Regular Issue Paper Pages: 953 - 956

10. Electrical properties of carbon nitride thin films: Role of morphology and hydrogen content

    • E. Broitman
    • N. Hellgren
    • L. Hultman

    Letter Pages: L11 - L15