Degradation mechanism of ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposure M. YamashitaK. Suganuma Special Issue Paper Pages: 551 - 556
A thermodynamic study of phase equilibria in the Au-Sb-Sn solder system Jong Hoon KimSang Won JeongHyuck Mo Lee Special Issue Paper Pages: 557 - 563
Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder Zhidong XiaZhigang ChenNa Sun Special Issue Paper Pages: 564 - 567
A comparison of graphite and AlN caps used for annealing ion-implanted SiC K. A. JonesM. A. DerengeR. D. Vispute Special Issue Paper Pages: 568 - 575
Kinetics of intermetallic formation at Sn-37Pb/Cu interface during reflow soldering Jong-Hyun LeeYong-Seog Kim Special Issue Paper Pages: 576 - 583
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni C. E. HoR. Y. TsaiC. R. Kao Special Issue Paper Pages: 584 - 590
Controlled vapor-pressure heat-treatment effect on deep levels in liquid-encapsulated czochralski-grown GaP crystals T. J. YuT. TannoJ. Nishizawa Special Issue Paper Pages: 591 - 596
Effects of alloying elements on cobalt silicide formation C. LavoieC. Cabral Jr.J. M. E. Harper Special Issue Paper Pages: 597 - 609
Feasibility of an Ag-alloy film as a thin-film transistor liquid-crystal display source/drain material C. O. JeongN. S. RohJ. G. Lee Special Issue Paper Pages: 610 - 614
Optical and electrochromic properties of annealed lithium-molybdenum-bronze thin films Zahid Hussain Special Issue Paper Pages: 615 - 630
Micro-raman investigation of the n-dopant distribution in lateral epitaxial overgrown GaN/sapphire (0001) V. V. ChaldyshevFred H. PollakI. Ferguson Special Issue Paper Pages: 631 - 634
Fabrication of self-aligned graded junction termination extensions with applications to 4H-SiC P-N diodes J. N. MerrettT. Isaacs-SmithJ. R. Williams Special Issue Paper Pages: 635 - 639
Phase identification and growth kinetics of the intermetallic compounds formed during in-49Sn/Cu soldering reactions T. H. ChuangC. L. YuS. S. Wang Special Issue Paper Pages: 640 - 645
Low-temperature air-fireable glass-free metallic thick-film electrical conductor materials Zongrong LiuD. D. L. Chung Special Issue Paper Pages: 646 - 647