1. Deposition and characterization of Pb TiO₃ thin films on silicon wafers using metalorganic sources

   • Cheol Seong Hwang
   • Hyeong Joon Kim

   Regular Issue Paper Pages: 707 - 716

2. Characterization of TiN/TiSi₂ bilayer for application to ULSI

   • Cheol-Jin Lee
   • Yung-Kwon Sung

   Regular Issue Paper Pages: 717 - 723

3. Defects in III–V materials and the accommodation of strain in layered semiconductors

   • Bruce Steiner
   • James Comas
   • Krishna Rajan

   Regular Issue Paper Pages: 725 - 738

4. Phonon-resolved and broad photoluminescence in strained Si_1−xGe_x alloy MBE layers

   • J. -P. Noël
   • N. L. Rowell
   • D. D. Perovic

   Regular Issue Paper Pages: 739 - 743

5. Improved efficiency in polymer light-emitting diodes using air-stable electrodes

   • S. Aratani
   • C. Zhang
   • A. J. Heeger

   Regular Issue Paper Pages: 745 - 749

6. Convection heat transfer from a hybrid circuit

   • F. Sarvar
   • P. A. Witting
   • N. J. Poole

   Regular Issue Paper Pages: 751 - 754

7. Development of high-quantum-efficiency, lattice-mismatched, 1.0-eV GaInAs solar cells

   • J. C. Schultz
   • M. E. Klausmeier-Brown
   • K. M. Jones

   Regular Issue Paper Pages: 755 - 761

8. Fabrication of ultrathin SOI by SIMOX water bonding (SWB)

   • Q. -Y. Tong
   • U. Gösele

   Regular Issue Paper Pages: 763 - 768

9. The formation and growth of intermetallics in composite solder

   • Yujing Wu
   • Jennifer A. Sees
   • Russell F. Pinizzotto

   Regular Issue Paper Pages: 769 - 777

10. Micro-raman characterization of molecular-beam epitaxial ge heterolayers on Si substrates

    • M. Ichimura
    • Y. Moriguchi
    • A. Sasaki

    Regular Issue Paper Pages: 779 - 784

11. Effect of rapid thermally nitrided titanium films contacting silicided and nonsilicided junctions

    • S. Chittipeddi
    • C. M. Dziuba
    • B. Rambabu

    Regular Issue Paper Pages: 785 - 791

12. Molecular beam epitaxial growth of Si_1−xGe_x/Si pseudomorphic layers using disilane and germanium

    • S. H. Li
    • P. K. Bhattacharya
    • E. Gulari

    Letter Pages: 793 - 795

13. Out-of-plane thermal expansion coefficient of biphenyldianhydride-phenylenediamine polyimide film

    • S. T. Chen
    • H. H. Wagner

    Letter Pages: 797 - 799

14. 1993 Electronic Materials Conference technical program

    Abstract Pages: A1 - A51