Editorial board
Editor-In-Chief
Wojciech M. Jadwisienczak, Ohio University, Athens, OH, USA
Senior Editor
John D. Baniecki, SLAC National Accelerator Laboratory, Stanford University, Menlo Park, CA, USA
Section Editors
Dong-Hau Kuo, National Taiwan University of Science and Technology, Taipei, Taiwan
Dan Ricinschi, Tokyo Institute of Technology, Tokyo, Japan
M.T. Sebastian, CSIR - National Institute for Interdisciplinary Science & Technology, Trivandrum, India
Cheuk-Wai Tai, Arrhenius Laboratory, Stockholm University, Stockholm, Sweden
Editorial Oversight Committee
Katayun Barmak, Columbia University, New York, NY, USA
Thomas Bieler, Michigan State University, East Lansing, MI, USA
Robert Kaplar, Sandia National Laboratory, Albuquerque, NM, USA
Ioannis (John) Kymissis, Columbia University, New York, NY, USA
Yuping Zeng, University of Delaware, Newark, DE, USA
Associate Editors
III-V As and Sb Based Materials and Devices
Ganesh Balakrishnan, University of New Mexico, Albuquerque, NM, USA
Interfaces and Contacts
L.J. Brillson, The Ohio State University, Columbus, OH, USA
Complex Oxides/Superconductors, Ferroelectric and Magnetic Materials, and Solid Oxide Fuel Cells
Tomasz Brylewski, AGH University of Krakow, Krakow, Poland
Electrocatalysis, Electrochemical Energy Technologies, Nanocomposites and Antimicrobial Application
Shaowei Chen, University of California-Santa Cruz, Santa Cruz, CA, USA
Packaging and Interconnects
Sinn-wen Chen, National Tsing Hua University, Hsin-chu, Taiwan
Thermal Management and Composite Materials
Deborah Chung, University at Buffalo, Buffalo, NY, USA
Organic Optoelectronics, Organic/Perovskite Solar Cells and Microelectronics
Yu Duan, Jilin University, Changchun, China
Interconnects and Nanocharacterization
Kathleen Dunn, State University of New York Polytechnic Institute, Albany, NY, USA
Materials Integration
Kurt G. Eyink, Air Force Research Laboratory, Wright-Patterson Air Force Base (WPAFB), OH, USA
Processing and Physical Properties of Electronic Ceramics
Tsang-Tse Fang, National Cheng Kung University, Tainan City, Taiwan
Packaging and Interconnects
Darrel Frear, NXP Semiconductors, Tempe, AZ, USA
Computational Simulations and First-Principles Calculations, Structure Evolution of Clusters and 2D Nanomaterials, Mechanical, Electronic, and Nonlinear Optoelectronic and Catalyst Properties of Nanomaterials
Junfeng Gao, Dalian University of Technology, Dalian, China
Electronic and Ionic Transport in Nonionic Materials
Doo Seok Jeong, Korea Instit ute of Science and Technology, Seoul, South Korea
Modeling and Simulation of 2D Electronic Devices, Advanced MOSFETs, Organic Thin Film Devices, and Metal Oxide Nanostructures
Satyabrata Jit, Indian Institute of Technology (BHU), Varanasi, India
Phase Change Memory, Photonics and Optoelectronics
Pei-Cheng Ku, University of Michigan, Ann Arbor, MI, USA
Materials for Energy Conversion and Storage, Sensors and Transducers for Biomedical and Industrial Applications
Koko Kwok-ho Lam, University of Glasgow, Glasgow, UK
Electronic Materials and Devices, Electrooptical Material and Devices, Organic Materials and Devices, Thin-Film Materials and Devices, and Nanomaterials and Devices
Ching-Ting Lee, National Cheng Kung University, Tainan, Taiwan, Republic of China
Packaging and Interconnects
Tae-Kyu Lee, Cisco Systems, San Jose, CA, USA
Group IV-based Nanomaterials, Nanophotonics, and Nanoelectronics
Pei-Wen Li, National Yang Ming Chiao Tung University, Hsinchu, Taiwan, Republic of China
Chalcogenides, Optoelectronic Materials, Interfaces and Devices
Fangyang Liu, Central South University, Changsha, China
Charge and Heat Transport on Semiconductor-based Devices, Nanoscale Energy Conversion Devices with a Focus on Thermoelectric Materials and Devices
Ramesh Chandra Mallik, Indian Institute of Science, Bangalore, India
Solar Energy Materials, Solar Cells, and Photovoltaics
Arturo Morales-Acevedo,Centro de Investigación y de Estudios Avanzados del Instituto Politécnico Nacional (CINVESTAV-IPN), México, D. F., México
Thermoelectric Materials and Devices for Power Generation and Cooling
Amin Nozariasbmarz, Pennsylvania State University, State College, PA, USA
Nanostructured and Nanocomposite Materials, Novel Sensors
Paul R. Ohodnicki, University of Pittsburgh, Pittsburgh, PA, USA
III-V and II-VI Optoelectronic Devices
Jens W. Tomm, Max-Born-Institute, Berlin, Germany
Theoretical and Computational Materials Science, Materials Informatics, Materials Discovery and Design
Huan Tran, Georgia Institute of Technology, Atlanta, GA, USA
Ferroelectric Ceramics and Glass-ceramics
Rahul Vaish, Indian Institute of Technology, Mandi, India
Crystalline and Amorphous Oxide Semiconductors and Devices, Combinatorial Material Science
Holger von Wenckstern, Universität Leipzig, Leipzig, Germany
Graphene/2D Materials; Chalcogenides; Electronic Materials for Energy Including Electrochemical and Photo-catalytic Applications
Xinhui Xia, Zhejiang University, Hangzhou, China
Luminescence and Related Phenomena in WBG Semiconductors, Phosphors and Mechanisms of Many-Body Luminescence, PV, and Photonics
Shijie Xu, The University of Hong Kong, Hong Kong, China
Theoretical and Computational Physics and Chemistry, Electronic Materials for Energy Including Electrochemical and Photo-Catalytic Applications
Rui-Qin Zhang, City University of Hong Kong, Kowloon, Hong Kong SAR, China