1. Copper Wire Bonding Concerns and Best Practices

   • Preeti Chauhan
   • Z. W. Zhong
   • Michael Pecht

   ReviewPaper 08 May 2013 Pages: 2415 - 2434

2. Influence of Interference on Extraction Efficiency of Ultraviolet Vertical Light-Emitting Diodes

   • Seung Hwan Kim
   • Young Ho Song
   • Hyung Jo Park

   BriefCommunication 25 May 2013 Pages: 2435 - 2438

3. Investigation of Characteristics of Al₂O₃/n-In _x Ga_1−x As (x = 0.53, 0.7, and 1) Metal–Oxide–Semiconductor Structures

   • Hai-Dang Trinh
   • Yueh-Chin Lin
   • David Hwang

   BriefCommunication 29 May 2013 Pages: 2439 - 2444

4. Thick In _x Ga_1−x N Films Prepared by Reactive Sputtering with Single Cermet Targets

   • Cheng-Che Li
   • Dong-Hau Kuo
   • Ying-Sheng Huang

   BriefCommunication 11 June 2013 Pages: 2445 - 2449

5. Dynamical X-ray Diffraction from In _x Ga_1−x As Heterostructures with Dislocations

   • P. B. Rago
   • J. E. Ayers

   OriginalPaper 09 May 2013 Pages: 2450 - 2458

6. Effects of Growth Temperature and Annealing on Properties of Zn₃Sn₂O₇ Thin Films and Application in TFTs

   • Yong-Yue Chen
   • Xi-Kun Cai
   • Hui-Zhen Wu

   OriginalPaper 30 April 2013 Pages: 2459 - 2463

7. Improvement of the Crystallinity of Silicon Films Deposited by Hot-Wire Chemical Vapor Deposition with Negative Substrate Bias

   • Lei Zhang
   • Honglie Shen
   • Jiayi You

   OriginalPaper 25 May 2013 Pages: 2464 - 2469

8. Improvement in the Bias Stability of Zinc-Tin Oxide Thin-Film Transistors by Hafnium Doping

   • Dong-Suk Han
   • Jae-Hyung Park
   • Jong-Wan Park

   OriginalPaper 25 May 2013 Pages: 2470 - 2477

9. Comparison of Phase Shifting Techniques for Measuring In-Plane Residual Stress in Thin, Flat Silicon Wafers

   • R. G. R. Prasath
   • K. Skenes
   • S. Danyluk

   OriginalPaper 07 June 2013 Pages: 2478 - 2485

10. Structural and Carrier Dynamics of GaN and AlGaN-Based Double Heterostructures in the UV Region

    • Ponnusamy Arivazhagan
    • Raju Ramesh
    • Krishnan Baskar

    OriginalPaper 11 June 2013 Pages: 2486 - 2491

11. Theoretical Study on Structural Stability of Fully Filled p-Type Skutterudites RETM₄Sb₁₂ (RE = Rare Earth; TM = Fe, Ru)

    • Zhuo Chen
    • Jiong Yang
    • Jihui Yang

    OriginalPaper 30 April 2013 Pages: 2492 - 2497

12. Heraclenin: A Potential Optoelectronic Device Material from Prangos pabularia

    • Javid A. Banday
    • Ghulam M. Bhat
    • Tej K. Razdan

    OriginalPaper 04 May 2013 Pages: 2498 - 2503

13. Atomistic Simulation of Strain-Induced Domain Evolution in a Uniaxially Compressed BaTiO₃ Single-Crystal Nanofilm

    • Xiao Bao Tian
    • Xin Hua Yang
    • Wei Zhong Cao

    OriginalPaper 30 April 2013 Pages: 2504 - 2509

14. Resistive Switching Properties of Sol–Gel-Derived V-Doped SrTiO₃ Thin Films

    • Zhen Hua Tang
    • Ying Xiong
    • Long Hai Wang

    OriginalPaper 30 April 2013 Pages: 2510 - 2515

15. Mixed-Alkali Effect in Li₂O–Na₂O–K₂O–B₂O₃ Glasses: Infrared and Optical Absorption Studies

    • M.A. Samee
    • A. Edukondalu
    • Syed Rahman

    OriginalPaper 07 May 2013 Pages: 2516 - 2524

16. Ultrafast UV-Curable Adhesives for Optical Pick-Ups

    • Chang-Kyu Chung
    • Kyung-Woon Jang
    • Chulho Jeon

    OriginalPaper 24 May 2013 Pages: 2525 - 2535

17. Structure and Optical Properties of CeO₂ Nanoparticles Synthesized by Precipitation

    • I-Tsan Liu
    • Min-Hsiung Hon
    • Lay Gaik Teoh

    OriginalPaper 25 May 2013 Pages: 2536 - 2541

18. Low-Temperature Sintering of Ba_0.5Sr_0.5TiO₃-SrMoO₄ Dielectric Tunable Composite Ceramics for LTCC Applications

    • Linjiang Tang
    • Jinwen Wang
    • Jiwei Zhai

    OriginalPaper 25 May 2013 Pages: 2542 - 2548

19. Synthesis, Structural and Optical Characterization of Sol–Gel-Derived Y-Doped Mesoporous CeO₂

    • Ying Chieh Lee
    • Kun-Dar Li
    • Ghi Wei Chiang

    OriginalPaper 06 June 2013 Pages: 2549 - 2555

20. Temperature Stability of V₂O₅-Doped KNN-LS-BF Lead-Free Piezoelectric Ceramics

    • Hua Wang
    • Xia Zhai
    • Ling Yang

    OriginalPaper 29 May 2013 Pages: 2556 - 2559

21. Quantum Theory of the Burns Temperature in Barium Titanate

    • G.D. Mahan

    OriginalPaper 11 June 2013 Pages: 2560 - 2563

22. PIN-PMN-PT Single-Crystal-Based 1–3 Piezoelectric Composites for Ultrasonic Transducer Applications

    • Lili Li
    • Zhuo Xu
    • Shaojun Long

    OriginalPaper 11 June 2013 Pages: 2564 - 2569

23. Thermoelectric Properties of Y_1−x Ag _x BaCo₄O_7+δ Ceramics

    • Q. L. He
    • J. Zhang
    • H. Z. Song

    OriginalPaper 07 June 2013 Pages: 2570 - 2573

24. Thermal Decomposition of Thermoelectric Material CoSb₃: A Thermogravimetry Kinetic Analysis

    • Fang Wu
    • Qingli He
    • Xing Hu

    OriginalPaper 08 June 2013 Pages: 2574 - 2581

25. Thermoelectric Properties of Ca_3−x Dy _x Co₄O_9+δ with x = 0.00, 0.02, 0.05, and 0.10

    • Ankam Bhaskar
    • C.-S. Jhang
    • Chia-Jyi Liu

    OriginalPaper 11 June 2013 Pages: 2582 - 2586

26. Dielectric and Pyroelectric Properties of La- and Pr-Modified Tungsten-Bronze Ferroelectrics

    • B. N. Parida
    • Piyush R. Das
    • R. N. P. Choudhary

    OriginalPaper 11 June 2013 Pages: 2587 - 2594

27. A Facile Synthesis of a Palladium-Doped Polyaniline-Modified Carbon Nanotube Composites for Supercapacitors

    • Soumen Giri
    • Debasis Ghosh
    • Chapal Kumar Das

    OriginalPaper 27 April 2013 Pages: 2595 - 2605

28. Modeling the Rate-Dependent Durability of Reduced-Ag SAC Interconnects for Area Array Packages Under Torsion Loads

    • Vikram Srinivas
    • Sandeep Menon
    • Michael G. Pecht

    OriginalPaper 26 April 2013 Pages: 2606 - 2614

29. Thermodynamic Assessment of the In-Ni-Sb System and Predictions for Thermally Stable Contacts to InSb

    • Zhanmin Cao
    • Wei Xie
    • Zhiyu Qiao

    OriginalPaper 07 May 2013 Pages: 2615 - 2629

30. A Feature-Scale Greenwood–Williamson Model for Metal Chemical Mechanical Planarization

    • Qinzhi Xu
    • Lan Chen

    OriginalPaper 01 May 2013 Pages: 2630 - 2640

31. Microstructure Evolution of Cu-Cored Sn Solder Joints Under High Temperature and High Current Density

    • Xianzhang Sa
    • Ping Wu

    OriginalPaper 04 May 2013 Pages: 2641 - 2647

32. Effect of Thickness and Phosphorus Content on Au/Pd/Ni(P) Metal Finish of Printed Circuit Board

    • Chih-Kai Huang
    • Keh-Wen Lin
    • Meng-Hui Li

    OriginalPaper 25 May 2013 Pages: 2648 - 2657

33. Phase-Field Modeling and Experimental Observation of Microstructures in Solidifying Sn-Ag-Cu Solders

    • G.J. Schmitz
    • B. Zhou
    • J. Villain

    OriginalPaper 25 May 2013 Pages: 2658 - 2666

34. Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates

    • Ahmed Sharif
    • Jun zhang Lim
    • Zhong Chen

    OriginalPaper 25 May 2013 Pages: 2667 - 2676

35. Kinetics of Dissolution and Isothermal Solidification for Gold-Enriched Solid–Liquid Interdiffusion (SLID) Bonding

    • Rogie I. Rodriguez
    • Dimeji Ibitayo
    • Pedro O. Quintero

    OriginalPaper 11 June 2013 Pages: 2677 - 2685

36. A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified Sn-3.5Ag Lead-Free Solder

    • Hai-Tao Ma
    • Jie Wang
    • A. Kunwar

    OriginalPaper 01 June 2013 Pages: 2686 - 2695

37. Spreading Behavior and Evolution of IMCs During Reactive Wetting of SAC Solders on Smooth and Rough Copper Substrates

    • Satyanarayan
    • K. N. Prabhu

    OriginalPaper 11 June 2013 Pages: 2696 - 2707

38. Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free Solder

    • Xu Chen
    • Feng Xue
    • Guotong Qian

    OriginalPaper 25 May 2013 Pages: 2708 - 2715

39. Effect of Ti Concentration on the Growth of Nb₃Sn Between Solid Nb(Ti) and Liquid Sn

    • Sangeeta Santra
    • Aloke Paul

    OriginalPaper 11 June 2013 Pages: 2716 - 2723

40. Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies

    • Ye Tian
    • Xi Liu
    • Suresh K. Sitaraman

    OriginalPaper 11 June 2013 Pages: 2724 - 2731