1. Foreword

   • Chih-ming Chen
   • Srinivas Chada
   • Chao-hong Wang

   Acknowledgments 28 August 2009 Pages: 2211 - 2211

2. Copper-Silver Alloy for Advanced Barrierless Metallization

   • C. H. Lin
   • W. K. Leau

   OriginalPaper 08 August 2009 Pages: 2212 - 2221

3. Interfacial Reactions of Sn-9Zn-xCu (x = 1, 4, 7, 10) Solders with Ni Substrates

   • Wei-kai Liou
   • Yee-Wen Yen
   • Chien-Chung Jao

   OriginalPaper 07 July 2009 Pages: 2222 - 2227

4. Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps

   • Gi-Tae Lim
   • Byoung-Joon Kim
   • Young-Bae Park

   OriginalPaper 18 August 2009 Pages: 2228 - 2233

5. Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates

   • C. C. Chang
   • Y. W. Lin
   • C. R. Kao

   OriginalPaper 30 June 2009 Pages: 2234 - 2241

6. Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging

   • Moon Gi Cho
   • Sung K. Kang
   • Hyuck Mo Lee

   OriginalPaper 30 June 2009 Pages: 2242 - 2250

7. Fifteen-Nanometer Ru Diffusion Barrier on NiSi/Si for a sub-45 nm Cu Contact Plug

   • Jia-Huei Lin
   • Jiing-Herng Lee
   • Jau-Shiung Fang

   OriginalPaper 11 August 2009 Pages: 2251 - 2256

8. Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions

   • Yee-Wen Yen
   • H. W. Tseng
   • C. Y. Liu

   OriginalPaper 19 August 2009 Pages: 2257 - 2263

9. Enhancement in Conductivity and Transmittance of Zinc Oxide Prepared by Chemical Bath Deposition

   • Wei-Hsiang Luo
   • Ting-Kan Tsai
   • Jau-Shiung Fang

   OriginalPaper 04 August 2009 Pages: 2264 - 2269

10. Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process

    • Kuan-Chih Huang
    • Fuh-Sheng Shieu
    • C. Y. Liu

    OriginalPaper 07 August 2009 Pages: 2270 - 2274

11. The Ni-rich Part of the Ni-P-Sn System: Isothermal Sections

    • C. Schmetterer
    • J. Vizdal
    • H. Ipser

    OriginalPaper 25 June 2009 Pages: 2275 - 2300

12. Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu₅Zn₈-Bearing Pb-Free Solders on a Copper Substrate

    • Inyu Jung
    • Moon Gi Cho
    • Hyuck Mo Lee

    OriginalPaper 26 June 2009 Pages: 2301 - 2307

13. In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays

    • Albert T. Wu
    • Chun-Yang Tsai
    • Ching-Shun Ku

    OriginalPaper 28 August 2009 Pages: 2308 - 2313

14. Investigation of the Interfaces in Ni-FUSI/Hf-Based/Si and Ni-FUSI/SiO₂/Si Stacks by Physical and Electrical Characterization Techniques

    • S. Y. Tan

    OriginalPaper 24 September 2009 Pages: 2314 - 2322

15. Controlled Growth of Non-Uniform Arsenic Profiles in Silicon Reduced-Pressure Chemical Vapor Deposition Epitaxial Layers

    • M. Popadić
    • T. L. M. Scholtes
    • L. K. Nanver

    OriginalPaper Open access 31 July 2009 Pages: 2323 - 2328

16. Performance Comparison of Top- and Bottom-emitting Long Wave Infrared Light Emitting Diode Devices

    • Naresh C. Das

    OriginalPaper 11 August 2009 Pages: 2329 - 2334

17. N Doping and Al-N Co-doping in Sol–Gel ZnO Films: Studies of Their Structural, Electrical, Optical, and Photoconductive Properties

    • M. Dutta
    • T. Ghosh
    • D. Basak

    OriginalPaper 11 August 2009 Pages: 2335 - 2342

18. Analysis of Dislocation Density in Pb_(1−x)Sn _x Se Grown on ZnTe/Si by MBE

    • P. J. Taylor
    • N. K. Dhar
    • W. A. Jesser

    OriginalPaper 08 August 2009 Pages: 2343 - 2347

19. Ohmic Contact to High-Aluminum-Content AlGaN Epilayers

    • Surendra Srivastava
    • Seong Mo Hwang
    • Asif Khan

    OriginalPaper 01 September 2009 Pages: 2348 - 2352

20. Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition

    • Meng Liu
    • Ai-Ping Xian

    OriginalPaper 26 August 2009 Pages: 2353 - 2361

21. Impact of Reaction Shrinkage on Stress in Semiconductor Packages

    • Manfred Mengel
    • Joachim Mahler

    OriginalPaper 29 July 2009 Pages: 2362 - 2367

22. Desmearing of FR4 Epoxy Resin Using NMP-Based Sweller

    • Yung-Chi Cheng
    • Chin-Hao Hsu
    • Meng-Hui Li

    OriginalPaper 28 July 2009 Pages: 2368 - 2375

23. Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction

    • D. R. Shirley
    • J. K. Spelt

    OriginalPaper Open access 16 September 2009 Pages: 2376 - 2387

24. Primary Creep in Sn-3.8Ag-0.7Cu Solder, Part II: Constitutive Creep Model Development and Finite Element Analysis

    • D. R. Shirley
    • J. K. Spelt

    OriginalPaper 16 September 2009 Pages: 2388 - 2397

25. Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints

    • X. N. Du
    • J. D. Guo
    • J. K. Shang

    OriginalPaper 18 August 2009 Pages: 2398 - 2404

26. Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys

    • Leonardo R. Garcia
    • Wislei R. Osório
    • Amauri Garcia

    OriginalPaper 04 August 2009 Pages: 2405 - 2414

27. Hygrothermal Effects on the Tensile Properties of Anisotropic Conductive Films

    • Yunhui Mei
    • Xu Chen
    • Hong Gao

    OriginalPaper 04 August 2009 Pages: 2415 - 2426