1. Foreword

   • Jihui Yang

   OriginalPaper 12 July 2007 Pages: 703 - 703

2. Nanostructured Thermoelectric Materials and High-Efficiency Power-Generation Modules

   • Timothy P. Hogan
   • Adam Downey
   • Eldon D. Case

   OriginalPaper 06 July 2007 Pages: 704 - 710

3. Synthesis and Thermoelectric Properties of “Nano-Engineered” CoSb₃ Skutterudite Materials

   • P.N. Alboni
   • X. Ji
   • Terry M. Tritt

   OriginalPaper 29 June 2007 Pages: 711 - 715

4. Development and Evolution of Nanostructure in Bulk Thermoelectric Pb-Te-Sb Alloys

   • Teruyuki Ikeda
   • Vilupanur A. Ravi
   • G. Jeffrey Snyder

   OriginalPaper 29 June 2007 Pages: 716 - 720

5. Solution-Chemical Syntheses of Nano-Structured Bi₂Te₃ and PbTe Thermoelectric Materials

   • X. Ji
   • B. Zhang
   • A. Kumbhar

   OriginalPaper 14 June 2007 Pages: 721 - 726

6. Thermoelectric Properties of Mo₃Sb_5.4Te_1.6 and Ni_0.06Mo₃Sb_5.4Te_1.6

   • Huqin Zhang
   • Jian He
   • Holger Kleinke

   OriginalPaper 12 June 2007 Pages: 727 - 731

7. Thermoelectric Properties of Half-Heusler Bismuthides ZrCo_1−x Ni _x Bi (x = 0.0 to 0.1)

   • V. Ponnambalam
   • Bo Zhang
   • S. Joseph Poon

   OriginalPaper 09 June 2007 Pages: 732 - 735

8. Thermoelectric Properties of Na _x CoO₂ and Prospects for Other Oxide Thermoelectrics

   • D.J. Singh
   • D. Kasinathan

   OriginalPaper 13 June 2007 Pages: 736 - 739

9. Crystal Growth, Structure, and Stoichiometry of the Superconducting Pyrochlore Cd₂Re₂O₇

   • J. He
   • R. Jin
   • Terry M. Tritt

   OriginalPaper 03 July 2007 Pages: 740 - 745

10. Thermoelectric Properties of NaCo_2–x Fe _x O _y

    • Biprodas Dutta
    • Jugdersuren Battogtokh
    • Ian L. Pegg

    OriginalPaper 19 June 2007 Pages: 746 - 752

11. Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads

    • W.H. Lin
    • Albert T. Wu
    • K.N. Tu

    OriginalPaper 07 June 2007 Pages: 753 - 759

12. Effects of Copper Doping on Microstructural Evolution in Eutectic SnBi Solder Stripes under Annealing and Current Stressing

    • Chih-Ming Chen
    • Chih-Chieh Huang
    • Kuen-Ming Liou

    OriginalPaper 12 June 2007 Pages: 760 - 765

13. Properties of Sn3.8Ag0.7Cu Solder Alloy with Trace Rare Earth Element Y Additions

    • H. Hao
    • J. Tian
    • Z.D. Xia

    OriginalPaper 19 June 2007 Pages: 766 - 774

14. Electroless Ni/Au Bump on a Copper Patterned Wafer for the CMOS Image Sensor Package in Mobile Phones

    • Joong-Do Kim

    OriginalPaper 30 May 2007 Pages: 775 - 782

15. Failure Mechanisms and Crack Propagation Paths in Thermally Aged Pb-Free Solder Interconnects

    • Eduardo Franco De Monlevade
    • Weiqun Peng

    OriginalPaper 16 June 2007 Pages: 783 - 797

16. The Role of TiO₂ in Ceramic Bulk Interference Suppressing Resistor Integrated with Car Spark Plug

    • Ewa Klimiec
    • Stanisław Nowak
    • Jerzy Stoch

    OriginalPaper 02 June 2007 Pages: 798 - 804

17. Improved Schottky Contacts on n-Type 4H-SiC Using ZrB₂ Deposited at High Temperatures

    • T.N. Oder
    • P. Martin
    • J.R. Williams

    OriginalPaper 05 June 2007 Pages: 805 - 811

18. Optical Characterization of Ag Nanoparticles Embedded in Aluminophosphate Glass

    • J.A. Jiménez
    • S. Lysenko
    • H. Liu

    OriginalPaper 30 May 2007 Pages: 812 - 820