Investigation of three-step epilayer growth approach of GaN films to minimize compensation C. R. Eddy Jr.R. T. HolmM. E. Twigg Regular Issue Paper Pages: 1187 - 1192
Ultralow-k silicon containing fluorocarbon films prepared by plasma-enhanced chemical vapor deposition Yoonyoung JinP. K. AjmeraVarshni Singh Regular Issue Paper Pages: 1193 - 1205
Local creep in SnAg3.8Cu0.7 lead-free solder Pascal P. JudGuenter GrossmannPeter J. Uggowitzer Regular Issue Paper Pages: 1206 - 1214
A modified vertical Bridgman method for growth of high-quality Cd1−xZnxTe crystals Guoqiang LiXiaolu ZhangWanqi Jie Regular Issue Paper Pages: 1215 - 1224
A CdTe passivation process for long wavelength infrared HgCdTe photo-detectors V. KumarR. PalV. Gopal Regular Issue Paper Pages: 1225 - 1229
Microstructures and degradation of heat sink very-thin quad flat package no-leads Pb-free Sn-Ag-Cu solder joints after thermal aging W. Fredriksz Regular Issue Paper Pages: 1230 - 1241
Threading dislocation removal from the near-surface region of epitaxial cadmium telluride on silicon by lithographic patterning of the substrate J. C. MolstadJ. D. BensonJ. H. Dinan Regular Issue Paper Pages: 1242 - 1248
Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering Jenn-Ming SongPei-Chi LiuKwang-Lung Lin Regular Issue Paper Pages: 1249 - 1254
Pastes for electromagnetic interference shielding Junhua WuD. D. L. Chung Regular Issue Paper Pages: 1255 - 1258
Characterization of physical and electrical properties of BaTiO3 films deposited on p-Si by modified polymeric precursors N. KonofaosZhongchun WangE. K. Evangelou Regular Issue Paper Pages: 1259 - 1263
A study on the temperature dependence of epoxy/BaTiO3 composite embedded capacitor films Jin-Gul HyunSung-Dong ChoKyung-Wook Paik Regular Issue Paper Pages: 1264 - 1269
Observed correlation of Sn oxide film to Sn whisker growth in Sn-Cu electrodeposit for Pb-free solders K. -W. MoonC. E. JohnsonW. J. Boettinger Letter Pages: L31 - L33
