1. Foreword

   • N. M. Ravindra
   • Choong-Un Kim
   • Seung H. Kang

   Special Issue Paper Pages: 467 - 467

2. Ion beam mixing of silicon-germanium thin films

   • Sufian Abedrabbo
   • D. -E. Arafah
   • S. Salem

   Special Issue Paper Pages: 468 - 473

3. Fluxon pinning in the nodeless pairing state of superconducting YBa₂Cu₃O₇

   • A. T. Fiory
   • D. R. Harshman
   • John D. Dow

   Special Issue Paper Pages: 474 - 483

4. Silicon-integrated uncooled infrared detectors: Perspectives on thin films and microstructures

   • V. R. Mehta
   • S. Shet
   • M. P. Lepselter

   Special Issue Paper Pages: 484 - 490

5. Novel pulsed-laser-deposition—VO₂ thin films for ultrafast applications

   • H. Liu
   • O. Vasquez
   • F. E. Fernandez

   Special Issue Paper Pages: 491 - 496

6. Analysis of thermal stresses in copper interconnect/low-k dielectric structures

   • Y. -L. Shen

   Special Issue Paper Pages: 497 - 505

7. Textural and microstructural transformation of Cu damascene interconnects after annealing

   • Jae-Young Cho
   • Hyo-Jong Lee
   • Jerzy A. Szpunar

   Special Issue Paper Pages: 506 - 514

8. Some silicon-based heterostructures for optical applications

   • M. Willander
   • Q. X. Zhao
   • Q. -H. Hu

   Special Issue Paper Pages: 515 - 521

9. Modeling and experiments on epitaxially grown multilayers with implications to critical thickness

   • Ganesh Vanamu
   • Joshua Robbins
   • Saleem H. Zaidi

   Special Issue Paper Pages: 522 - 527

10. Microstructure and mechanical properties of ceramic/self-assembled monolayer bilayer coatings

    • K. Chitre
    • Q. Yang
    • J. Cho

    Special Issue Paper Pages: 528 - 533

11. Toward a better understanding of synthesis and processing of ceramic/self-assembled monolayer bilayer coatings

    • T. O. Salami
    • Q. Yang
    • S. R. J. Oliver

    Special Issue Paper Pages: 534 - 540

12. Fabrication of potential NiMoP diffusion barrier/seed layers for Cu interconnects via electroless deposition

    • Y. Wu
    • C. C. Wan
    • Y. Y. Wang

    Special Issue Paper Pages: 541 - 550

13. Characterization of environmental stability of pulsed laser deposited oxide ceramic coatings

    • Thad M. Adams
    • Andrew J. Duncan
    • James Fitz-Gerald

    Special Issue Paper Pages: 551 - 558

14. Three-dimensional simulation of microstructure evolution in damascene interconnects: Effect of overburden thickness

    • Jung-Kyu Jung
    • Nong-Moon Hwang
    • Young-Chang Joo

    Special Issue Paper Pages: 559 - 563

15. Dielectric films for Si solar cell applications

    • Bhushan Sopori

    Special Issue Paper Pages: 564 - 570

16. Progress in crystalline multijunction and thin-film photovoltaics

    • Donna Cowell Senft

    Special Issue Paper Pages: 571 - 574

17. Surface modification of ferrous alloys with boron

    • Roumiana S. Petrova
    • Naruemon Suwattananont

    Special Issue Paper Pages: 575 - 582

18. Numerical simulation of thermal wave propagation during laser processing of thin films

    • X. Ai
    • B. Q. Li

    Special Issue Paper Pages: 583 - 591

19. Formation of Ti diffusion barrier layers in Thin Cu(Ti) alloy films

    • S. Tsukimoto
    • T. Morita
    • Masanori Murakami

    Special Issue Paper Pages: 592 - 599

20. Novel interconnection method using electrically conductive paste with fusible filler

    • Jong-Min Kim
    • Kiyokazu Yasuda
    • Kozo Fujimoto

    Special Issue Paper Pages: 600 - 604

21. Investigation of microstructure and V-defect formation in In_xGa_1−xN/GaN MQW grown using temperature-gradient metalorganic chemical vapor deposition

    • M. C. Johnson
    • Z. Liliental-Weber
    • E. D. Bourret-Courchesne

    Special Issue Paper Pages: 605 - 611

22. Study of threading dislocations in the plan-view sample of SiGe/Si(001) superlattices by transmission electron microscopy

    • Yusuf Atici

    Special Issue Paper Pages: 612 - 616

23. The anomalous microstructural, tensile, and aging response of thin-cast Sn3.9Ag0.6Cu lead-free solder

    • Qiang Xiao
    • Luu Nguyen
    • William D. Armstrong

    Special Issue Paper Pages: 617 - 624

24. Thermal and Mechanical stability of electrically conductive adhesive joints

    • Jun Xiao
    • D. D. L. Chung

    Special Issue Paper Pages: 625 - 629

25. Fluxless fabrications of Sn-Au solder microbumps by a hydrogen plasma reflow technique

    • Takao Ishii
    • Shinji Aoyama

    Special Issue Paper Pages: 630 - 634

26. Oxidation study of pure tin and its alloys via electrochemical reduction analysis

    • Sungil Cho
    • Jin Yu
    • Da-Yuan Shih

    Special Issue Paper Pages: 635 - 642

27. The effects of boron in the Cu(B)/Ti/SiO₂ system on the Cu-Ti reaction, resistivity, and diffusion barrier properties

    • H. J. Yang
    • S. Lee
    • J. G. Lee

    Special Issue Paper Pages: 643 - 646

28. Encapsulation of lead-free Sn/Zn/Bi solder alloy particles by coating with wax powder for improving oxidation resistance

    • Tomohiro Iwasaki
    • Jeong Hwan Kim
    • Munetake Satoh

    Special Issue Paper Pages: 647 - 654

29. Molecular beam epitaxial growth and characterization of Cd-based II–VI wide-bandgap compounds on Si substrates

    • G. Brill
    • Y. Chen
    • N. K. Dhar

    Special Issue Paper Pages: 655 - 661

30. Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization

    • M. N. Islam
    • Y. C. Chan

    Special Issue Paper Pages: 662 - 669

31. Experimental investigation and thermodynamic calculation of phase equilibria in the Sn-Au-Ni system

    • X. J. Liu
    • M. Kinaka
    • K. Ishida

    Special Issue Paper Pages: 670 - 679

32. Nanostructured thermoelectric materials

    • T. C. Harman
    • M. P. Walsh
    • G. W. Turner

    Letter Pages: L19 - L22