1. Self-assembly of metal nanocrystals on ultrathin oxide for nonvolatile memory applications

   • Chungho Lee
   • Jami Meteer
   • Edwin C. Kan

   Regular Issue Paper Pages: 1 - 11

2. The effects of bath composition on the morphologies of electroless nickel under-bump metallurgy on Al input/output pad

   • J. H. Lee
   • I. G. Lee
   • S. Y. Oh

   Regular Issue Paper Pages: 12 - 18

3. Uniform Cr²⁺ doping of physical vapor transport grown CdS_xSe_1−x crystals

   • U. N. Roy
   • O. S. Babalola
   • A. Burger

   Regular Issue Paper Pages: 19 - 22

4. A GeSi-buffer structure for growth of high-quality GaAs epitaxial layers on a Si substrate

   • Edward Y. Chang
   • Tsung-Hsi Yang
   • Chun-Yen Chang

   Regular Issue Paper Pages: 23 - 26

5. Electromigration-induced failure in flip-chip solder joints

   • Y. H. Lin
   • C. M. Tsai
   • C. R. Kao

   Regular Issue Paper Pages: 27 - 33

6. The effects of oxygen, nitrogen, and hydrogen annealing on Mg acceptors in GaN as monitored by electron paramagnetic resonance spectroscopy

   • D. M. Matlock
   • M. E. Zvanut
   • Alma Wickenden

   Regular Issue Paper Pages: 34 - 39

7. Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications

   • Hai Dong
   • Kyoung-Sik Moon
   • C. P. Wong

   Regular Issue Paper Pages: 40 - 45

8. Comparative study of interfacial reactions of Sn-Ag-Cu and Sn-Ag solders on Cu pads during reflow soldering

   • Ahmed Sharif
   • Y. C. Chan

   Regular Issue Paper Pages: 46 - 52

9. Texture investigation of copper interconnects with a different line width

   • J. -Y. Cho
   • K. Mirpuri
   • J. A. Szpunar

   Regular Issue Paper Pages: 53 - 61

10. Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure

    • Qiu-Lian Zeng
    • Zhong-Guang Wang
    • J. K. Shang

    Regular Issue Paper Pages: 62 - 67

11. The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

    • Guh-Yaw Jang
    • Jenq-Gong Duh

    Regular Issue Paper Pages: 68 - 79

12. Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy

    • Young-Doo Jeon
    • Kyung-Wook Paik
    • Herbert Reichl

    Regular Issue Paper Pages: 80 - 90

13. Effect of off-orientation of seed crystal on silicon carbide (SiC) single-crystal growth on the (11\(\bar 2\)0) surface0) surface

    • Masakazu Katsuno
    • Noboru Ohtani
    • Hirokatsu Yashiro

    Regular Issue Paper Pages: 91 - 95

14. Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding

    • Jihye Lee
    • Jung H. Kim
    • Choong D. Yoo

    Regular Issue Paper Pages: 96 - 102

15. Analysis of the redeposition of AuSn₄ on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders

    • T. Laurila
    • V. Vuorinen
    • J. K. Kivilahti

    Regular Issue Paper Pages: 103 - 111

16. Correlation of in-situ reflectance spectra and resistivity of GaN/Al₂O₃ interfacial layer in metalorganic chemical vapor deposition

    • Yugang Zhou
    • Deliang Wang
    • Kei May Lau

    Regular Issue Paper Pages: 112 - 118

17. Effect of bismuth addition on sintering behavior and microwave dielectric properties of zinc titanate ceramics

    • Hsun-Chin Chen
    • Ming-Hang Weng
    • Yeong-Her Wang

    Regular Issue Paper Pages: 119 - 124

18. Multiaxial low-cycle fatigue of 63Sn-37Pb solder

    • X. Chen
    • D. Jin
    • T. Yamamoto

    Letter Pages: L1 - L6