1. Foreword

   • C. R. Kao
   • S. -W. Chen
   • D. J. Swenson

   Special Issue Paper Pages: 1057 - 1057

2. Self-assembled Au nanoparticle superlattice via a displacement reaction

   • J. C. Hu
   • P. Y. Su
   • L. J. Chen

   Special Issue Paper Pages: 1058 - 1063

3. Interface reaction between Ni and amorphous SiC

   • Sungtae Kim
   • J. H. Perepezko
   • A. S. Edelstein

   Special Issue Paper Pages: 1064 - 1070

4. Phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the sn-rich corner

   • Sinn-Wen Chen
   • Cheng-An Chang

   Special Issue Paper Pages: 1071 - 1079

5. Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates

   • G. Ghosh

   Special Issue Paper Pages: 1080 - 1091

6. Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints

   • Y. L. Lin
   • W. C. Luo
   • C. R. Kao

   Special Issue Paper Pages: 1092 - 1097

7. Microstructure and thermal expansion properties of invar-type Cu-Zn-Al shape memory alloys

   • J. J. Wang
   • T. Omori
   • K. Ishida

   Special Issue Paper Pages: 1098 - 1102

8. The nanoindentation characteristics of Cu₆Sn₅, Cu₃Sn, and Ni₃Sn₄ intermetallic compounds in the solder bump

   • Guh-Yaw Jang
   • Jyh-Wei Lee
   • Jeng-Gong Duh

   Special Issue Paper Pages: 1103 - 1110

9. Bromine- and chlorine-induced degradation of gold-aluminum bonds

   • Min-Hsien Lue
   • Chen-Town Huang
   • Ker-Chang Hsieh

   Special Issue Paper Pages: 1111 - 1117

10. Mechanism of interfacial reaction for the Sn-Pb solder bump with Ni/Cu under-bump metallization in flip-chip technology

    • Guh-Yaw Jang
    • Chien-Sheng Huang
    • Hideyuki Takahashi

    Special Issue Paper Pages: 1118 - 1129

11. Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps

    • S. J. Wang
    • H. J. Kao
    • C. Y. Liu

    Special Issue Paper Pages: 1130 - 1136

12. Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment

    • C. N. Liao
    • C. T. Wei

    Special Issue Paper Pages: 1137 - 1143

13. Under bump metallurgy study on copper/low-k dielectrics for fine pitch flip chip packaging

    • Seung Wook Yoon
    • Vaidyanathan Kripesh
    • Mahadevan K. Iyer

    Special Issue Paper Pages: 1144 - 1155

14. Effect of partial la filling on high-temperature thermoelectric properties of IrSb₃-based skutterudite compounds

    • S. W. Kim
    • Y. Kimura
    • Y. Mishima

    Special Issue Paper Pages: 1156 - 1160

15. Phase field simulations of intermetallic compound growth during soldering reactions

    • J. Y. Huh
    • K. K. Hong
    • K. T. Kim

    Special Issue Paper Pages: 1161 - 1170

16. Semiconductor-to-metallic phase transition of VO₂ by laser excitation

    • H. Liu
    • O. Vasquez
    • F. E. Fernandez

    Special Issue Paper Pages: 1171 - 1175

17. Crystallization and failure behavior of Ta-Ni nanostructured/amorphous diffusion barriers for copper metallization

    • J. S. Fang
    • T. P. Hsu
    • G. S. Chen

    Special Issue Paper Pages: 1176 - 1181

18. Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization

    • Sang-Won Kim
    • Jeong-Won Yoon
    • Seung-Boo Jung

    Special Issue Paper Pages: 1182 - 1189

19. Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder

    • Jeong-Won Yoon
    • Sang-Won Kim
    • Seung-Boo Jung

    Special Issue Paper Pages: 1190 - 1199

20. Influence of Cu addition to interface microstructure between Sn-Ag solder and Au/Ni-6P plating

    • Chi-Won Hwang
    • Katsuaki Suganuma
    • Shigeo Hashimoto

    Special Issue Paper Pages: 1200 - 1209

21. Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability

    • Hyoung-Joon Kim
    • Jong-Soo Cho
    • Kyung-Wook Paik

    Special Issue Paper Pages: 1210 - 1218

22. Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints

    • John H. L. Pang
    • Luhua Xu
    • S. L. Ngoh

    Special Issue Paper Pages: 1219 - 1226

23. The effect of microstructural and geometrical features on the reliability of ultrafine flip chip microsolder joints

    • Zhiheng Huang
    • Paul P. Conway
    • Rachel C. Thomson

    Regular Issue Paper Pages: 1227 - 1235

24. Dielectric properties of low loss Ba_6−3xNd_8+2xTi₁₈O₅₄ thin films prepared by pulsed laser deposition for microwave applications

    • Y. D. Xia
    • G. H. Shi
    • Z. G. Liu

    Regular Issue Paper Pages: 1236 - 1239

25. Capacitance-voltage characterization of pulsed plasma polymerized allylamine dielectrics for flexible polymeric field effect transistors

    • Yifan Xu
    • Paul R. Berger
    • Richard B. Timmons

    Regular Issue Paper Pages: 1240 - 1247

26. Effects of excess Bi concentration, buffered Bi₂O₃ layer, and Ta doping on the orientation and ferroelectricity of chemical-solution-deposited Bi_3.25La_0.75Ti₃O₁₂ films

    • Jian-Long Lin
    • Tian-Lin Chang
    • Wen-Tai Lin

    Regular Issue Paper Pages: 1248 - 1252