1. Mechanical strength of Sn-3.5Ag-based solders and related bondings

   • Chiang-Ming Chuang
   • Po-Cheng Shih
   • Kwang-Lung Lin

   Regular Issue Paper Pages: 1 - 6

2. The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates

   • Chiang-Ming Chuang
   • Hui-Tzu Hung
   • Kwang-Lung Lin

   Regular Issue Paper Pages: 7 - 13

3. A continuous contact resistance monitoring during the temperature ramp of anisotropic conductive adhesive film joint

   • M. A. Uddin
   • Y. C. Chan
   • M. O. Alam

   Regular Issue Paper Pages: 14 - 21

4. Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates

   • T. H. Chuang
   • H. M. Wu
   • S. F. Yen

   Regular Issue Paper Pages: 22 - 27

5. Kinetics of the Au-Ni-Sn ternary intermetallic layer redeposition at the solder/under-bump metallurgy interface during aging treatment

   • Jong-Hyun Lee
   • Jong-Whan Park
   • Yong-Seog Kim

   Regular Issue Paper Pages: 28 - 33

6. Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad

   • M. J. Chiang
   • S. Y. Chang
   • T. H. Chuang

   Regular Issue Paper Pages: 34 - 39

7. Fiber-alignment shifts in butterfly laser packaging by laser-welding technique: Measurement and finite-element method analysis

   • Y. C. Hsu
   • W. K. Huang
   • W. H. Cheng

   Regular Issue Paper Pages: 40 - 47

8. Relationship between grain structures and texture of damascene Cu lines

   • Jong-Min Paik
   • Ki-Chul Park
   • Young-Chang Joo

   Regular Issue Paper Pages: 48 - 52

9. Effect of process conditions on uniformity of velocity and wear distance of pad and wafer during chemical mechanical planarization

   • Hyoungjae Kim
   • Haedo Jeong

   Regular Issue Paper Pages: 53 - 60

10. The microstructure characterization of ultrasmall eutectic Bi-Sn solder bumps on Au/Cu/Ti and Au/Ni/Ti under-bump metallization

    • Un-Byoung Kang
    • Young-Ho Kim

    Regular Issue Paper Pages: 61 - 69

11. Microstructure and strength of bump joints in photodiode packages

    • Kyung-Seob Kim
    • Nam-Kyu Kim
    • Eui-Goo Chang

    Regular Issue Paper Pages: 70 - 75

12. Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film

    • Myung Jin Yim
    • Jin-Sang Hwang
    • Kyung-Wook Paik

    Regular Issue Paper Pages: 76 - 82

13. Thermal effects in thin copper foil

    • H. D. Merchant

    Regular Issue Paper Pages: 83 - 88

14. Indium- and tungsten-doped ZnGa₂O₄ phosphor

    • Su-Hua Yang

    Letter Pages: L1 - L4

15. TaN-TiN binary alloys and superlattices as diffusion barriers for copper interconnections

    • H. Wang
    • A. Gupta
    • J. Narayan

    OriginalPaper Pages: L5 - L5