Research on applying direct plating to additive process for printed circuit board Yi-Ying ChiangYun-Yung WangChi-Chao Wan Regular Issue Paper Pages: 1001 - 1006
The reactions between electroless Ni-Cu-P Deposit and 63Sn-37Pb flip chip solder bumps during reflow Chun-Jen ChenKwang-Lung Lin Regular Issue Paper Pages: 1007 - 1014
Developing a lead-free solder alloy Sn-Bi-Ag-Cu by mechanical alloying C. M. L. WuM. L. HuangY. C. Chan Regular Issue Paper Pages: 1015 - 1020
Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging M. L. HuangC. M. L. WuY. C. Chan Regular Issue Paper Pages: 1021 - 1026
Effect of NO annealing conditions on electrical characteristics of n-type 4H-SiC MOS capacitors H. -F. LiS. DimitrijevH. B. Harrison Regular Issue Paper Pages: 1027 - 1032
Luminescent chemically-etched porous poly-crystalline silicon on insulating substrates T. J. PeaseS. N. Ekkanath-MadathilS. C. Bayliss Regular Issue Paper Pages: 1033 - 1037
The microstructure of ultrafine eutectic Au-Sn solder joints on Cu H. G. SongJ. W. Morris Jr.M. T. McCormack Regular Issue Paper Pages: 1038 - 1046
Interfacial reactions between liquid indium and silver substrates Y. M. LiuY. L. ChenT. H. Chuang Regular Issue Paper Pages: 1047 - 1051
Sol-gel processed silica/titania/ÿ-Glycidoxypropyltrimethoxysilane composite materials for photonic applications Wenxiu QueY. ZhouC. H. Kam Regular Issue Paper Pages: 1052 - 1058
Visible light-emitting diodes grown on optimized ∇x[InxGa1−x]P/GaP epitaxial transparent substrates with controlled dislocation density Andrew Y. KimMichael E. GroenertEugene A. Fitzgerald Letter Pages: L9 - L12
Segregation of phosphorus and germanium to grain boundaries in chemical vapor deposited silicon-germanium films determined by scanning transmission electron microscopy W. QinD. G. AstT. I. Kamins Letter Pages: L13 - L17
