Phase equilibria of Sn-In based micro-soldering alloys I. OhnumaY. CuiK. Ishida Special Issue Paper Pages: 1113 - 1121
Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys K. -W. MoonW. J. BoettingerC. A. Handwerker Special Issue Paper Pages: 1122 - 1136
Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys I. OhnumaM. MiyashitaK. Ishida Special Issue Paper Pages: 1137 - 1144
Study on the soldering in partial melting state (1) analysis of surface tension and wettability Jae Yong ParkJun Seok HaJae Pil Jung Special Issue Paper Pages: 1145 - 1152
Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering Jong-Hyun LeeDaejin ParkYong-Seog Kim Special Issue Paper Pages: 1153 - 1159
Flux development for lead-free solders containing zinc S. VaynmanM. E. Fine Special Issue Paper Pages: 1160 - 1163
The effect of solder paste residues on RF signal integrity Laura J. TurbiniBrian A. SmithJürgen Gamalski Special Issue Paper Pages: 1164 - 1169
Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization A. M. MinorJ. W. Morris Jr. Special Issue Paper Pages: 1170 - 1174
Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish C. E. HoR. ZhengC. R. Kao Special Issue Paper Pages: 1175 - 1181
A comparative study of the kinetics of interfacial reaction between eutectic solders and Cu/Ni/Pd metallization G. Ghosh Special Issue Paper Pages: 1182 - 1193
Reactions of lead-free solders with CuNi metallizations T. M. KorhonenP. SuC. -Y. Li Special Issue Paper Pages: 1194 - 1199
Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate C. ChenC. E. HoC. R. Kao Special Issue Paper Pages: 1200 - 1206
Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate Won Kyoung ChoiHyuck Mo Lee Special Issue Paper Pages: 1207 - 1213
Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure S. ChadaR. A. FournelleD. Shangguan Special Issue Paper Pages: 1214 - 1221
Electromigration effect upon the Zn/Ni and Bi/Ni interfacial reactions Chih-Ming ChenSinn-Wen Chen Special Issue Paper Pages: 1222 - 1228
Ag and Cu migration phenomena on wire-bonding Ker-Chang HsiehTheo Martens Special Issue Paper Pages: 1229 - 1232
Interfacial reaction and solder joint reliability of Pb-free solders in lead frame chip scale packages (LF-CSP) Seung Wook YoonChang Jun ParkHeung Sup Chun Special Issue Paper Pages: 1233 - 1240
Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders F. GuoS. ChoiK. N. Subramanian Special Issue Paper Pages: 1241 - 1248
Thermomechanical fatigue behavior of Sn-Ag solder joints S. ChoiK. N. SubramanianT. R. Bieler Special Issue Paper Pages: 1249 - 1257
Analysis of ring and plug shear strengths for comparison of lead-free solders J. C. FoleyA. GicklerD. Brown Special Issue Paper Pages: 1258 - 1263
Reliability of composite solder bumps produced by an in-situ process Jong-Hyun LeeDaejin ParkYong-Seog Kim Special Issue Paper Pages: 1264 - 1269
Correction factors for area array alpha detectors M. W. Roberson Special Issue Paper Pages: 1270 - 1273
Conversion between standard and low-alpha lead in solder bumping production lines M. W. RobersonP. A. DeaneS. Nangalia Special Issue Paper Pages: 1274 - 1277
Characterization of electroplated bismuth-tin alloys for electrically conducting materials S. K. KangS. BuchwalterC. Tsang Special Issue Paper Pages: 1278 - 1283
Ensuring the reliability of alpha counting Guenter Schindlbeck Special Issue Paper Pages: 1284 - 1289
Clean galena, contaminated lead, and soft errors in memory chips G. I. LykkenJ. HustoftB. Momcilovic Special Issue Paper Pages: 1290 - 1293
The “Discovery” of alpha activity in lead and solder Ron Brodzinski Special Issue Paper Pages: 1294 - 1298
High purity InxGa1−xSb single crystals with cutoff wavelength of 7–8 µm grown by melt epitaxy Yu Zhu GaoHirofumi KanTomuo Yamaguchi Letter Pages: L25 - L27
