Volume 53, Issue 1 | Russian Microelectronics

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Volume 53, Issue 1

February 2024

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11 articles in this issue

Modeling of the Electronic Properties of M-Doped Supercells Li₄Ti₅O₁₂–M (М = Zr, Nb) with a Monoclinic Structure for Lithium-Ion Batteries
M. M. Asadov
S. O. Mammadova
V. F. Lukichev
OriginalPaper 04 May 2024 Pages: 1 - 13
Simulation of the Physical-Chemical and Electronic Properties of Lithium-Containing 4H–SiC and Binary Phases of the Si–C–Li System
M. M. Asadov
S. S. Huseinova
V. F. Lukichev
OriginalPaper 04 May 2024 Pages: 14 - 34
Application of Spectral Ellipsometry for Dielectric, Metal, and Semiconductor Films in Microelectronics Technology
R. A. Gaidukasov
A. V. Miakonkikh
OriginalPaper 04 May 2024 Pages: 35 - 43
Electron Transport in a Bipolar Transistor with a Superlattice in the Emitter
O. L. Golikov
I. Yu. Zabavichev
S. V. Khazanova
OriginalPaper 04 May 2024 Pages: 44 - 50
Analysis of Nonlinear Distortions of DpHEMT Structures Based on a GaAs/In_0.53Ga_0.47As Compound with Double-Sided Delta-Doping
O. L. Golikov
N. E. Kodochigov
S. V. Khazanova
OriginalPaper 04 May 2024 Pages: 51 - 56
Features of Electroforming and Functioning of Memristors Based on Open TiN–SiO₂–Mo Sandwich Structures
E. S. Gorlachev
V. M. Mordvintsev
S. E. Kudryavtsev
OriginalPaper 04 May 2024 Pages: 57 - 64
Molecular Layering of an Additive Layer of Silicon Dioxide on Anodized Tantalum and Niobium Oxides
Yu. K. Ezhovskii
S. V. Mikhailovskii
OriginalPaper 04 May 2024 Pages: 65 - 69
Parameters and Composition of Plasma in a CF₄ + H₂ + Ar Mixture: Effect of CF₄/H₂ Ratio
A. V. Miakonkikh
V. O. Kuzmenko
K. V. Rudenko
OriginalPaper 04 May 2024 Pages: 70 - 78
Structuring of the Surface of Thin Carbon Films during Activation by Microsecond Current Pulses
D. V. Nefedov
N. O. Shabunin
D. N. Bratashov
OriginalPaper 04 May 2024 Pages: 79 - 84
Research on Memristor Effect in Crossbar Architecture for Neuromorphic Artificial Intelligence Systems
V. V. Polyakova
A. V. Saenko
A. V. Kovalev
OriginalPaper 04 May 2024 Pages: 85 - 90
Materials for Interconnections of Integrated Circuits with Design Standards Less Than 5 nm
A. E. Rogozhin
O. G. Glaz
OriginalPaper 04 May 2024 Pages: 91 - 103