Diluted magnetic semiconductors: Actual structure and magnetic and transport properties M. A. ChuevB. A. AronzonO. V. Vikhrova IC Characterization 19 January 2011 Pages: 73 - 88
Microwave method for SOS quality testing P. A. BorodovskiiA. F. BuldyginV. A. Samoilov Materials Characterization 19 January 2011 Pages: 89 - 97
Achieving sub-1.6-nm resolutions of a low-voltage microscopic focused-ion-beam system not involving aberration correction V. A. Zhukov Materials Characterization 19 January 2011 Pages: 98 - 106
Flip-chip bump-lead fabrication: A review V. V. ZeninE. P. NovokreshchenovaO. V. Khishko Micro-and Nanofabrication Technologies 19 January 2011 Pages: 107 - 113
Silicon readout ICs for third-generation 2D IR focal-plane arrays operating over the wavelength range 8–12 μm I. I. Lee Solid-State Devices and Circuits 19 January 2011 Pages: 114 - 120
Radiation effects in a BiCMOS LSI interface transceiver A. I. BelousYu. V. BogatyrevS. V. Shvedov Hardness Assurance: Methods and Results 19 January 2011 Pages: 121 - 130
New approach to the mathematical modeling of thermal regimes for electronic equipment G. V. KuznetsovM. A. Sheremet Circuits and Systems 19 January 2011 Pages: 131 - 138