1. EPR investigation of plasma-chemical resist etching in O₂ and O₂/CF₄ discharges

   • F. -W. Breitbarth
   • E. Ducke
   • H. -J. Tiller

   OriginalPaper Pages: 377 - 399

2. Deposition of silicon nitride thin films by reaction of SiH₄ in a nitrogen post-discharge

   • J. L. Jauberteau
   • D. Conte
   • A. Catherinot

   OriginalPaper Pages: 401 - 417

3. Electron kinetics in a collision-dominated SiH₄ rf plasma including self-consistent rf field strength calculation

   • R. Winkler
   • M. Capitelli
   • J. Wilhelm

   OriginalPaper Pages: 419 - 442

4. Catalytic activity of silica in ozone formation in electrical discharges

   • Kzysztof Schmidt-Szałowski
   • Anna Borucka
   • Sławomir Jodzis

   OriginalPaper Pages: 443 - 450

5. Plasma polymerization anda-C:H film ablation in microwave discharges in methane diluted with argon and hydrogen

   • R. N. Rudolph
   • J. H. Moore

   OriginalPaper Pages: 451 - 471

6. Nonequilibrium modeling of low-pressure argon plasma jets; Part I: Laminar flow

   • C. H. Chang
   • E. Pfender

   OriginalPaper Pages: 473 - 491

7. Nonequilibrium modeling of low-pressure argon plasma jets; Part II: Turbulent flow

   • C. H. Chang
   • E. Pfender

   OriginalPaper Pages: 493 - 500