A novel method of processing pulse echo data in adhesive bond inspection E. SegalP. DicksteinH. Dodiuk OriginalPaper Pages: 1 - 17
Estimating the depth and width of arbitrarily-oriented disbonds in laminates using shearography H. M. ShangF. S. ChauS. L. Toh OriginalPaper Pages: 19 - 26
Finite element studies of the impact-echo response of plates containing thin layers and voids Yiching LinMary SansaloneNicholas J. Carino OriginalPaper Pages: 27 - 47