1. A novel method of processing pulse echo data in adhesive bond inspection

   • E. Segal
   • P. Dickstein
   • H. Dodiuk

   OriginalPaper Pages: 1 - 17

2. Estimating the depth and width of arbitrarily-oriented disbonds in laminates using shearography

   • H. M. Shang
   • F. S. Chau
   • S. L. Toh

   OriginalPaper Pages: 19 - 26

3. Finite element studies of the impact-echo response of plates containing thin layers and voids

   • Yiching Lin
   • Mary Sansalone
   • Nicholas J. Carino

   OriginalPaper Pages: 27 - 47