Volume 22, Issue 10

Search all Journal of Materials Science: Materials in Electronics articles

October 2011

Failure Analysis in Electronics: An EDFAS Special Issue

Issue Editor:

Lee Knauss

10 articles in this issue

Introduction
Lee Knauss
Editorial 10 September 2011 Pages: 1509 - 1510
Screening for counterfeit electronic parts
Bhanu Sood
Diganta Das
Michael Pecht
OriginalPaper 23 August 2011 Pages: 1511 - 1522
Failure localization with active and passive voltage contrast in FIB and SEM
Ruediger Rosenkranz
OriginalPaper 22 July 2011 Pages: 1523 - 1535
Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devices
Tao-Chi Liu
Chih Chen
Jandel Lin
OriginalPaper 12 July 2011 Pages: 1536 - 1541
Two-photon absorption laser assisted device alteration using continuous wave 1,340 nm laser
Baohua Niu
Patrick Pardy
Travis Eiles
OriginalPaper 22 July 2011 Pages: 1542 - 1552
Characterization of poly-Si thin-film solar cell functions and parameters with IR optical interaction techniques
M. Boostandoost
F. Friedrich
Y. Yokoyama
OriginalPaper 23 July 2011 Pages: 1553 - 1579
Extending acoustic microscopy for comprehensive failure analysis applications
Sebastian Brand
Peter Czurratis
Matthias Petzold
OriginalPaper 11 August 2011 Pages: 1580 - 1593
LA ICP-MS in microelectronics failure analysis
Zixiao Pan
Wei Wei
Fuhe Li
OriginalPaper 14 July 2011 Pages: 1594 - 1601
Conductive filament formation in printed circuit boards: effects of reflow conditions and flame retardants
Bhanu Sood
Michael Pecht
OriginalPaper 11 August 2011 Pages: 1602 - 1615
Disassembly methodology for conducting failure analysis on lithium–ion batteries
Nick Williard
Bhanu Sood
Michael Pecht
OriginalPaper 16 July 2011 Pages: 1616 - 1630

Volume 22, Issue 10

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