1. Low temperature sintering of Li_1.1Nb_0.58Ti_0.5O₃-xBi₂O₃ dielectric with adjustable temperature coefficient

   • Ping Zhang
   • Lingxia Li
   • Wei Zhang

   OriginalPaper 11 April 2009 Pages: 213 - 217

   

2. The sensitivity of the electron transport within bulk wurtzite indium nitride to variations in the crystal temperature, the doping concentration, and the non-parabolicity coefficient: an updated Monte Carlo analysis

   • Stephen K. O’Leary
   • Brian E. Foutz
   • Lester F. Eastman

   OriginalPaper 29 April 2009 Pages: 218 - 230

   

3. Study on properties of forsterite/cordierite ceramic composites

   • Haikui Zhu
   • Hongqing Zhou
   • Min Liu

   OriginalPaper 26 April 2009 Pages: 231 - 235

   

4. Two critical grain sizes of Ba_0.6Sr_0.4TiO₃ thin films

   • Hongwei Chen
   • Chuanren Yang
   • Li Zhao

   OriginalPaper 23 April 2009 Pages: 236 - 240

   

5. Structure and piezoelectric properties of lead-free (Na_0.52K_0.44−x )(Nb_0.95−x Sb_0.05)O₃-xLiTaO₃ ceramics

   • Jian Fu
   • Ruzhong Zuo
   • Yang Wu

   OriginalPaper 23 April 2009 Pages: 241 - 245

   

6. Microstructure and electrical properties of (Ta, Co, Pr) doped TiO₂ based electroceramics

   • V. C. Sousa
   • M. M. Oliveira
   • E. Longo

   OriginalPaper 03 May 2009 Pages: 246 - 251

   

7. Microwave dielectric properties of low temperature firing (Li_1/2Nd_1/2)WO₄ ceramic

   • Huanfu Zhou
   • Hong Wang
   • Haibo Yang

   OriginalPaper 26 April 2009 Pages: 252 - 255

   

8. Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints

   • Yaowu Shi
   • Jianping Liu
   • Xiaoyan Li

   OriginalPaper 28 April 2009 Pages: 256 - 261

   

9. Impression creep of the rare-earth doped Sn–2%Bi lead-free solder alloy

   • R. Mahmudi
   • A. R. Geranmayeh
   • H. Pirayesh

   OriginalPaper 29 April 2009 Pages: 262 - 269

   

10. Crystallization of silicon films by new metal mediated mechanism

    • Chiung Wei Lin
    • Seng Chi Lee
    • Yeong Shyang Lee

    OriginalPaper 01 May 2009 Pages: 270 - 277

    

11. Copper pillar bump design optimization for lead free flip-chip packaging

    • K. M. Chen
    • T. S. Lin

    OriginalPaper 15 May 2009 Pages: 278 - 284

    

12. Investigation on deep level defects in rapid thermal annealed undoped n-type InP

    • V. Janardhanam
    • A. Ashok Kumar
    • P. Narasimha Reddy

    OriginalPaper 07 May 2009 Pages: 285 - 290

    

13. Structure and electrical properties of Bi_0.5Na_0.5TiO₃-Y_0.5Na_0.5TiO₃-BaTiO₃ lead-free piezoelectric ceramics

    • Dunmin Lin
    • K. W. Kwok

    OriginalPaper 07 May 2009 Pages: 291 - 297

    

14. Doping effect of Mg²⁺ on BaTiO₃-based metal–dielectric composite system

    • Lingxia Li
    • Yu Liang
    • Ping Zhang

    OriginalPaper 15 May 2009 Pages: 298 - 301

    

15. Low-temperature fabrication of BaBi₂Nb₂O₉ ceramics by reaction controlled sintering

    • Tatsuhiro Shigyo
    • Hidenobu Itoh
    • Junichi Takahashi

    OriginalPaper 16 May 2009 Pages: 302 - 308

    

16. Effect of post annealing on structural and optical properties of ZnO thin films deposited by vacuum coating technique

    • C. Periasamy
    • Rajiv Prakash
    • P. Chakrabarti

    OriginalPaper 21 May 2009 Pages: 309 - 315