Editorial: Short-Circuit Diffusion at Interfaces in Materials Yuri Mishin Editorial Board Pages: 5 - 5
Diffusion, Solute Segregations and Interfacial Energies in Some Material: An Overview D. Gupta OriginalPaper Pages: 7 - 20
Grain Boundary Diffusion and Linear and Non-Linear Segregation of Ag in Cu Sergiy DivinskiMaik LohmannChristian Herzig OriginalPaper Pages: 21 - 31
Effect of Grain Boundary Segregation and Migration on Diffusion Profiles: Analysis and Experiments J. BernardiniCh. GirardeauxD.L. Beke OriginalPaper Pages: 33 - 40
Grain Boundary Diffusion and Segregation in Interstitial Solid Solutions Based on BCC Transition Metals: Carbon in Niobium B. BoksteinI. Razumovskii OriginalPaper Pages: 41 - 49
Effects of Metastable Diffusion Short-Circuits on Surface Segregation René Le GallGuy Saindrenan OriginalPaper Pages: 59 - 66
Tracer Diffusion of 63Ni in Nano-γ-FeNi Produced by Powder Metallurgical Method: Systematic Investigations in the C, B, and A Diffusion Regimes S.V. DivinskiF. HiskerChr. Herzig OriginalPaper Pages: 67 - 80
The Lattice Model for Addressing Phenomenological Diffusion Problems Associated with Grain Boundaries G.E. MurchI.V. Belova OriginalPaper Pages: 91 - 97
An Atomistic Study of Interfacial Diffusion in Lamellar TiAl Alloys M. NomuraV. Vitek OriginalPaper Pages: 99 - 109
Effect of High-Temperature Structure and Diffusion on Grain-Boundary Diffusion Creep in fcc Metals P. KeblinskiV. Yamakov OriginalPaper Pages: 111 - 120
Modeling of Surface Diffusion in hcp Zr and Ti M.I. PascuetJ.R. FernándezA.M. Monti OriginalPaper Pages: 121 - 129
Atomistic Modeling of Point Defects and Diffusion in Copper Grain Boundaries A. SuzukiY. Mishin OriginalPaper Pages: 131 - 148