Length scales for the fracture of nanostructures William W. GerberichJohn M. JungkKarl Yoder OriginalPaper Pages: 387 - 405
Effects of diffusion on interfacial fracture of gold-chromium hybrid microcircuit films N.R. MoodyD.P. AdamsA. Volinsky OriginalPaper Pages: 407 - 419
Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation T. ScherbanD. PantusoJ.M. MartÃnez-Esnaola OriginalPaper Pages: 421 - 429
Fiducial mark and CTOA estimates of thin film adhesion Alex A. VolinskyNeville R. MoodyWilliam W. Gerberich OriginalPaper Pages: 431 - 439
Measurement of the noibium/sapphire interface toughness via delamination H. JeG.S. WasM.D. Thouless OriginalPaper 01 January 2003 Pages: 441 - 448
High-cycle fatigue of micron-scale polycrystalline silicon films: fracture mechanics analyses of the role of the silica/silicon interface C.L. MuhlsteinR.O. Ritchie OriginalPaper Pages: 449 - 474
Adhesion of polymer thin-films and patterned lines Christopher S. LittekenReinhold H. Dauskardt OriginalPaper Pages: 475 - 485
Mechanical properties and fracture toughness of organo-silicate glass (OSG) low-k dielectric thin films for microelectronic applications J.B. VellaI.S. AdhihettyA.A. Volinsky OriginalPaper Pages: 487 - 499