1. Length scales for the fracture of nanostructures

   • William W. Gerberich
   • John M. Jungk
   • Karl Yoder

   OriginalPaper Pages: 387 - 405

2. Effects of diffusion on interfacial fracture of gold-chromium hybrid microcircuit films

   • N.R. Moody
   • D.P. Adams
   • A. Volinsky

   OriginalPaper Pages: 407 - 419

3. Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation

   • T. Scherban
   • D. Pantuso
   • J.M. Martínez-Esnaola

   OriginalPaper Pages: 421 - 429

4. Fiducial mark and CTOA estimates of thin film adhesion

   • Alex A. Volinsky
   • Neville R. Moody
   • William W. Gerberich

   OriginalPaper Pages: 431 - 439

5. Measurement of the noibium/sapphire interface toughness via delamination

   • H. Je
   • G.S. Was
   • M.D. Thouless

   OriginalPaper 01 January 2003 Pages: 441 - 448

6. High-cycle fatigue of micron-scale polycrystalline silicon films: fracture mechanics analyses of the role of the silica/silicon interface

   • C.L. Muhlstein
   • R.O. Ritchie

   OriginalPaper Pages: 449 - 474

7. Adhesion of polymer thin-films and patterned lines

   • Christopher S. Litteken
   • Reinhold H. Dauskardt

   OriginalPaper Pages: 475 - 485

8. Mechanical properties and fracture toughness of organo-silicate glass (OSG) low-k dielectric thin films for microelectronic applications

   • J.B. Vella
   • I.S. Adhihetty
   • A.A. Volinsky

   OriginalPaper Pages: 487 - 499