1. Eshelby's formula for an ellipsoidal elastic inclusion in anisotropic poroelasticity and thermoelasticity

   • Valery M. Levin
   • Juan M. Alvarez-Tostado

   OriginalPaper Pages: L77 - L82

2. Path-independent integrals and crack extension force for functionally graded materials

   • Shi Weichen

   OriginalPaper Pages: L83 - L89

3. Stress concentration around a strongly oblate spheroidal cavity in a transversely isotropic medium

   • Chun-Ron Chiang

   OriginalPaper Pages: L91 - L97

4. CTOD for the through-the-thickness crack in a plate of arbitrary thickness

   • Andrei Kotousov

   OriginalPaper Pages: L99 - L104

5. Micromechanics modeling of plastic yielding in a solid containing mode III cohesive cracks

   • Shaofan Li
   • Elise F. Morgan

   OriginalPaper Pages: L105 - L112

6. Channel cracking in thin films on substrates of finite thickness

   • J.J. Vlassak

   OriginalPaper Pages: 299 - 323

7. Channel cracking during thermal cycling of thin film multi-layers

   • M.R. Begley
   • J.M. Ambrico

   OriginalPaper Pages: 325 - 338

8. Indentation induced film fracture in hard film – soft substrate systems

   • D.F. Bahr
   • C.L. Woodcock
   • N.R. Moody

   OriginalPaper Pages: 339 - 349

9. In situ TEM observations of fracture in nanolaminated metallic thin films

   • T. Foecke
   • D.E. Kramer

   OriginalPaper Pages: 351 - 357

10. Flow and fracture of free-standing Ag and Cu thin films and Ag/Cu multilayers

    • Haibo Huang
    • Denis Y.W. Yu
    • Frans Spaepen

    OriginalPaper Pages: 359 - 364

11. Co-planar crack interaction in cleaved mica

    • J.C. Hill
    • S.J. Bennison
    • S. Saigal

    OriginalPaper Pages: 365 - 386