1. Water-assisted sub-critical crack growth along an interface between polyimide passivation and epoxy underfill

   • Charavana K. Gurumurthy
   • Edward J. Kramer
   • Chung-Yuen Hui

   OriginalPaper Pages: 1 - 28

2. Crack patterns in brittle thin films

   • V.B. Shenoy
   • A.F. Schwartzman
   • L.B. Freund

   OriginalPaper Pages: 29 - 45

3. Modeling of electromechanically-induced failure of passivated metallic thin films used in device interconnections

   • M. Rauf Gungor
   • Dimitrios Maroudas

   OriginalPaper Pages: 47 - 68

4. Fatigue and fracture properties of thin metallic foils

   • A. Hadrboletz
   • B. Weiss
   • G. Khatibi

   OriginalPaper Pages: 69 - 89

5. Modeling electromigration and the void nucleation in thin-film interconnects of integrated circuits

   • R.V. Goldstein
   • M.E. Sarychev
   • Yu.V. Zhitnikov

   OriginalPaper Pages: 91 - 121

6. Creep and contact opening electromigration failures in miniaturized interconnects

   • E.E. Glickman

   OriginalPaper Pages: 123 - 139