Editors
Editor-in-Chief
Gwo-Bin Vincent Lee
National Tsing Hua University
Department of Power Mechanical Engineering
Taiwan
e-mail: gwobin@pme.nthu.edu.tw
Associate Editors
Stéphane Colin
Institut Clément Ader
Université de Toulouse
France
e-mail: colin@insa-toulouse.fr
Marie-Caroline Jullien
Institut de Physique de Rennes
CEDEX
France
e-mail: marie-caroline.jullien@univ-rennes1.fr
Qiao Lin
Columbia University
Department of Mechanical Engineering
New York, NY
USA
e-mail: qlin@columbia.edu
Che-Hsin Lin
National Sun Yat-Sen University
Department of Mechanical and Electro-mechanical Engineering
Taiwan
e-mail: chehsin@mail.nsysu.edu.tw
Hywel Morgan
University of Southampton
ECS, Faculty of Physical Sciences and Engineering
United Kingdom
e-mail: hm@ecs.soton.ac.uk
Nam-Trung Nguyen
Griffith University
QLD Micro- and Nanotechnology Centre
Australia
e-mail: nam-trung.nguyen@griffith.edu.au
Sumita Pennathur
University of California, Santa Barbara
College of Engineering
USA
e-mail: sumita@ucsb.edu
Shaurya Prakash
Ohio State University
Department of Mechanical & Aerospace Engineering
USA
e-mail: prakash.31@osu.edu
Wei Wang
Peking University
Institute of Microelectronics
P.R. China
e-mail: w.wang@pku.edu.cn
Pak Kin Wong
The Pennsylvania State University
USA
e-mail: pxw28@psu.edu
Editorial Advisory Board
Chong H. Ahn
University of Cincinnati
Microsystems and BioMEMS Lab
Department of Electrical and Computer Engineering
USA
Haim H. Bau
University of Pennsylvania
The Department of Mechanical Engineering and Applied Mechanics
USA
Albert van den Berg
University of Twente
Faculty of Electrical Engineering
The Netherlands
Carlo Effenhauser
Roche Instrument Center AG
Microtechnology Center
Switzerland
Jan C. T. Eijkel
University of Twente
Faculty of Electrical Engineering, Mathematics and Computer Science
The Netherlands
David Erickson
Cornell University
Sibley School of Mechanical and Aerospace Engineering
USA
Richard Fair
Duke University
Department of Electrical and Computer Engineering
USA
Martin Gijs
Swiss Federal Institute of Technology (EPFL)
Institute of Microelectronic & Microsystems (IMM)
Laboratory for Microsystems (LMIS)
Switzerland
Satish G. Kandlikar
Rochester Institute of Technology
Mechanical Engineering Department
USA
Takehiko Kitamori
University of Tokyo
Department of Applied Chemistry
Japan
Dongqing Li (Founding Editor)
University of Waterloo
Department of Mechanical and Mechatronics Engineering
Faculty of Engineering
Canada
Gui-Rong Liu
University of Cincinnati
Department of Aerospace Engineering &
Engineering Mechanics
USA
Juan G. Santiago
Stanford University
Department of Mechanical Engineering
USA
Shuichi Takayama
Georgia Institute of Technology & Emory University School of Medicine
Wallace H. Coulter Department of Biomedical Engineering
USA
Joseph Wang
Arizona State University
Department of Chemical & Materials Engineering
USA
Chun Yang
Nanyang Technological University
Division of Thermal Fluids Engineering
School of Mechanical and Aerospace Engineering
Singapore
Ruey-Jen Yang
National Cheng Kung University
Department of Engineering Science
Taiwan
Roland Zengerle
University of Freiburg
Dept. of Microsystems Engineering - IMTEK
Germany
Yitshak Zohar
The University of Arizona
Department of Aerospace & Mechanical Engineering
Department of Biomedical Engineering
USA