Skip to main content
Log in

A Novel Counterfeit Detection Approach for Integrated Circuit Supply Chain Assurance

  • Published:
Journal of Hardware and Systems Security Aims and scope Submit manuscript

Abstract

The electronics industry has become a primary target in the global market of counterfeiting. Counterfeit electronic parts transverse through the supply chain end up in critical avionics, industrial, medical, and military systems, and the financial loss due to these parts is in the billions. A vast majority of counterfeit parts within the electronics industry are integrated circuits. In this paper, a new (near real-time) counterfeit detection process, which is based upon infrared thermal imaging, intensive statistical analysis, and machine learning, to differentiate between authentic and inauthentic electronic parts is presented and then showcased as a highly accurate and cost-effective method to verify hardware authenticity.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6

Similar content being viewed by others

References

  1. U.S. General Accountability Office (2016) Counterfeit parts: U.S. Department of Defense (DoD) needs to improve reporting and oversight to reduce supply chain risk

  2. Bumgarner J, Coleman G, Smith A, Willems M, Wren S (2011) U.S. Department of Defense’s 2010 Comprehensive Inventory Management Improvement Plan

  3. Hughitt B (2008) Counterfeit electronic parts. In: Trilateral Safety and Mission Assurance Conference. National Aeronautics and Space Administration (NASA), European Space Agency (ESA), Japan Aerospace Exploration Agency (JAXA)

  4. Birdsong, B, Schipp, F (2012) U.S. Missile Defense Agency (MDA) Counterfeit Awareness Training—avoidance, detection, containment, and reporting briefing

  5. McFadden F, Arnold R (2010) Supply chain risk mitigation for IT electronics. In: 2010 IEEE International Conference on Technologies for Homeland Security (HST). IEEE, pp. 49–55

  6. Collins, I, Frazier, P, Gilmore, E, Chouikha, M (2014) Industry study of supply chain risk management practices and ways to improve hardware reliability. In: 3rd Annual IEEE International Reliability Innovations Conference. IEEE

  7. Intel Corporation (2012) Intel risk assessment 2 summary. https://supplier.intel.com/static/eicc/2012_Final_Intel_RA2_summary.pdf. Accessed: 30 July 2012

  8. Texas Instruments (2014) Sustainability: supply chain accountability: transparency. http://www.ti.com/corp/docs/csr/transparency.html. Accessed: 17 July 2014

  9. IHS Technology (2012) Top 5 most counterfeited parts represent a $169 billion potential challenge for global semiconductor market. http://www.isuppli.com/Semiconductor-Value-Chain/News/pages/Top-5-Most-Counterfeited-Parts-Represent-a-$169-Billion-Potential-Challenge-for-Global-Semiconductor-Market.aspx. Accessed: 4 November 2014

  10. Guin U, Huang K, DiMase D, Carulli J, Tehranipoor M, Makris Y (2014) Counterfeit integrated circuits: a rising threat in the global semiconductor supply chain. Proc IEEE 102(8):1207–1228

    Article  Google Scholar 

  11. Tehranipoor M, Guin U, Forte D (2015) Counterfeit integrated circuits: detection and avoidance. Springer, New York

    Google Scholar 

  12. Sheppard C, Shotton D (1997) Confocal laser scanning microscopy. Springer, New York

    Google Scholar 

  13. Chatterjee K, Das D (2007) Semiconductor manufacturers’ efforts to improve trust in the electronic part supply chain. IEEE Trans Compon Packag Technol 30(3):547–549

    Article  Google Scholar 

  14. Shrivasta A, Azarian M, Morillo C, Sood B, Pecht M (2014) Detection and reliability risks of counterfeit electrolytic capacitors. IEEE Trans Reliab 63(2):468–479

    Article  Google Scholar 

  15. Cushing M, Mortin D, Stadterman T, Malhorta A (1993) Comparison of electronics – reliability assessment approaches. IEEE Trans Reliab 42(4):542–546

    Article  Google Scholar 

  16. Zhang X, Tehranipoor M (2014) Design of on-chip lightweight sensors for effective detection of recycled ICs. IEEE Trans VLSI Syst 22(5):1016–1029

    Article  Google Scholar 

  17. Dogan H, Forte D, Tehranipoor M (2014) Aging analysis for recycled FPGA detection. In: 2014 International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT). IEEE, pp. 171–176

  18. Alam M, Tehranipoor M, Forte D (2016) Recycled FPGA detection using exhaustive LUT path delay characterization. In: 2016 IEEE international test conference (ITC). IEEE, pp. 1–10

  19. Shakya B, Guin U, Tehranipoor M, Forte D (2015) Performance optimization for on-chip sensors to detect recycled ICs. In: 33rd IEEE International Conference on Computer Design (ICCD) IEEE, pp. 289–295

  20. Guin U, Zhang X, Forte D, Tehranipoor M (2016) Design of accurate low-cost on-chip structures for protecting integrated circuits against recycling. IEEE Trans VLSI Syst 24(4):1233–1246

    Article  Google Scholar 

  21. Guin U, Zhang X, Forte D, Tehranipoor M (2014) Low-cost on-chip structures for combating die and IC recycling. In: 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC). IEEE, pp. 1–6

  22. Huang K, Liu Y, Korolija N, Carulli J, Makris Y (2015) Recycled IC detection based on statistical methods. IEEE Trans Comput-Aided Design Integr Circuits Syst 34(6):947–960

    Article  Google Scholar 

  23. Alam, M, Chowdhury, S, Tehranipoor, M, Guin, U (2018) Robust, low-cost, and accurate detection of recycled ICs using digital signatures. In: IEEE International Symposium on Hardware Oriented Security and Trust (HOST). IEEE, pp. 1–6

  24. Mahmood K, Latorre-Carmona P, Shahbazmohamadi S, Pla F, Javidi B (2015) Real-time automated counterfeit integrated circuit detection using X-ray microscopy. Appl Opt 54(13):25–32

    Article  Google Scholar 

  25. Ahi, K, Asadizanjani, N, Shahbazmohamadi, S, Tehranipoor, M, Anwar, M (2015) Terahertz characterization of electronic components and comparison of terahertz imaging with X-ray imaging techniques. In: Terahertz physics, devices, and systems IX: advanced applications in industry and defense. SPIE

  26. Ahi, K, Anwar, M (2016) Advanced terahertz techniques for quality control and counterfeit detection. In: terahertz physics, devices, and systems X: advanced applications in industry and defense. SPIE

  27. Ahi K, Shahbazmohamadi S, Asadizanjani N (2018) Quality control and authentication of packaged integrated circuits using enhanced-spatial-resolution terahertz time-domain spectroscopy and imaging. Opt Lasers Eng 104:274–284

    Article  Google Scholar 

  28. Huang K, Carulli J, Makris Y (2013) Counterfeit electronics: a rising threat in the semiconductor manufacturing industry. In: 2013 IEEE International Test Conference (ITC). IEEE, pp. 1–4

  29. Huang K, Carulli J, Makris Y (2012) Parametric counterfeit IC detection via support vector machines. In: 2012 IEEE International Symposium on Defect and Fault Tolerance in Very-large-scale integration and Nanotechnology Systems (DFT). IEEE, pp. 7–12

  30. Zheng Y, Wang X, Bhunia S (2015) SACCI: scan-based characterization through clock phase sweep for counterfeit chip detection. IEEE Trans VLSI Syst 23(5):831–841

    Article  Google Scholar 

  31. Pecht M (2013) Bogus: electronic manufacturing and consumers confront a rising tide of counterfeit electronics. IEEE Spectr 43(37):37–46

    Google Scholar 

  32. Huang H, Boyer A, Dhia S (2014) The detection of counterfeit integrated circuit by the use of electromagnetic fingerprint. In: 2014 International Symposium on Electromagnetic Compatibility (EMC Europe 2014). IEEE, pp. 1118–1122

  33. Li J, Wang J, Li Z, Li B (2013) A novel algorithm of IC defect images enhancement based on histogram equalization and IHS transform. In: 2013 IEEE International Conference on Anti-Counterfeiting, Security and Identification (ASID). IEEE, pp. 1–5

  34. Welke S, Johnson B, Aylor J (1995) Reliability modeling of hardware/software systems. IEEE Trans Reliab 44(3):468–479

    Article  Google Scholar 

  35. Blais R (1969) True reliability versus inspection efficiency. IEEE Trans Reliab 18(4):201–203

    Article  Google Scholar 

  36. Ahi K, Rivera A, Mazadi A, Anwar M (2017) Fabrication of robust nano-signatures for identification of authentic electronic components and counterfeit avoidance. Int J High Speed Electron Sys 26(3):3–11

  37. Ahi K, Rivera A, Mazadi A, Anwar M (2017) Encrypted electron beam lithography nano-signatures for authentication, microelectronics and optoelectronics. Int J High Speed Electron Sys 26(3):134–146

  38. Song P, Stellari F, Pfeiffer D, Culp J, Weger A, Bonnoit A, Wisnieff B, Taubenblatt M (2011) MARVEL—malicious alteration recognition and verification by emission of light. In: 2011 IEEE International Symposium on Hardware-Oriented Security and Trust (HOST). IEEE, pp. 117–121

  39. Chen A, Hu X, Jin Y, Niemier M, Yin X (2016) Using emerging technologies for hardware security beyond PUFs. In: 2016 IEEE Design, Automation & Test in Europe Conference & Exhibition (DATE) IEEE, pp. 1544–1549

  40. Zheng, Y, Basak, A, Bhunia, S (2014) CACI: dynamic current analysis towards robust recycled chip identification. In: 51st annual ACM/EDAC/IEEE design automation conference (DAC)

  41. Zheng F, Hennessy A, Bhunia S (2015) Robust counterfeit PCB detection exploiting intrinsic trace impedance variations. In: 2015 IEEE 33rd Very Large Scale Integration (VLSI) Test Symposium (VTS). IEEE, pp. 1–6

  42. Guo, Z, Xu, X, Tehranipoor, M, Forte, D (2017) FFD: a framework for fake flash detection. In: 51st Annual ACM/EDAC/IEEE Design Automation Conference (DAC). IEEE

  43. Zhang H, Sfarra S, Sarasini F, Ibarra-Castanedo C, Perilli S, Fernandes H, Duan Y, Peeters J, Maldague X (2018) Optical and mechanical excitation thermography for impact response in basalt-carbon hybrid fiber-reinforced composite laminates. IEEE Trans Ind Informat 14(2):831–841

    Google Scholar 

  44. Zhang H, Robitalle F, Grosse C, Ibarra-Castanedo C, Ocana-Martins J, Sfarra S, Maldague X (2018) Optical excitation thermography for Twill/Plain weaves and stitched fabric dry carbon fibre preform inspection. Compos A: Appl Sci Manuf 107(4):282–293

    Article  Google Scholar 

  45. Zhang H, Yu L, Hasler U, Fernandes H, Genest M, Robitaille F, Joncas S, Holub W, Sheng Y, Maldague X (2016) An experimental and analytical study of micro-laser line thermography on micro-sized flaws in stitched carbon fiber reinforced polymer composites. Compos Sci Technol 126(4):17–26

    Article  Google Scholar 

  46. Fernandes H, Zhang H, Figueiredo A, Malheiros F, Ignacio L, Sfarra S, Ibarra-Castanedo C, Guimaraes G, Maldague X (2018) Machine learning and infrared thermography for fiber orientation assessment on randomly-oriented strands parts. Sensors 18(1):1–16

    Article  Google Scholar 

  47. Parra L (2002) Tutorial on blind source separation and independent component analysis. Adaptive Image & Signal Processing Group, Sarnoff Corporation, Princeton

    Google Scholar 

  48. Gilmore E, Frazier P, Collins I, Reid W, Chouikha M (2013) Infrared analysis for counterfeit electronic parts detection and supply chain validation. J Environ Sys Dec 33(4):477–485

    Article  Google Scholar 

  49. Cortes C, Vapnik A (1995) Support vector networks. Mach Learn 20(3):273–297

    MATH  Google Scholar 

  50. Friedman N, Geiger G, Goldszmidt M (1997) Bayesian network classifiers. Mach Learn 29:131–161

    Article  Google Scholar 

  51. Lewis D (1988) Naïve (Bayes) at forty: the independence assumption in information retrieval. In: 10th European Conference on Machine Learning. IEEE, pp. 4–15

  52. Kohonen T (1988) An introduction to neural computing. Neural Netw 1:3–16

    Article  Google Scholar 

  53. Rabiner L, Rosenberg A, Levinson S (1978) Considerations in dynamic time warping algorithms for discrete word recognition. IEEE Trans Acoust Speech Signal Process 26(6):575–582

    Article  Google Scholar 

  54. Myers C, Rabiner L (1981) A comparative study of several dynamic time-warping algorithms for connected word recognition. Bell Syst Tech J 60(7):1389–1409

    Article  Google Scholar 

  55. Weng Y, Zhu Z (2003) Time series clustering based on shape dynamic time warping using cloud models. In: 2003 International Conference on Machine Learning. IEEE, pp 236–241

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Preston D. Frazier.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Frazier, P.D., Thomas Gilmore, E., Collins, I.J. et al. A Novel Counterfeit Detection Approach for Integrated Circuit Supply Chain Assurance. J Hardw Syst Secur 2, 240–250 (2018). https://doi.org/10.1007/s41635-018-0041-6

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s41635-018-0041-6

Keywords

Navigation