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Recent advances in direct ink writing of electronic components and functional devices

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Abstract

Three dimensional (3D) printing technologies, known as the additive manufacturing, have been attracting extensive interests in various fields, including the academic world, industries and even daily life. It has special capabilities that can be used for increasing shape or structure complexity and fabrication efficiency, while reducing the waste materials, capital cost and design cycle for manufacturing. Among these, fabrication of functional components or devices for microelectronic systems with 3D printing technologies is still an emerging field. Recently, a series of 3D printed functional components and devices for electronics have been reported, especially with the widely used direct ink writing 3D printing. This paper will focus on materials and practical applications of 3D printing for electronic units and systems, including microelectrodes, supercapacitances, electronic circuits, batteries and so on. The implementation of 3D printing for electronics with advanced materials will have great advantage in terms of performance, microstructures, product flexibility and tailored shape along with low cost, less waste and high efficiency.

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Fig. 1

Reproduced with permission from ref [27]. Copyright 2014, Wiley-VCH

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Reprinted with permission from ref [47]. Copyright 2004, Elsevier

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Reproduced with permission from ref [51]. Copyright 2017, ACS

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Reproduced with permission from ref [69]. Copyright 2015, Wiley-VCH

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Reproduced with permission from ref [70]. Copyright 2017, Nature

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Reprinted with permission from ref [85]. Copyright 2010, RSC

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Reproduced with permission from ref [94]. Copyright 2009, Science

Fig. 8

Reproduced with permission from ref [102]. Copyright 2014, ACS

Fig. 9

Reprinted with permission from ref [103]. Copyright 2017, ACS

Fig. 10

Reproduced with permission from ref [104]. Copyright 2016, Elsevier

Fig. 11

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Fig. 12

Reproduced with permission from ref [116]. Copyright 2014, ACS

Fig. 13

Reproduced with permission from ref [129]. Copyright 2013, Wiley-VCH

Fig. 14

Reproduced with permission from ref [128]. Copyright 2016, Wiley-VCH

Fig. 15

Reproduced with permission from ref [136]. Copyright 2014, ACS. (Color figure online)

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Acknowledgements

The authors are grateful for the financial supports from the National Natural Science Foundation of China (51775538), Gansu province science and technology plan (17JR5RA318, 1606RJZA051 and 17YF1FA139), and the West Light Program of CAS.

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  1. State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou, 730000, China

    Pan Jiang, Zhongying Ji, Xiaoqin Zhang, Zhilu Liu & Xiaolong Wang

  2. University of Chinese Academy of Science, Beijing, 100080, China

    Pan Jiang & Zhongying Ji

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  1. Pan Jiang
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  4. Zhilu Liu
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Jiang, P., Ji, Z., Zhang, X. et al. Recent advances in direct ink writing of electronic components and functional devices. Prog Addit Manuf 3, 65–86 (2018). https://doi.org/10.1007/s40964-017-0035-x

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