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Experimental Investigation and Modeling of Friction Coefficient and Material Removal During Optical Glass Polishing

  • Research Article-Mechanical Engineering
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Abstract

Chemical mechanical polishing is a hybrid polishing technique having different applications in the semiconductor industry, biomedical and optical instrumentation, and defense equipment. The control and accuracy highly depend on the operator's skill due to limited knowledge of material removal behavior. This article attempts to fill this gap through an experimental investigation of friction coefficient and material removal rate as functions of abrasive particle size, normal load, relative velocity, and polishing time during BK7 optical glass polishing. In this article, Taguchi L18 mixed levels full factorial design was used to perform the experiments. Also, a temporal model for material removal rate is developed to study and investigate the mechanism of material removal. The results show the load per particle varies between 0.18 × 10–6 and 4.1 × 10–6 N, which led to the conclusion that material, are removed plastically from the workpiece surface and mechanical actions are dominant over chemical actions in material removal. The values of friction coefficient (μ ~ 0.1) and 3D profilometer images also support this statement. The errors between predicted and experimental results are well within 8% and 12% for friction coefficient and material removal rate, respectively. This study is an important step toward the deterministic optical polishing process, leading to better control of material removal during the polishing of precision optical components.

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All data generated or analyzed during this study are included in this published article.

Abbreviations

μ :

Friction coefficient

k :

Preston’s constant

ρ :

Density

a :

Abrasive size

L :

Polishing load

p :

Polishing pressure

v :

Speed (relative, polishing)

r :

Offset distance between workpiece and polisher centers

s :

Polisher speed

w :

Weight

D :

Diameter of the workpiece

A r :

Workpiece to polisher area ratio

Ns :

Number of abrasive particles bearing the polishing load

t p :

Pad thickness

F a :

Load per particle

V a :

Volume of abrasive particle

x, y, z, γ , α, β, ε:

Fitting parameters

MRR:

Material removal rate

CMP:

Chemical mechanical polishing

OA:

Orthogonal array

AFM:

Atomic force microscope

ANOVA:

Analysis of variance

Adj SS:

Adjusted sum of square

Adj MS:

Adjusted mean square

DOF:

Degrees of freedom

SR:

Surface roughness

CCI:

Coherence correlation interferometry

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Acknowledgements

The authors like to thank the Director, CSIR-Central Scientific Instruments Organization, and Chandigarh, India, for providing the necessary resources and research facilities to carry out this study.

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  1. Imaging, Avionics, and Display Systems (IADS), CSIR-Central Scientific Instruments Organisation (CSIR-CSIO), Sector-30, Chandigarh, 160030, India

    Raj Kumar Pal, Manoj Kumar & Vinod Karar

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  1. Raj Kumar Pal
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Contributions

RKP contributed to conceptualization, resources, methodology, data curation, software, formal analysis, supervision, validation, investigation, writing—reviewing and editing, and project administration. MK contributed to data curation, formal analysis, methodology, software, visualization, and investigation. VK contributed to resources, visualization, supervision, validation, and project administration.

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Correspondence to Raj Kumar Pal.

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Pal, R.K., Kumar, M. & Karar, V. Experimental Investigation and Modeling of Friction Coefficient and Material Removal During Optical Glass Polishing. Arab J Sci Eng 48, 3255–3268 (2023). https://doi.org/10.1007/s13369-022-07042-7

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