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Enhanced thermal and mechanical properties of polyimide/graphene composites

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Abstract

Polyimide (PI)/graphene sheets (GSs) composites were prepared by solution blending. The incorporation of GSs into PI increased the thermal conductivity, thermal stability and mechanical properties of PI. The thermal conductivity of PI/GSs composites was significantly improved compared with that of neat PI from 0.254 to 1.002 W/mK; this can be attributed to the homogeneous dispersion of graphene and the formation of heat conduction pathway. Furthermore, the Young modulus of PI/GSs was raised up to 4.04 GPa, approximately two-fold enhancement in comparison with that of neat PI. In addition, the incorportation of GSs in PI indicated excellent optical transparency at the lowest weight fractions of GSs and modified wettability of PI films.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Southwest University of Science and Technology, Mianyang, 621010, P. R. China

    Wen Dai & Huiwei Liao

  2. Key Laboratory of Marine New Materials and Related Technology, Zhejiang Key Laboratory of Marine Materials and Protection Technology, Ningbo Institute of Material Technology & Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China

    Wen Dai, Jinhong Yu, Yi Wang, Yingze Song, Hua Bai, Kazuhito Nishimura & Nan Jiang

  3. Key Laboratory of New Processing Technology for Nonferrous Metals and Materials, Ministry of Education, School of Material Science and Engineering, Guilin University of Technology, Guilin, 541004, P. R. China

    Jinhong Yu

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  1. Wen Dai
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  2. Jinhong Yu
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  3. Yi Wang
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  4. Yingze Song
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  5. Hua Bai
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Correspondence to Jinhong Yu, Huiwei Liao or Nan Jiang.

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Dai, W., Yu, J., Wang, Y. et al. Enhanced thermal and mechanical properties of polyimide/graphene composites. Macromol. Res. 22, 983–989 (2014). https://doi.org/10.1007/s13233-014-2143-5

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  • DOI: https://doi.org/10.1007/s13233-014-2143-5

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