Abstract
This paper reports an unique approach to suppress ambipolarity and enhance drive current in tunnel field effect transistor (TFET) by incorporating vertically extending drain in double gate Si1−xGex source TFET. This structure has dual source extending laterally on both sides of the channel with vertically extended drain over the T-shaped channel (VD-DG-Si1−xGexS-TFET). Our study is based on calibrated exhaustive 2-D TCAD simulations. It advocates that the device performance is not only retained but significantly enhanced even by deploying only double gate instead of quadruple gate with Si1−xGex sources. Further the drive current can be significantly increased by optimizing the mole fraction (x) in Si1−xGex source. Our study reveals that the average subthreshold slope (SSavg) is 23.98 m V/dec (point SS (SSpoint) is 12.7 m V/dec with sub-60 m V/dec point SS for 107 orders of current change), drive current (ION) is 2.73× 10− 4 A/um and 46% improvement in transconductance as compared to the earlier reported drain engineered quardruple gate TFET. Further the device sensitivity analysis with respect to gate oxide dielectric constant, gate metal work-function, temperature and germanium mole fraction variation is also analyzed here. Moreover, in terms of device analog behaviour, the cut off frequency (ft) is reported as 38.93 GHz and 140% increment in gain bandwidth product (GWB) as compared to its quardruple gate alternative. This study proves the potentials of considered device structure as a promising candidate for ultra low power analog/RF and digital logic applications.
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References
Shalf J (2020) The future of computing beyond Moore‘s law. Philos Trans Royal Soc A 378 (2166):20190061
Sakurai T (2004) Perspectives of low-power VLSI’s. IEICE Trans Electron 87(4):429–436
Bangsaruntip S, Cohen GM, Majumdar A, Sleight JW (2010) Universality of short-channel effects in undoped-body silicon nanowire MOSFETs. IEEE Electron Device Lett 31(9):903–905
Singh S, Kondekar PN, Jaiswal NK (2016) Label-free biosensor using nanogap embedded dielectric modulated schottky tunneling source impact ionization MOS. Microelectron Eng 149:129–134
Nirschl T, Fischer J, Fulde M, Bargagli-Stoffi A, Sterkel M, Sedlmeir J, Weber C, Heinrich R, Schaper U, Einfeld J, Neubert R (2006) Scaling properties of the tunneling field effect transistor (TFET): Device and circuit. Solid-State Electron 50(1):44–51
Kim SW, Choi WY, Sun MC, Kim HW, Park BG (2012) Design guideline of Si-based L shaped tunneling field-effect transistors, vol 51
Kim SW, Kim JH, Liu TJK, Choi WY, Park BG (2015) Demonstration of L shaped tunnel field-effect transistors. IEEE Trans Electron Devices 63(4):1774–1778
Wang W, Wang PF, Zhang CM, Lin X, Liu XY, Sun QQ, Zhou P, Zhang DW (2013) Design of U-shape channel tunnel FETs with SiGe source regions. IEEE Trans Electron Devices 61(1):193–197
Yang Z (2016) Tunnel field-effect transistor with an L-shaped gate. IEEE Electron Device Lett 37(7):839–842
Krishnamohan T, Kim D, Raghunathan S, Saraswat K (2008) Double-gate Strained-Ge Heterostructure Tunneling FET (TFET) With record high drive currents and 60 mV/dec subthreshold slope. In: IEEE international electron devices meeting, pp 1–3
Saurabh S, Kumar MJ (2010) Novel attributes of a dual material gate nanoscale tunnel fieldeffect transistor. IEEE Trans Electron Devices 58(2):404–410
Chang HY, Adams B, Chien PY, Li J, Woo JC (2012) Improved subthreshold and output characteristics of source-pocket Si tunnel FET by the application of laser annealing. IEEE Trans Electron Devices 60(1):92–96
Kumar MJ, Janardhanan S (2013) Doping-less tunnel field effect transistor: design and investigation. IEEE Trans Electron Devices 60(10):3285–3290
Vladimirescu A, Amara A, Anghel C (2012) An analysis on the ambipolar current in Si double gate tunnel FETs. Solid State Electron 70:67–72
Singh S, Singh AP, Kondekar PN (2017) A novel self-aligned charge plasma Schottky barrier tunnel FET using work function engineering. Microelectron Eng 168:67–75
Choi WY, Lee W (2010) Hetero-gate-dielectric tunneling field-effect transistors. IEEE Trans Electron Devices 57(9):2317–2319
Verhulst AS, Vandenberghe WG, Maex K, Groeseneken G (2007) Tunnel field-effect transistor without gate-drain overlap. Appl Phys Lett 91(5):053102
Wan J, Le Royer C, Zaslavsky A, Cristoloveanu S (2010) SOI TFETS: Suppression of ambipolar leakage and low-frequency noise behavior. In: IEEE 2010 proceedings of the european solid state device research conference, pp 341–344
Shaker A, El-Sabbagh M, El-Banna MM (2017) Influence of drain doping engineering on the ambipolar conduction and high-frequency performance of TFETs. IEEE Trans Electron Devices 64(9):3541–3547
Bashir F, Loan SA, Rafat M, Alamoud ARM, Abbasi SA (2015) A high-performance source engineered charge plasma-based Schottky MOSFET on SOI. IEEE Trans Electron Devices 62(10):3357–3364
Boucart K, Ionescu AM (2007) Double-Gate Tunnel FET with high- gate dielectric. IEEE Trans Electron Devices 54(7):1725–1733
Shaikh MRU, Loan SA (2019) Drain-Engineered TFET With fully suppressed ambipolarity for High-Frequency application. IEEE Trans Electron Devices 66(4):1628–1634
Solomon PM, Jopling J, Frank DJ, D’Emic C, Dokumaci O, Ronsheim P, Haensch WE (2004) Universal tunneling behavior in technologically relevant P/N junction diodes. J Appl Phys 95(10):5800–5812
ATLAS Device Simulation Software (2013) Silvaco Int. Santa Clara, CA, USA
Omura Y, Horiguchi S, Tabe M, Kishi K (1993) Quantum-mechanical effects on the threshold voltage of ultrathin-SOI nMOSFETs. IEEE Electron Device Lett 14(12):569–571
Zhao QT, Hartmann JM, Mantl S (2011) An improved Si tunnel field effect transistor with a buried strained \(Si_{1_{x}} Ge_{x}\) source. IEEE Electron Device Lett 32(11):1480–1482
Cressler J. D. (ed) (2006) Heterostructure handbook. Taylor and Francis, New York
Born M, Bhuwalka KK, Schindler M, Abelein U, Schmidt M, Sulima T, Eisele I (2006) Tunnel FET:, A CMOS device for high temperature applications. In: 25th international conference on microelectronics, pp 124–127
Guo PF, Yang LT, Yang Y, Fan L, Han GQ, Samudra GS, Yeo YC (2009) Tunneling field effect transistor: Effect of strain and temperature on tunneling current. IEEE Electron Device Lett 30(9):981–983
Narang R, Saxena M, Gupta RS, Gupta M (2013) Impact of temperature variations on the device and circuit performance of tunnel FET: a simulation study. IEEE Trans Nanotechnol 12(6):951–957
Zhang Q, Zhao W, Seabaugh A (2006) Low-subthreshold-swing tunnel transistors. IEEE Electron Device Lett 27(4):297–300
Zhi J, Yiqi Z, Cong L, Ping W, Yuqi L (2016) Vertical-dual-source tunnel FETs with steeper subthreshold swing. J Semicond 37(9):094003
Karbalaei M, Dideban D, Heidari H (2020) Impact of high-k gate dielectric with different angles of coverage on the electrical characteristics of gate-all-around field effect transistor: A simulation study, vol 16
Pillarisetty R, Chu-Kung B, Corcoran S, Dewey G, Kavalieros J, Kennel H, Kotlyar R, Le V, Lionberger D, Metz M, Mukherjee N (2010) High mobility strained germanium quantum well field effect transistor as the p-channel device option for low power (Vcc= 0.5 V) III–V CMOS architecture. In: International electronics devices meeting, pp 6–7
Tezuka T, Sugiyama N, Takagi S (2001) Fabrication of strained Si on an ultrathin SiGe-on-insulator virtual substrate with a high-Ge fraction. Appl Phys Lett 79(12):798–1800
Liow TY, Tan KM, Yeo YC, Agarwal A, Du A, Tung CH, Balasubramanian N (2005) Investigation of silicon-germanium fins fabricated using germanium condensation on vertical compliant structures. Appl Phys Lett 87(26):262104
Balakumar S, Buddharaju KD, Tan B, Rustagi SC, Singh N, Kumar R, Lo GQ, Tripathy S, Kwong DL (2009) Germanium-rich SiGe Nanowires formed through oxidation of patterned SiGe FINs on insulator. J Electron Mater 38(3):443–448
Jiang Y, Singh N, Liow TY, Loh WY, Balakumar S, Hoe KM, Tung CH, Bliznetsov V, Rustagi SC, Lo GQ, Chan DSH (2008) Ge-rich. 70 Devices Letter 29(6):595–598
Ko E, Lee H, Park JD, Shin C (2016) Vertical tunnel FET: Design optimization with triple metal-gate layers. IEEE Trans Electron Devices 63(12):5030–5035
Garg S, Saurabh S (2018) Suppression of ambipolar current in tunnel FETs using drain-pocket: Proposal and analysis. Superlattice Microst 113:261–270
Vladimirescu A, Amara A, Anghel C (2012) An analysis on the ambipolar current in Si double-gate tunnel FETs. Solid-State Electron 70:67–72
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The authors are grateful to the National Institute of Technology, Raipur for providing the computational resources.
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Raj, A., Singh, S., Priyadarshani, K.N. et al. Vertically Extended Drain Double Gate Si1−xGex Source Tunnel FET : Proposal & Investigation For Optimized Device Performance. Silicon 13, 2589–2604 (2021). https://doi.org/10.1007/s12633-020-00603-1
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DOI: https://doi.org/10.1007/s12633-020-00603-1