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Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration

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Abstract

Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature (HPHT) infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters (temperature, pressure, and time). The improvement in interfacial bonding strength and the maximum thermal conductivity of 750 W/(m·K) were achieved at the optimal sintering parameters of 1200°C, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.

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Authors and Affiliations

  1. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China

    Hui Chen & Cheng-chang Jia

  2. Shenzhen Haimingrun Industrial Co., Ltd., Shenzhen, 518128, China

    Hui Chen & Shang-jie Li

Authors
  1. Hui Chen
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  2. Cheng-chang Jia
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  3. Shang-jie Li
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Correspondence to Hui Chen.

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Chen, H., Jia, Cc. & Li, Sj. Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration. Int J Miner Metall Mater 20, 180–186 (2013). https://doi.org/10.1007/s12613-013-0711-x

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  • DOI: https://doi.org/10.1007/s12613-013-0711-x

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