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Solid state interfacial reactions in electrodeposited Ni/Sn couples

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Abstract

Ni/Sn couples, prepared by sequentially electroplating Ni layers and Sn layers on metallized Si wafers, were employed to study the microstructures and growth kinetics of Ni-Sn intermediate phases, when the Ni/Sn couples were aged at room temperature or annealed at temperatures from 150 to 225°C for various times. The results show that the NiSn phase and Ni3Sn4 phase are formed, respectively, in the aged couples and annealed couples. The Ni3Sn4 layer is continuously distributed between the Ni and Sn sides in the annealed Ni/Sn couples. The Ni3Sn4 growth follows parabolic growth kinetics with an apparent activation energy of 39.0 kJ/mol.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Hefei University of Technology, Hefei, 230009, China

    Wen-ming Tang

  2. Department of Chemical and Materials Engineering, University of Alberta, Edmonton, T6G 2G6, Canada

    An-qiang He, Qi Liu & Douglas-G. Ivey

Authors
  1. Wen-ming Tang
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  2. An-qiang He
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  3. Qi Liu
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  4. Douglas-G. Ivey
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Correspondence to Wen-ming Tang.

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Tang, Wm., He, Aq., Liu, Q. et al. Solid state interfacial reactions in electrodeposited Ni/Sn couples. Int J Miner Metall Mater 17, 459–463 (2010). https://doi.org/10.1007/s12613-010-0341-5

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  • DOI: https://doi.org/10.1007/s12613-010-0341-5

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