Skip to main content
SpringerLink
Log in

Prediction of steady-state creep strain rate and rupture life for SnAg-based Lead-free solder joints by SP test

  • Published:
International Journal of Precision Engineering and Manufacturing Aims and scope Submit manuscript

Abstract

This is to predict the equation of steady-state creep strain rate and rupture life of Lead-free solder joints and to observed the fractographies of the surfaces of the fractured solder joints using the SP creep test method. In this research, Sn-4Ag, Sn-4Ag-0.5Cu, Sn-4Ag-1.0Cu and Sn-37Pb solders are used. So as to compare the Lead-free solder alloys with lead(Pb) containing solder alloys. In addition, SP creep tests are held at temperature of 30, 50 and 80¢™C. And the shear stresses used in the research are in the range of 3 to 22 MPa. The microstructure characterization and fractographic analysis of the fractured solder joints are conducted to fully describe the creep behavior of the solder joints. Increasing the testing temperature from 30 to 80°C has some effect on the fracture behavior of ternary SnAgCu solder joints during creep testing. The increased temperature made the joints more vulnerable to the brittle interfacial fracture. In addition, Sn-37Pb solder joint, dimples in the fractured surfaces are much smaller than that of the Lead-free solder joints. Also using the creep data, we obtained a prediction equation of steady-state creep strain rate and rupture life for Lead-free solder joint in this research.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Manko, H. H., “Solders and Soldering,” 2nd Ed., McGraw-Hill, pp. 1–20, 1964.

    Google Scholar 

  2. Abtew, M. and Selvaduray, G., “Lead-free Solders in Microelectronics,” Materials Science and Engineering, Vol. 27, No. 5–6, pp. 95–141, 2000.

    Google Scholar 

  3. Hwang, J. S., “Implementing lead-free electronics,” McGraw-Hill, pp. 10–90, 2005.

    Google Scholar 

  4. Settle, M. D. and Patterson, C. C., “Lead in albacore: guide to lead pollution in Americans,” Science, Vol. 207, No. 4437, pp. 1167–1176, 1980.

    Article  Google Scholar 

  5. Wood, E. P. and Nimmo, K. L., “In search of new lead-free electronic solders,” Journal of Electronic Materials. Vol. 23, No. 8, pp. 709–713, 1994.

    Article  Google Scholar 

  6. Wang, C. H. and Chen, S. W., “Sn-0.7wt.%Cu/Ni interfacial reactions at 250°C,” Acta Materialia, Vol. 54, No. 1, pp. 247–253, 2006.

    Article  Google Scholar 

  7. Jeong, M. K., Jo, S. J., Lee, H. S., Lee, A. R., Kang, C. Y., Choi, J. W., Kim, J. H., and Jeong, H. D., “Chemical mechanical planarization of copper bumps on printed circuit board,” Int. J. Precis. Eng. Manuf., Vol. 12, No. 1, pp. 149–152, 2011.

    Article  Google Scholar 

  8. Yang, Z. J., “The evaluation of creep property for lead-free solder joints of SnAg and SnAgCu alloy system,” Ph.D. Thesis, Department of Mechanical System Engineering, Chonbuk National University, 2012.

    Google Scholar 

  9. Evans, H. E., “Mechanisms of Creep Fracture,” Elsevier Applied Science Publishers, 1984.

    Google Scholar 

  10. Evans, H. E., “Mechanisms of Creep Fracture,” Elsevier Applied Science Publishers, 1984.

    Google Scholar 

  11. Shin, C. F., deLorenzi, H. G., and Miller, A. K., “A stable Computational Scheme for Stiff Time-Dependance Constitutive Equations,” Proc. of SMIRT-4, 1977.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. School of Mechanical System Engineering, Chonbuk National University, 664-14, Duckjin-Dong, Duckjin-Gu, Jeonju, South Korea, 561-756

    Zheng-Jie Yang, Hyo-Sun Yu, Sung-Mo Yang & So-Young Park

  2. Jeonju Institute of Machinery and Carbon Composites, Jeonju, South Korea, 561-844

    Joon-Hyuk Song

Authors
  1. Zheng-Jie Yang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Hyo-Sun Yu
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Sung-Mo Yang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Joon-Hyuk Song
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. So-Young Park
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Sung-Mo Yang.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Yang, ZJ., Yu, HS., Yang, SM. et al. Prediction of steady-state creep strain rate and rupture life for SnAg-based Lead-free solder joints by SP test. Int. J. Precis. Eng. Manuf. 14, 1245–1250 (2013). https://doi.org/10.1007/s12541-013-0169-9

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s12541-013-0169-9

Keywords

Search

Navigation