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Finite element analysis of crystalline silicon solar cell in screen printing process by using Taguchi method

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Abstract

Screen printing is one of key processes in manufacturing crystalline silicon solar cells. The performance of screen printing process is characterized by various types of variables. The effects of squeegee pressure, angle and speed, and snap-off on the stress distributions of silicon wafers are focused. The breakage rate is evaluated by using the stress level during the screen printing process. A finite element analysis is performed according to Taguchi design of experiments in this study. The factors with the most effect on wafer quality and productivity are analyzed and optimal screen printing conditions were selected for a lower breakage rate.

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Authors and Affiliations

  1. Graduate School of Mechanical Engineering, Kyungpook National University, 1370 Sankyuk-dong, Buk-gu, Daegu, South Korea, 702-701

    Seung-Chang Lee & Chan-Ki Kim

  2. Photovoltaic Research Center, Korea Institute of Energy Research, 152 Gajeong-ro, Yuseougn-gu, Daejeon, South Korea, 305-343

    Hee-Eun Song

  3. Department of Mechanical Engineering, Kyungpook National University, 1370 Sankyuk-dong, Buk-gu, Daegu, South Korea, 702-701

    Young-Suk Kim

Authors
  1. Seung-Chang Lee
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  2. Chan-Ki Kim
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  3. Hee-Eun Song
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  4. Young-Suk Kim
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Correspondence to Young-Suk Kim.

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Lee, SC., Kim, CK., Song, HE. et al. Finite element analysis of crystalline silicon solar cell in screen printing process by using Taguchi method. Int. J. Precis. Eng. Manuf. 14, 635–642 (2013). https://doi.org/10.1007/s12541-013-0085-z

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  • DOI: https://doi.org/10.1007/s12541-013-0085-z

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