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Wetting and interfacial reaction characteristics of Sn-1.2Ag-0.5Cu-xIn quaternary solder alloys

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Abstract

Through the use of a wetting balance technique, the wetting characteristics of Sn-1.2Ag-0.5Cu-xIn quaternary solder alloys with respect to the In content and soldering temperature were investigated to validate the applicability of compositions with a low Ag content as solder material. It was found that a small addition (0.4–0.6 wt.%) of In significantly improved the wetting properties of the Sn-1.2Ag-0.5Cu-xIn composition at soldering temperatures ranging from 230 °C to 240 °C due to the excellent wetting property of In. In an observation of the interfacial reaction, it was found that the added In element did not participate in the interfacial reaction with a Cu or Ni pad, unlike in the Sn-Ag-Cu-In case, which has a high In content. The package or boardside IMC layers in Sn-1.2Ag-0.5Cu-0.4In joints were thinner than those of Sn-3.0Ag-0.5Cu, especially after aging.

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Authors and Affiliations

  1. Division of Materials Science & Engineering, Inha University, Incheon, 402-020, Korea

    A-Mi Yu & Mok-Soon Kim

  2. Advanced Welding and Joining R&D Department/Microjoining Center, Korea Institute of Industrial Technology (KITECH), Incheon, 406-840, Korea

    Chang-Woo Lee

  3. Department of Materials Science & Engineering, Seoul National University of Science and Technology, Seoul, 139-743, Korea

    Jong-Hyun Lee

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  1. A-Mi Yu
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  2. Mok-Soon Kim
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Correspondence to Jong-Hyun Lee.

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Yu, AM., Kim, MS., Lee, CW. et al. Wetting and interfacial reaction characteristics of Sn-1.2Ag-0.5Cu-xIn quaternary solder alloys. Met. Mater. Int. 17, 521–526 (2011). https://doi.org/10.1007/s12540-011-0634-x

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  • DOI: https://doi.org/10.1007/s12540-011-0634-x

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