Abstract
Multifunctional flexible conductive materials have attracted significant attention as next-generation portable wearable electronics. However, designing robust electronics fabrics with high-performance electromagnetic interference (EMI) shielding and reliable use in all-weather environments remains a challenge. Herein, a practical and optimized methodology was provided to achieve surface metallization of insulating fabrics for conductive devices. The Ag seeds were successfully embedded on the surface of viscose nonwovens as catalytic centers, and ammonia-free silver plating was carried out at room temperature. Subsequently, the Ag-wrapped fabric was impregnated with 1-octadecanethiol so that the surface of the obtained fabric showed super-hydrophobicity and water contact angle can reach 152.3°. The Ag/viscose exhibits ultrahigh conductivity (up to 538 S/cm) and the EMI shielding effectiveness (SE) reaches as high as 94.1 dB in the range of 1–18 GHz. The obtained Ag/viscose possesses outstanding waterproof, strong mechanical durability, excellent Joule heating effect and antibacterial, which can be potentially applied for multifunctional wearable electronics and smart clothing.
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Q. F. Shi, B. W. Dong, T. Y. Y. He, Z. D. Sun, J. X. Zhu, Z. X. Zhang, and C. Lee, InfoMat, 2, 1131 (2020).
J. Shi, S. Liu, L. Zhang, B. Yang, L. Shu, Y. Yang, M. Ren, Y. Wang, J. Chen, W. Chen, Y. Choi, and X. Tao, Adv. Mater., 32, 1901958 (2020).
Y. C. Tang, X. J. Li, H. M. Lv, W. L. Wang, C. Y. Zhi, and H. F. Li, InfoMat, 2, 1109 (2020).
T. Stockinger, D. Wirthl, G. Mao, M. Drack, R. Pruckner, S. Demchyshyn, M. Steiner, F. Egger, U. Muller, R. Schwodiauer, S. Bauer, N. Arnold, and M. Kaltenbrunner, Adv. Mater., 33, 2102736 (2021).
S. Li, Z. Xu, Y. Dong, D. Liu, and G. Sui, Compos. Part A Appl. Sci. Manuf., 131, 105798 (2020).
D. Pan, G. Yang, H. M. Abo-Dief, J. Dong, F. Su, C. Liu, Y. Li, B. Bin Xu, V. Murugadoss, N. Naik, S. M. El-Bahy, Z. M. El-Bahy, M. Huang, and Z. Guo, Nanomicro. Lett., 14, 118 (2022).
H. Cheng, L. Xing, Y. Zuo, Y. Pan, M. Huang, A. Alhadhrami, M. M. Ibrahim, Z. M. El-Bahy, C. Liu, C. Shen, and X. Liu, Adv. Comps. Hybrid. Ma., 5, 775 (2022).
Z. H. Zeng, F. Z. Jiang, Y. Yue, D. X. Han, L. C. Lin, S. Y. Zhao, Y. B. Zhao, Z. Y. Pan, C. J. Li, G. Nystrom, and J. Wang, Adv. Mater., 32, 1908496 (2020).
J. Y. Zhai, C. Cui, E. H. Ren, M. Zhou, R. H. Guo, H. Y. Xiao, A. Li, S. X. Jiang, and W. F. Qin, J. Mater. Sci. Mater. Electron., 31, 8910 (2020).
M. S. Ozen, E. Sancak, N. Soin, T. H. Shah, A. Zarei, and E. Siores, Fiber. Polym., 19, 321 (2018).
N. Wu, B. Zhao, X. Chen, C. Hou, M. Huang, A. Alhadhrami, G. A. M. Mersal, M. M. Ibrahim, and J. Tian, Adv. Comps. Hybrid. Ma., 5, 1548 (2022).
J. F. Gao, J. C. Luo, L. Wang, X. W. Huang, H. Wang, X. Song, M. J. Hu, L. C. Tang, and H. G. Xue, Chem. Eng. J., 364, 493 (2019).
K. M. F. Hasan, H. N. Wang, S. Mahmud, M. Abu Taher, and C. Genyang, Surf. Innov., 9, 25 (2021).
L. Zhang, T. Song, L. Shi, N. Wen, Z. Wu, C. Sun, D. Jiang, and Z. Guo, J. Nanostruct. Chem., 11, 323 (2021).
S. Gao, X. Zhao, Q. Fu, T. Zhang, J. Zhu, F. Hou, J. Ni, C. Zhu, T. Li, Y. Wang, V. Murugadoss, G. A. M. Mersal, M. M. Ibrahim, Z. M. El-Bahy, M. Huang, and Z. Guo, J. Mater. Sci. Technol., 126, 152 (2022).
C. Wang, C. Xiang, L. Tan, J. W. Lan, L. H. Peng, S. X. Jiang, and R. H. Guo, RSC Adv., 7, 40452 (2017).
Y. Xu, K. Qian, D. Deng, L. Luo, J. Ye, H. Wu, M. Miao, and X. Feng, Carbohydr. Polym., 250, 116915 (2020).
H. I. Kao, C. H. Chuang, L. C. Chang, C. L. Cho, and H. C. Chiu, Surf. Coat. Technol., 362, 328 (2019).
Z. Zhang, G. Wang, W. Gu, Y. Zhao, S. Tang, and G. Ji, J. Colloid Interface Sci., 605, 193 (2022).
Y. Shen, Z. Lin, J. Wei, Y. Xu, Y. Wan, T. Zhao, X. Zeng, Y. Hu, and R. Sun, Carbon, 186, 9 (2022).
Y. N. Gao, Y. Wang, T. N. Yue, B. Zhao, R. Che, and M. Wang, Chem. Eng. J., 430, 132949 (2022).
Y. N. Gao, Y. Wang, T. N. Yue, Y. X. Weng, and M. Wang, J. Colloid Interface Sci., 582, 112 (2021).
D. Xing, L. S. Lu, Y. X. Xie, Y. Tang, and K. S. Teh, Mater. Des., 185, 108227 (2020).
J. Yang, X. Liao, G. Wang, J. Chen, P. Song, W. Tang, F. Guo, F. Liu, and G. Li, Compos. Sci. Technol., 206, 108663 (2021).
Y. Mao, W. Wang, and D. Yu, J. Appl. Polym. Sci., 135, 46766 (2018).
R. Xu, W. Wang, J. Y. Sun, Y. Wang, C. R. Wang, X. D. Ding, Z. H. Ma, Y. Mao, and D. Yu, Colloid Surface A, 578, 123554 (2019).
C. M. Gui, H. D. Ma, R. X. Zhang, Y. L. Liu, H. L. Li, J. J. Huang, and P. Li, Langmuir, 37, 5673 (2021).
S. M. Kim, I. Y. Kim, and H. R. Kim, J. Text. Inst., 108, 1065 (2017).
C. M. Gui, D. Sun, W. Y. Liu, H. D. Ma, Z. M. Chen, P. Li, and J. J. Huang, J. Text. Inst., 108, 1065 (2022).
L. Wang, D. He, L. Qian, B. He, and J. Li, Int. J. Biol. Macromol., 183, 651 (2021).
L. Zhang, J. Luo, S. Zhang, J. Yan, X. Huang, L. Wang, and J. Gao, J. Mater. Sci. Technol., 98, 62 (2022).
F. Lin, W. Li, X. Du, N. Chen, Y. Wu, Y. Tang, and J. Jiang, Appl. Surf. Sci., 493, 1 (2019).
Q. Lin, S. Liu, X. Wang, Y. Huang, and W. Yu, Appl. Surf. Sci., 575, 151700 (2022).
Y. Mao, M. Zhu, W. Wang, and D. Yu, Soft Matter, 14, 1260 (2018).
M. Yang, X. Jia, D. He, Y. Ma, Y. Cheng, J. Wang, Y. Li, and C. Wang, ACS Appl. Electron. Mater., 3, 2067 (2021).
J. Luo, L. Huo, L. Wang, X. Huang, J. Li, Z. Guo, Q. Gao, M. Hu, H. Xue, and J. Gao, Chem. Eng. J., 391, 123537 (2020).
R. Begam, M. Joshi, and R. Purwar, Fiber. Polym., 23, 148 (2021).
J. Sun, L. Shi, T. Song, and C. Sun, Adv. Comps. Hybrid. Ma., 4, 1155 (2021).
B. Sun, S. Sun, P. He, H.-Y. Mi, B. Dong, C. Liu, and C. Shen, Chem. Eng. J., 416, 129083 (2021).
J. Liu, Y. Zhang, W. Cheng, S. Lei, L. Song, B. Wang, and Y. Hu, J. Colloid Interface Sci., 608, 2493 (2022).
Y. Bu, S. Zhang, Y. Cai, Y. Yang, S. Ma, J. Huang, H. Yang, D. Ye, Y. Zhou, W. Xu, and S. Gu, Cellulose, 26, 2109 (2018).
Q. Xu, P. Wang, Y. Zhang, and C. Li, Fiber. Polym., 23, 386 (2021).
L. Wang, D. He, J. Li, B. He, and L. Qian, Cellulose, 28, 5881 (2021).
T. T. Li, Y. Wang, H. K. Peng, X. Zhang, B. C. Shiu, J. H. Lin, and C. W. Lou, Compos. Part A Appl. Sci. Manuf., 128, 105685 (2020).
H. Wu, Z. Mu, G. Qi, Y. Zhang, X. Wang, P. Xie, N. Wu, H. Yuan, K. Sui, R. Fan, and C. Liu, J. Mater. Sci.: Mater. Electron., 32, 10388 (2021).
M. Liu, X. Lan, H. Zhang, P. Xie, N. Wu, H. Yuan, K. Sui, R. Fan, and C. Liu, J. Mater. Sci.: Mater. Electron., 32, 15995 (2021).
G. Wang, L. Hao, X. Zhang, S. Tan, M. Zhou, W. Gu, and G. Ji, J Colloid Interface Sci., 607, 89 (2022).
C. Liang, K. Ruan, Y. Zhang, and J. Gu, ACS Appl. Mater. Interfaces, 12, 18023 (2020).
B. Zhao, M. Hamidinejad, S. Wang, P. W. Bai, R. C. Che, R. Zhang, and C. B. Park, J. Mater. Chem. A, 9, 8896 (2021).
Q. Gao, Y. Pan, G. Zheng, C. Liu, C. Shen, and X. Liu, Adv. Comps. Hybrid. Ma., 4, 274 (2021).
F. Luo, D. Liu, T. Cao, H. Cheng, J. Kuang, Y. Deng, and W. Xie, Adv. Comps. Hybrid. Ma., 4, 591 (2021).
S. Jiang, K. Qian, K. Yu, H. Zhou, Y. Weng, and Z. Zhang, Chem. Phys. Lett., 779, 138873 (2021).
J. Ahn, J. Gu, B. Hwang, H. Kang, S. Hwang, S. Jeon, J. Jeong, and I. Park, Nanotechnology, 30, 455707 (2019).
Acknowledgement
This work was financially supported by Sichuan Science and Technology Program (2020YFSY0002) and Cooperation Project between Sichuan University and Yibin City (2019CDYB-29).
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The authors declare that no conflict of interest exists in the submission of this manuscript, and the manuscript has been approved by all authors for publication. I would like to declare on behalf of my co-authors that the work was original research that has not been published previously, and is not under consideration for publication elsewhere in whole or in part. All the authors listed have approved the manuscript that is enclosed.
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Jiang, S., Cui, C., Bai, W. et al. Superhydrophobic Ag/Viscose Non-woven Fabrics with Excellent Electric Heating and High-efficient Electromagnetic Interference Shielding. Fibers Polym 23, 3091–3102 (2022). https://doi.org/10.1007/s12221-022-0227-y
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DOI: https://doi.org/10.1007/s12221-022-0227-y